C03C17/3668

METHOD OF PRODUCING PLATING DEPOSIT

Provided is a method of producing a plating deposit which enables the production of a plating deposit with good adhesion to a glass substrate. Included is a method of producing a plating deposit, which includes: (1) forming a metal oxide layer on a surface of a glass substrate; (2) performing a first heat treatment after the step (1); (3) forming an electroless copper plating deposit on the metal oxide layer after the step (2); (4) performing a second heat treatment after the step (3); and (5) forming an electrolytic copper plating deposit on the electroless copper plating deposit after the step (4).

ELECTRO-OPTIC ELEMENT WITH IMI LAYER

An electro-optic assembly includes a first partially reflective, partially transmissive substrate defining a first surface and a second surface. A second partially reflective, partially transmissive substrate defines a third surface and a fourth surface. A space is defined between a first substrate and a second substrate. A seal is disposed about a perimeter of the first and second substrates. An electro-optic material is disposed between the second surface of the first substrate and the third surface of the second substrate. The electro-optic assembly is operable to change at least one of a reflectance state and a transmittance state in either a discrete or continuous manner. A transparent electrode coating is disposed between the second surface and the third surface. The transparent electrode coating includes an insulator layer, metal layer, and insulator layer (IMI) structure. The reflectance off of the transparent electrode coating is less than about 2%.

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Copper-alloy capping layers for metallization in touch-panel displays

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

ELECTRO-OPTIC ELEMENT WITH IMI LAYER

An electro-optic assembly includes a first partially reflective, partially transmissive substrate defining a first surface and a second surface. A second partially reflective, partially transmissive substrate defines a third surface and a fourth surface. A space is defined between a first substrate and a second substrate. A seal is disposed about a perimeter of the first and second substrates. An electro-optic material is disposed between the second surface of the first substrate and the third surface of the second substrate. The electro-optic assembly is operable to change at least one of a reflectance state and a transmittance state in either a discrete or continuous manner. A transparent electrode coating is disposed between the second surface and the third surface. The transparent electrode coating includes an insulator layer, metal layer, and insulator layer (IMI) structure. The reflectance off of the transparent electrode coating is less than about 2%.

Composite conductive materials and methods

Articles and methods regarding composite conductor materials comprising a first conductive material layer and a first carbonaceous material layer. In certain embodiments, the first carbonaceous material layer comprises an sp2 hybridized carbon compound. In certain embodiments, the electrical conductivity of the composite conductive material can be controlled and exhibits a conductivity at least 1.5% greater than the conductivity of the first conductive material layer alone.

COATED ARTICLE WITH IR REFLECTING LAYER(S) AND METHOD OF MAKING SAME

A coated article is provided with at least one infrared (IR) reflecting layer. The IR reflecting layer may be of silver or the like. In certain example embodiments, a titanium oxide layer is provided over the IR reflecting layer, and it has been found that this surprisingly results in an IR reflecting layer with a lower specific resistivity (SR) thereby permitting thermal properties of the coated article to be improved.

Flash annealing of silver coatings

Methods of processing coated articles, such as transparencies, are provided comprising flash annealing one or more layers of the coated article. The one or more layers may be reflective metallic layers, such as silver layers, or comprise a transparent conductive oxide, such as indium tin oxide, or a semiconductor.

Glass-ceramic
09637410 · 2017-05-02 · ·

A subject matter of the invention is a glass-ceramic sheet provided, on at least a portion of at least one of its faces, with a coating of thin layers comprising at least one thin functional layer composed of a metal based on niobium metal Nb, or of an oxide based on a niobium oxide NbO.sub.x in which x is at most 0.5, the or each thin functional layer being framed by at least two thin layers made of dielectric materials, the physical thickness of the thin functional layer or, if appropriate, the combined physical thickness of all the thin functional layers being within a range extending from 8 to 15 nm.

ELECTRICAL STORAGE SYSTEM INCLUDING A SHEET-LIKE DISCRETE ELEMENT, SHEET-LIKE DISCRETE ELEMENT, METHOD FOR PRODUCING SAME, AND USE THEREOF

An electrical storage element is provided that includes a discrete sheet-like element with particularly low transparency to high-energy electrical radiation, preferably in a range of wavelengths from 200 to 400 nm, and to the manufacturing thereof, and also relates to a discrete sheet-like element that exhibits particularly low transparency for high-energy electromagnetic radiation, preferably in a range of wavelengths from 200 to 400 nm, and to the manufacturing thereof.