The present invention relates to a nano bi-material, electromagnetic spectrum shifter based on said nano bi-material and method to produce said electromagnetic spectrum shifter using said nano bi-material. In particular, the present invention provides nano bi-material based electromagnetic spectrum shifter, e.g. color filters, with a wide range of transmission and color tunability and methods to produce said color filters. The present invention has applications in color filtration and production of color filters; reflector and production of reflectors; and electromagnetic spectrum shifter and production of electromagnetic spectrum shifters.

A copper-based coatings that contain an additional element selected from titanium, zinc, and tin for cultivation under glass covers. In addition, an antiphytopathogenic coating glass for use as glass covers mainly in greenhouses for crops cultivation, as well as a method for producing coatings on a glass surface.

The disclosure relates to a method for making a metal nanowire film. The method includes applying a metal layer on a substrate; placing a carbon nanotube composite structure on the metal layer, wherein the carbon nanotube composite structure defines a number of openings and parts of the metal layer are exposed by the number of openings; dry etching the metal layer using the carbon nanotube composite structure as a mask; and removing the carbon nanotube composite structure. The carbon nanotube composite structure includes a carbon nanotube structure and a protective layer coated on the carbon nanotube structure. The carbon nanotube structure includes a number of carbon nanotubes arranged substantially along the same direction.

This invention describes a process for selectively depositing metal on the surfaces of inorganic dielectric materials such as glass, ceramics, or semiconductor materials. The method enables the rapid and precise formation of electric circuits on both flat and three-dimensional surfaces. The production method includes steps: firstly, treatment of an item surface with an ultrashort pulse laser of the areas for metallisation, seconds step pre-treatment with the ROH solution followed by metal salt catalyst activation in a bath and finally electroless metal plating. During immersion in the metal salt catalyst activation bath, localized ROH molecules on the item's surface act as reducing agents, facilitating the reduction of metal ions from the activation bath. This results in the formation of catalytic seeds exclusively at the laser-modified areas. The metal layers exhibit high adhesion to the dielectric surface due to the formation of chemical bonds.

The disclosure belongs to a field of a micro-nano processing technology, and more specifically, relates to a method and application of isotropic shrinkage of a three-dimensional micro-nanostructure. In the disclosure, the high polymer film is prepared by mixing the high polymer material and the solvent, and then spin-coating it on a surface of a substrate. Then, the high polymer film is etched to expose a portion of the surface of the substrate, and a raw material of a three-dimensional structure is processed into a target three-dimensional structure with an etched area as an initial processing position. Then, the target three-dimensional structure is subjected to a stiffness strengthening treatment, immersed in a solvent, and pyrolyzed and calcined to obtain an isotropically shrunk three-dimensional micro-nanostructure.

The disclosure belongs to a field of a micro-nano processing technology, and more specifically, relates to a method and application of isotropic shrinkage of a three-dimensional micro-nanostructure. In the disclosure, the high polymer film is prepared by mixing the high polymer material and the solvent, and then spin-coating it on a surface of a substrate. Then, the high polymer film is etched to expose a portion of the surface of the substrate, and a raw material of a three-dimensional structure is processed into a target three-dimensional structure with an etched area as an initial processing position. Then, the target three-dimensional structure is subjected to a stiffness strengthening treatment, immersed in a solvent, and pyrolyzed and calcined to obtain an isotropically shrunk three-dimensional micro-nanostructure.

The present invention relates to a glass metallization process for through glass vias with a high aspect ratio. The process includes a single-sided coating step, a bonding step, a drilling step, a pre-lubricating step and a metallization step; or a drilling step, a single-sided coating step, a bonding step, a pre-lubricating step and a metallization step. Since the walls of the first and second glass substrates, the first and second seed layers and a bonding layer at the vias have undergone a pre-lubricating process, it is easy for the growth of the metal material during the electroplating process. Also, the metal material grows outward from a center of the stacked structure of the first and second glass substrates to completely fill the vias, thereby being able to be applied to vias with a higher aspect ratio without creating air gaps, making the electroplating process simpler and improving the electroplating yield.

A process for heating a glass or glass ceramic article with copper-metallized through holes includes heating the article from a first temperature to a second temperature. The first temperature is greater than or equal to 200 C. and less than or equal to 300 C., and the second temperature is greater than or equal to 350 C. and less than or equal to 450 C. An average heating rate during the heating of the article from the first temperature to the second temperature is greater than 0.0 C./min and less than 8.7 C./min. An article includes a glass or glass ceramic substrate having at least one through hole penetrating the substrate in a thickness direction; and copper present in the at least one through hole. The article does not comprise radial cracks.

A self-filling method for high-aspect-ratio microvias of a substrate is provided, in which the substrate is activated with a coupling agent; a pasty nano-filler is applied onto a surface of the substrate, where the microvias in the substrate are self-filled with the pasty nano-filler through capillary action, the pasty nano-filler has a wetting angle of 30, and each of the microvias has an aspect ratio of 5-500:1 and a diameter of 1-100 m; and the coated substrate is subjected to sintering treatment.

An article that includes a substrate with a first surface and a second surface and that has a bulk region and a surface modified region, the bulk region being integral with the surface modified region, and the surface modified region being at the first surface of the substrate. The bulk region including a higher concentration of at least one alkali than the surface modified region, and where a metal coating is disposed on the first surface of the substrate.