A laminate includes a transparent substrate having a first surface, and a laminated film provided on the first surface of the transparent substrate, wherein the laminated film includes, in a descending order of closeness to the first surface, a first dielectric layer including silicon nitride or zinc oxide or including silicon nitride and zinc oxide, a first layer including titanium oxide and provided on or above the first dielectric layer, a first barrier layer including nickel and chromium and provided on or above the first layer, and a silver-containing metal layer provided directly on the first barrier layer.

An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

Provided is a transparent substrate with a multilayer thin film coating, in which the multilayer thin film coating includes a lower dielectric layer, a lower protective layer, a metal functional layer having an infrared reflection function, an upper protective layer, and an upper dielectric layer, which are sequentially laminated on the transparent substrate, the thickness of the metal function layer is 12 nm or more, and the thickness of the lower protective layer is larger than that of the upper protective layer and the thickness of the lower protective layer is 2 nm or more.

Embodiments of the present disclosure generally relate to encapsulated optical devices and methods for fabricating the encapsulated optical devices. In one or more embodiments, a method for encapsulating an optical device includes depositing a metallic silver layer on a substrate, depositing a barrier layer on the metallic silver layer, where the barrier layer contains silicon nitride, a metallic element, a metal nitride, or any combination thereof, and depositing an encapsulation layer containing silicon oxide on the barrier layer.

An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

Disclosed herein is method for fabricating a graphene layer on a non-graphene carbon layer including steps of cleaning and seeding a substrate, depositing a crystalline diamond on the substrate, sputtering an aluminum layer on the crystalline diamond, where the aluminum layer is greater than 5 nanometers and less than 50 nanometers; and treating a surface of the aluminum layer with an ion beam resulting in a graphene layer on the crystalline diamond.

There are provided an oxide sintered material containing an In.sub.2O.sub.3 crystal phase, a Zn.sub.4In.sub.2O.sub.7 crystal phase and a ZnWO.sub.4 crystal phase, and a method of producing the oxide sintered material. The method includes forming the oxide sintered material by sintering a molded body containing In, W and Zn, and forming the oxide sintered material including placing the molded body at a first constant temperature selected from a temperature range of 500 C. or more and 1000 C. or less for 30 minutes or longer.

A substrate having a coating is disclosed. The coating is formed of a plurality of layers. A base layer of the plurality of layers includes an alloy, and at least two additional layers include silver. A coating for a substrate is also disclosed. A method of coating a substrate is further disclosed.

An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

Multilayer metallo-dielectric energy control coatings are disclosed in which one or more layers are formed from a hydrogenated metal nitride dielectric, which may be hydrogenated during or after dielectric deposition. Properties of the multilayer coating may be configured by appropriately tuning the hydrogen concentration (and/or the spatial profile thereof) in one or more hydrogenated metal nitride dielectric layers. One or more metal layers of the multilayer coating may be formed on a hydrogenated nitride dielectric layer, thereby facilitating adhesion of the metal with a low percolation threshold and enabling the formation of thin metal layers that exhibit substantial transparency in the visible spectrum. Optical properties of the coating may be tuned through modulation of metal-dielectric interface roughness and dispersion of metal nanoparticles in the dielectric layer. Electrical busbars and micro-nano electrical grids may be integrated with one or more metal layers to provide functionality such as de-icing and defogging.