Patent classifications
C03C17/3655
METHOD FOR PRODUCING A CURVED LAMINATED GLAZING
A method for producing a curved laminated glazing, for a windscreen or roof of a motor vehicle includes providing a first glass sheet, coated on at least one part of one of its faces with a stack of thin layers, depositing, on one part of the surface of the stack of thin layers in a zone to be cleared, a washable dissolving layer, a pre-firing after which the stack of thin layers located under the washable dissolving layer is dissolved by the washable dissolving layer, creating a cleared zone, the removal of the washable dissolving layer by washing, the deposit, at least on one part of the cleared zone, of an opaque mineral layer, the curving of the first glass sheet and of an additional glass sheet, together or separately, and the laminating of the first glass sheet with an additional glass sheet using a lamination interlayer.
INDUCTION HEATING TYPE COOKTOP WITH REDUCED THERMAL DEFORMATION OF THIN FILM
An induction heating type cooktop includes a cover plate that is coupled to a top of a case and that includes an upper plate configured to seat an object to be heated, a working coil disposed inside the case and configured to heat the object, an insulator disposed between a bottom surface of the upper plate and the working coil, and a thin film that is disposed on at least one of a top surface of the upper plate or the bottom surface of the upper plate and that includes a plurality of sub-films that are arranged about a central portion of the thin film. An outer boundary of one of the plurality of sub-films is positioned radially outward of an outer boundary of another of the plurality of sub-films relative to the central portion of the thin film.
Methods and apparatus of processing transparent substrates
Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.
METHODS AND APPARATUS OF PROCESSING TRANSPARENT SUBSTRATES
Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.
Solar cell with selectively doped conductive oxide layer and method of making the same
A method of making a coated substrate having a transparent conductive oxide layer with a dopant selectively distributed in the layer includes selectively supplying an oxide precursor material and a dopant precursor material to each coating cell of a multi-cell chemical vapor deposition coater, wherein the amount of dopant material supplied is selected to vary the dopant content versus coating depth in the resultant coating.
SYSTEMS AND METHODS FOR ADHERING COPPER INTERCONNECTS IN A DISPLAY DEVICE
Embodiments are related generally to conductive interconnects formed on substrates, and more particularly to a glass ceramic, or glass-ceramic substrate having copper interconnects disposed thereon.
Thin-film transistor and method of forming an electrode of a thin-film transistor
In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
Head-up display system
A head-up display system with an imaging unit for generating an image on a projection surface is described. The projection surface is provided for reflecting at least a part of the image. The projection surface includes a transparent screen having a transparent substrate and at least one electrically conductive coating with at least one functional layer on at least one surface of the transparent substrate.
Solar mirrors and methods of making solar mirrors having improved properties
A solar reflective mirror includes a parting film between solar reflecting sublayers to improve optics and stability of the solar mirror. The coating stack of the solar reflector mirror is encapsulated to increase the useable life of the solar mirror, and to eliminate the need for a permanent protection overcoat. Omission of the PPO film which is electrically non-conductive makes the coating stack electrically conductive eliminating the need for a two layer encapsulant when the encapsulant is e-coated. Another feature of the invention is applying the base coat of the encapsulant over the marginal edges of the PPO film leaving a center section without coverage and adding the top coating of the encapsulant over the base coat and the uncoated area.
Solar Glass And Method For Its Production
A solar glass is specified. In an embodiment a solar glass includes a glass substrate and a layer system arranged on the glass substrate, wherein the layer system includes a base layer comprising one or more first dielectric layers, a first silver layer arranged on the base layer, an absorber layer arranged on the first silver layer, the absorber layer comprising a metal or metal alloy, an aluminum oxynitride layer arranged on the absorber layer, an intermediate layer arranged on the aluminum oxynitride layer, the intermediate layer comprising one or more second dielectric layers, a second silver layer arranged on the intermediate layer and a cover layer arranged on the second silver layer, the cover layer comprising one or more third dielectric layers, and wherein the absorber layer has a spatially varying thickness, a spatially varying material composition and/or a spatially varying surface coverage density in at least one direction.