An electronic device according to various embodiments of the disclosure includes: a display; and a housing adjacent to the display, wherein at least a part of the housing includes: an aluminum alloy layer; a first film layer formed on the aluminum alloy layer; and a second film layer formed between the aluminum alloy layer and the first film layer and which includes multiple snowflake structures arranged adjacent to the first film layer. The first film layer is formed by a first anodizing process using a first voltage on the aluminum alloy layer, and the second film layer is formed by a second anodizing process using a second voltage on the aluminum alloy layer after the first anodizing process.

An electronic device according to various embodiments of the disclosure includes: a display; and a housing adjacent to the display, wherein at least a part of the housing includes: an aluminum alloy layer; a first film layer formed on the aluminum alloy layer; and a second film layer formed between the aluminum alloy layer and the first film layer and which includes multiple snowflake structures arranged adjacent to the first film layer. The first film layer is formed by a first anodizing process using a first voltage on the aluminum alloy layer, and the second film layer is formed by a second anodizing process using a second voltage on the aluminum alloy layer after the first anodizing process.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.

At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.

In an embodiment, a housing for an electronic device is colored through an anodizing process. The electronic device includes the housing, which includes a front plate; a rear plate facing away from the front plate; a side member surrounding a space between the front plate and the rear plate; and a support member which is disposed in the space. A portion of the housing is a conductive member formed of an electrically conductive material, which is divided into a first portion and a second portion which is electrically isolated from the first portion. The first portion is colored by a primary anodizing process with a first color, and the second portion is colored by a secondary anodizing process with a second color different from the first color.

In an embodiment, a housing for an electronic device is colored through an anodizing process. The electronic device includes the housing, which includes a front plate; a rear plate facing away from the front plate; a side member surrounding a space between the front plate and the rear plate; and a support member which is disposed in the space. A portion of the housing is a conductive member formed of an electrically conductive material, which is divided into a first portion and a second portion which is electrically isolated from the first portion. The first portion is colored by a primary anodizing process with a first color, and the second portion is colored by a secondary anodizing process with a second color different from the first color.

Provided is an anodized aluminum film formed on a surface of a substrate that comprises aluminum or an aluminum alloy, the anodized aluminum film having a structure constituted of a single anodized film layer or a structure composed of superposed anodized film layers of two or more different kinds, wherein the outermost anodized film has a degree of film formation, defined by equation (1), of 1.3 or more and the proportion of the thickness of this anodized film in the entire film thickness is 3% or higher. Thus, the anodized aluminum film is inhibited from cracking in bent portions. As a result, the substrate is inhibited from corroding in corrosive-gas atmospheres, and a decrease in withstand voltage characteristics due to film cracking is inhibited. With this anodized aluminum film, enhanced withstand voltage characteristics can hence be attained:
Degree of film formation=(thickness of anodized film)/(substrate thickness loss by anodization)  (1).

Provided is an anodized aluminum film formed on a surface of a substrate that comprises aluminum or an aluminum alloy, the anodized aluminum film having a structure constituted of a single anodized film layer or a structure composed of superposed anodized film layers of two or more different kinds, wherein the outermost anodized film has a degree of film formation, defined by equation (1), of 1.3 or more and the proportion of the thickness of this anodized film in the entire film thickness is 3% or higher. Thus, the anodized aluminum film is inhibited from cracking in bent portions. As a result, the substrate is inhibited from corroding in corrosive-gas atmospheres, and a decrease in withstand voltage characteristics due to film cracking is inhibited. With this anodized aluminum film, enhanced withstand voltage characteristics can hence be attained:
Degree of film formation=(thickness of anodized film)/(substrate thickness loss by anodization)  (1).