Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.

A method of making a coated substrate having a transparent conductive oxide layer with a dopant selectively distributed in the layer includes selectively supplying an oxide precursor material and a dopant precursor material to each coating cell of a multi-cell chemical vapor deposition coater, wherein the amount of dopant material supplied is selected to vary the dopant content versus coating depth in the resultant coating.

A low-emissivity (low-E) coating on a substrate (e.g., glass substrate) includes at least first and second infrared (IR) reflecting layers (e.g., silver based layers) that are spaced apart by contact layers (e.g., NiCr based layers), a layer comprising silicon nitride, and an absorber layer of or including a material such as niobium zirconium which may be oxided and/or nitrided. The absorber layer is designed to allow the coated article to realize glass side reflective (equivalent to exterior reflective in an IG window unit when the coating is provided on surface #2 of an IG window unit) silver color. In certain example embodiments, the coated article (monolithic form and/or in IG window unit form) has a low visible transmission (e.g., from 15-45%, more preferably from 22-39%, and most preferably from 24-35%). In certain example embodiments, the coated article may be heat treated (e.g., thermally tempered and/or heat bent).

Provided is an antireflective-film attached transparent substrate having a luminous transmittance of 20% to 84% and a b* value of a transmission color being 5 or smaller under a D65 light source, in which the antireflective film has a luminous reflectance being 1% or lower and a sheet resistance being 10.sup.4 Ω/□ or higher, and in which the antireflective film has a multilayer structure built up of at least two layers, at least one layer is constituted mainly of silicon oxide, and at least another layer is constituted mainly of a mixed oxide of at least one oxide of Mo and W and at least one oxide of Si, Nb, Ti, Zr, Ta, Al, Sn, and In, and has an extinction coefficient at 550 nm being in a range of 0.005 to 3.

A multilayered-reflective-film-provided substrate includes: a substrate; a multilayered reflective film provided on the substrate; and a protective film provided on the multilayered reflective film, in which the protective film includes ruthenium (Ru) and at least one additive material selected from aluminum (Al), yttrium (Y), zirconium (Zr), rhodium (Rh), and hafnium (Hf), and a content of the additive material is 5% or more by atom and less than 50% by atom.

A transparent structure may have structural layers such as an inner layer and an outer layer, which may be formed from glass. The transparent structure may be curved. At least one of the inner layer and the outer layer may be coated with an infrared reflection coating. The infrared reflection coating may be formed from multiple optical resonators. Each of the resonators may include two half-mirrors separated by a dielectric layer. The half-mirrors may include infrared reflective material, such as silver. At least some of the resonators may additionally include a getter layer. The getter layer may be formed from amorphous material, nanoparticles in dielectric material, or other desired material, and may protect the infrared reflective material while the infrared reflection coating is being deposited. Additionally, the getter layer may reduce the color shift exhibited by high angle light as it passes through the transparent structure.

Certain example embodiments of this invention relate to coated articles having a metamaterial-inclusive layer, coatings having a metamaterial-inclusive layer, and/or methods of making the same. Metamaterial-inclusive coatings may be used, for example, in low-emissivity applications, providing for more true color rendering, low angular color dependence, and/or high light-to-solar gain. The metamaterial material may be a noble metal or other material, and the layer may be made to self-assemble by virtue of surface tensions associated with the noble metal or other material, and the material selected for use as a matrix. An Ag-based metamaterial layer may be provided below a plurality (e.g., 2, 3, or more) continuous and uninterrupted layers comprising Ag in certain example embodiments. In certain example embodiments, barrier layers comprising TiZrOx may be provided between adjacent layers comprising Ag, as a lower-most layer in a low-E coating, and/or as an upper-most layer in a low-E coating.

An optical component according to an embodiment of the present invention includes a translucent substrate, one or more intermediate layers stacked on at least one of an incident surface and an exit surface of the substrate, and a surface layer stacked on an outermost layer of the one or more intermediate layers, the surface layer containing diamond-like carbon as a main component. At least one intermediate layer among the one or more intermediate layers contains silicon as a main component, and the intermediate layer containing silicon as a main component has an oxygen content of 10 atomic % or less.

An insulating glass (IG) window unit including first and second glass substrates that are spaced apart from each other. At least one of the glass substrate has a triple silver low-emissivity (low-E) coating on one major side thereof, and a dielectric coating for improving angular stability on the other major side thereof.

Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.