Disclosed herein are lipseal assemblies for use in an electroplating clamshell for engaging and supplying electrical current to a semiconductor substrate during electroplating, which include an elastomeric lipseal for engaging the semiconductor substrate during electroplating, and wherein upon engagement the elastomeric lipseal forms multiple radially-separated sealing contact surfaces with the substrate which substantially exclude plating solution from a peripheral region of the substrate. Said lipseal assemblies may also include one or more electrical contact elements for supplying electrical current to the semiconductor substrate during electroplating.

A photovoltaic cell is proposed. The photovoltaic cell includes a substrate of semiconductor material, and a plurality of contact terminals each one arranged on a corresponding contact area of the substrate for collecting electric charges being generated in the substrate by the light. For at least one of the contact areas, the substrate includes at least one porous semiconductor region extending from the contact area into the substrate for anchoring the whole corresponding contact terminal on the substrate. In the solution according to an embodiment of the invention, each porous semiconductor region has a porosity decreasing moving away from the contact area inwards the substrate. An etching module and an electrolytic module for processing photovoltaic cells, a production line for producing photovoltaic cells, and a process for producing photovoltaic cells are also proposed.

A photo-electrochemical cell of an embodiment includes: a first electrode which has a transparent conductive film provided on a first surface of a photoelectric conversion layer; a first catalyst layer provided on the first electrode; a second electrode provided on a second surface of the photoelectric conversion layer; and a second catalyst layer provided on the second electrode. The first catalyst layer has a plurality of catalyst parts disposed on the first electrode and a transparent dielectric part disposed in a gap between the plurality of catalyst parts.

Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer.

A semiconductor substrate has a first area and a second area. A seed layer is provided on a principal surface of the semiconductor substrate including the first area and the second area. Insulating layers are discretely provided on the seed layer in the first area and not provided on the seed layer in the second area. Plating layers in the first area are connected to the seed layer between the discretely provided insulating layers and connected to the seed layer in the second area.

A photoelectrosynthetically active heterostructure (PAH) is manufactured by forming or providing cavities in an electrically insulating material; forming or providing an electrically conductive layer on a side of the electrically insulating material; depositing an electrocatalyst cathode layer in the cavities; depositing one or more layers of light-absorbing semiconductor material in the cavities; depositing an electrocatalyst anode layer in the cavities; removing the layer of electrically conductive metal; and forming a hydrogen permeable layer over the electrocatalyst cathode layer. The one or more layers of light-absorbing semiconductor material can form a p-n junction or Schottky junction. The PAH can be used in photoelectrosynthetic processes to produce desired products, such as reduction product (e.g., methane gas, methanol, or carbon monoxide) from carbon dioxide and liquid waste streams.

The embodiments disclosed herein pertain to novel methods and apparatus for removing material from a substrate. In certain embodiments, the method and apparatus are used to remove negative photoresist, though the disclosed techniques may be implemented to remove a variety of materials. In practicing the disclosed embodiments, a stripping solution may be introduced from an inlet to an internal manifold, sometimes referred to as a cross flow manifold. The solution flows laterally through a relatively narrow cavity between the substrate and the base plate. Fluid exits the narrow cavity at an outlet, which is positioned on the other side of the substrate, opposite the inlet and internal manifold. The substrate spins while in contact with the stripping solution to achieve a more uniform flow over the face of the substrate. In some embodiments, the base plate includes protuberances which operate to increase the flow rate (and thereby increase the local Re) near the face of the substrate.

A method of fabricating a catalyst on a substrate comprising: providing a substrate having a layer of metal thereon; and contacting the layer of metal with a corrosive solution to form the catalyst.

One embodiment of the present invention can provide a system for fabrication of a photovoltaic structure. The system can include a physical vapor deposition tool configured to sequentially deposit a transparent conductive oxide layer and a metallic layer on an emitter layer formed in a first surface of a Si substrate, without requiring the Si substrate to be removed from the physical vapor deposition tool after depositing the transparent conductive oxide layer. The system can further include an electroplating tool configured to plate a metallic grid on the metallic layer and a thermal annealing tool configured to anneal the transparent conductive oxide layer.

One embodiment of the present invention can provide a system for fabrication of a photovoltaic structure. The system can include a physical vapor deposition tool configured to sequentially deposit a transparent conductive oxide layer and a metallic layer on an emitter layer formed in a first surface of a Si substrate, without requiring the Si substrate to be removed from the physical vapor deposition tool after depositing the transparent conductive oxide layer. The system can further include an electroplating tool configured to plate a metallic grid on the metallic layer and a thermal annealing tool configured to anneal the transparent conductive oxide layer.