An object comprising a chromium-based coating on a substrate is disclosed. The chromium is electroplated from an aqueous electroplating bath comprising trivalent chromium cations, wherein the chromium-based coating comprises: a first chromium-containing layer, on the substrate, having a thickness of at least 100 nm, and a Vickers microhardness value of 700-1000 HV; a second chromium-containing layer, on the first chromium-containing layer, having a Vickers microhardness value that is at least 1.3 times higher than the Vickers microhardness value of the first chromium-containing layer, and a crystal size of 8-35 nm; and wherein the chromium-based coating exhibits a critical scratch load value (L.sub.c2) of at least 60 N in the adhesion test according to ASTM C1624-05 (2015; point 11.11.4.4), and wherein the chromium-based coating does not contain chromium carbide. Further is disclosed a method for its production.

The present invention provides a silver-plated member with a surface layer made of a silver-plating layer being formed on a base member, wherein a crystal plane of the surface layer has a {110} plane preferential orientation, and the orientation proportion of the {110} plane is 30% or more and 75% or less.

The preset invention has as its object the provision of a laminate free of hexavalent chromium and excellent in corrosion resistance and wear resistance, and a manufacturing process of the laminate. To solve the above-described problems, a laminate according to the present invention includes a substrate, and a laminated film portion with metal films laminated in two or more layers. The laminate has an interface layer between each two adjacent ones of the metal films. The laminated film portion contains a first metal element as a principal component, the first metal element being at least one element of Ni, Cr, Co, and W, and a second metal element that is a metal element of smaller cohesive energy than that of the first metal element. The second metal element contained in the interface layer is at a content ratio higher than that of the second metal element contained in each of the adjacent metal films.

An advanced reverse treated electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced reverse treated electrodeposited copper foil has an uneven micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups, which are in a non-uniform distribution to form a non-uniformly distributed horizontal or vertical stripe pattern.

A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm.sup.2 in a silver plating solution so as to satisfy (32.6x−300)≦y≦(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g.Math.A/L.Math.dm.sup.2) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

A method of forming a multilayered zinc alloy coating comprises steps of providing a bath of an aqueous electrolyte including zinc and a second electrodepositable component in an electrolytic cell having an anode and a cathode; applying a current or voltage between the anode and the cathode; modulating the applied current or voltage over time between at least two current or voltage values to thereby modulate the current density over multiple cycles between at least two current density values, wherein a first current density value is in a range of 0.3 to less than 2 A/dm.sup.2 and a second current density value is higher than the first current density value and is in a range of 0.6 to less than 5 A/dm.sup.2; and controlling the modulation of the applied current or voltage to obtain a multilayered structure having multiple layers of one or more of alternating proportions of the second component, alternating corrosion potential, alternating grain size, and alternating grain orientation, wherein one or more of the multiple layers has a thickness in the range of 1 to 10 μm.

Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

A copper foil with a release layer is provided that capable of forming a circuit, of such as an embedded trace substrate, by a subtractive method in a simple process. A copper foil with a release layer, containing, in this order, a release layer; a barrier layer having dissolution resistance to a copper etchant; and a copper foil.

An object comprising a chromium-based coating on a substrate is disclosed. The chromium is electroplated from an aqueous electroplating bath comprising trivalent chromium cations, wherein the chromium-based coating comprises at least one chromium-containing layer, the chromium-based coating does not contain macrocracks, wherein a macrocrack is a crack that extends from the outer surface of the chromium-based coating, through the chromium-based coating, to the substrate, the chromium-based coating has a Vickers microhardness value of 800-1100 HV, and the chromium-based coating exhibits a critical scratch load value (L.sub.C2) of at least 80 N in the adhesion test according to ASTM C1624-05 (2015; point 11.11.4.4). Further is disclosed a method for its production.

A silver-plated product having a higher hardness and more excellent wear resistance than those of conventional silver-plated products, and a method for producing the same. In a method for producing a silver-plated product by forming a surface layer of silver on a base material by electroplating at a current density in a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzimidazole (such as 2-mercaptobenzmimidazole or 2-mercaptobenzimidazole sulfonic acid sodium salt dihydrate), the ratios of the concentrations of silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and the imidazole to the current density during the silver-plating (or the ratios of the concentrations of silver potassium cyanide or silver cyanide and the imidazole to the current density during the silver plating, and the concentration of potassium cyanide or sodium cyanide) are set to be predetermined ranges, respectively.