Disclosed herein are a microchip provided with a titanium oxide film between a glass substrate and a metal thin film; and a method for forming the metal thin film and the titanium oxide film on the glass substrate of the microchip. The microchip has a second microchip substrate that has the metal thin film inside a channel, and the titanium oxide film, which has a low extinction coefficient, is provided as a buffer layer between the substrate and the metal thin film such as a gold film.

A porous sintered body with an electrically conductive coating is provided. The sintered body has an open porosity in a range from 10 to 90%. The electrically conductive coating is bonded to the surface of the pores and is part of a heating device in a vaporizer. The electrically conductive coating lines the pores located in the interior of the sintered body so that when the sintered body is electrically connected and a current is applied, the current flows at least partially through the interior of the sintered body so that the interior of the sintered body is heated. A method for producing a porous sintered body with an electrically conductive coating is also provided.

The present disclosure relates to a method for manufacturing a decoration element, the method including depositing a light reflective layer having a structure of two or more islands separated from each other on one surface of a light absorbing layer; and dry etching the light absorbing layer using the island as a mask, wherein a resistance value of the decoration element after the dry etching of the light absorbing layer increases by two times or more compared to before the dry etching of the light absorbing layer.

The invention concerns reflective opaque panels that can be used as facing panels or decorative panels. They consist of a substrate coated with a stack of layers comprising, in the following order, at least (i) a transparent substrate (S), (ii) a first dielectric layer which is a high refractive index dielectric layer (H1), (iii) a second dielectric layer which is a low refractive index dielectric layer (L1), and (vi) a single chromium-based layer.

A process for producing a coated glass, the process comprising, a) providing a glass substrate, b) depositing a chemical vapour (CVD) deposited coating on at least one surface of the glass substrate to produce a CVD coated glass, and c) sputter depositing a further coating on the surface of the CVD coated glass, wherein the further coating comprises at least three reflective metal layers.

A method for obtaining a glazing includes depositing, by an inkjet printing technique, an enamel coating on part of a face of a glass sheet, then depositing, at least on part of the enamel coating, an electrically conductive layer forming designs, then performing a heat treatment for curing the enamel coating and the electrically conductive layer, the thickness of the designs formed by the electrically conductive layer being at least 3 ?m after the curing heat treatment.

A double-layer system includes a metal layer facing away from a viewer and a coating facing the viewer. In order to make the layer system production process as simple as possible and to provide a sputter deposition method that dispenses entirely with the use of reactive gases in the sputtering atmosphere or requires only a small amount thereof, the coating is in the form of an optically partially absorbing layer which has an absorption coefficient kappa of less than 0.7 at a wavelength of 550 nm and a thickness ranging from 30 to 55 nm.

The invention relates to a process for obtaining a material comprising a substrate coated on at least one part of at least one of its faces with at least one functional layer, said process comprising: a step of depositing the or each functional layer, then a step of depositing a sacrificial layer on said at least one functional layer, then a step of heat treatment by means of radiation chosen from laser radiation or radiation from at least one flash lamp, said radiation having at least one treatment wavelength between 200 and 2500 nm, said sacrificial layer being in contact with the air during this heat treatment step, then a step of removing the sacrificial layer using a solvent,

said sacrificial layer being a monolayer and being such that, before heat treatment, it absorbs at least one part of said radiation at said at least one treatment wavelength and that, after heat treatment, it is capable of being removed by dissolution and/or dispersion in said solvent.

Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.

Disclosed is an inorganic polarizing plate that exhibits improved heat resistance while suppressing an increase in lead time resulting from addition of process steps and an increase in costs. An inorganic polarizing plate 1 includes: a substrate (11) transparent to light having a wavelength within a used band; a plurality of linear reflective film layers (12) arranged on the substrate (11) at pitches smaller than the wavelength of the light within the used band; a plurality of dielectric film layers (13) arranged on the corresponding reflective film layers (12); and a plurality of absorptive film layers (14) arranged on the corresponding dielectric film layers (13). Each of the absorptive film layers (14) includes: a property-oriented layer (15); and a heat-resistance-oriented layer (16) made of the same material as the property-oriented layer (15) and having an extinction coefficient greater than an extinction coefficient of the property-oriented layer (15).