An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

A low-E (low emissivity) coating includes a multilayer overcoat designed for reducing fingerprints. The multilayer overcoat includes a layer comprising an oxide of zirconium (e.g., ZrO.sub.2) sandwiched between and contacting first and second layers of or including silicon nitride (e.g., Si.sub.3N.sub.4, SiO.sub.xN.sub.y, SiZrO.sub.xN.sub.y, or the like). The uppermost layer comprising silicon nitride modifies the surface energy of the layer comprising the oxide of zirconium so as to make the uppermost surface of the coating more hydrophilic, thereby reducing or minimizing interaction between zirconium oxide and finger oil to reduce fingerprints on the uppermost surface of the coating.

A method for manufacturing a wiring board capable of improving adhesion between an underlayer and a seed layer. An electrically conductive underlayer is disposed on the surface of an insulating substrate and a seed layer containing metal is disposed on the surface of the underlayer to prepare a substrate with seed-layer. A diffusion layer in which elements forming the underlayer and seed layer are mutually diffused is formed between the underlayer and the seed layer, by irradiating the seed layer with a laser beam. A metal layer is formed on the surface of the seed layer by disposing a solid electrolyte membrane between an anode and the seed layer as a cathode and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from the insulating substrate.

An insulating glass (IG) window unit including first and second glass substrates that are spaced apart from each other. At least one of the glass substrate has a triple silver low-emissivity (low-E) coating on one major side thereof, and a dielectric coating for improving angular stability on the other major side thereof.

A material includes a transparent substrate coated with a stack including at least one silver-based functional metallic layer and at least two dielectric coatings, each dielectric coating including at least one dielectric layer, so that each functional metallic layer is positioned between two dielectric coatings, wherein the stack includes two blocking layers located in contact, below and above, with a silver-based functional metallic layer, the blocking layers being chosen from metallic layers based on a metal or a metal alloy of one or more elements chosen from titanium, nickel, chromium, tantalum, zirconium and niobium, and a titanium nitride layer located in contact with a blocking layer and separated from the silver-based functional layer by the blocking layer.

The present disclosure relates to a method for forming a glass, ceramic or composite material. The method may involve initially forming a plurality of tubes and then performing a coating operation to coat the plurality of tubes with materials containing metal or metalloid elements, including inorganic compounds, organometallic compounds, or coordination complexes to form coated tubes. The method may further include performing at least one of a thermal operation or a thermochemical operation on the coated tubes to form a solid glass, ceramic, or composite structure with dimensions representing at least one of a rod or fiber.

An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

The present disclosure relates to a method of manufacturing a curved laminated glass and the curved laminated glass. The method comprises preparing a curved soda lime glass, providing a functional layer on one surface of an alkali-free glass, disposing a lamination film or a bonding agent between the curved soda lime glass and the functional layer, and elastically deforming the alkali-free glass, and laminating the alkali-free glass with the curved soda lime glass.

Provided is a polarizing plate having a wire grid structure, comprising a transparent substrate, a first antireflection film laminated on the first surface of the transparent substrate, a plurality of protrusions protruding from the first antireflection film, a second antireflection layer laminated on a second surface opposite to the first surface, wherein the plurality of protrusions are periodically arranged at a pitch shorter than a wavelength of light in a use band, each of the protrusions extends in in a first direction and includes a reflective layer, a dielectric layer, and an absorption layer in order from the first direction, and both the first antireflection layer and the second antireflection layer have high refractive index layers and low refractive index layers that are alternately laminated.

Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.