A pre-shaded ZrO.sub.2 block (e.g., a monochromatic block or polychromatic block) is sequentially infiltrated with a yttrium-containing solution at one porous surface and with water at a second porous surface to make a polychromatic/polytranslucent ZrO.sub.2 block.

The present invention relates to an alumina sintered body and a manufacturing method therefor; for example, the present invention relates to an alumina sintered body that is suitably utilized for a member or similar used in a plasma processing device, an etcher for semiconductor/liquid crystal display device manufacturing, a CVD device, or similar, or that is suitably utilized for a substrate or similar of a plasma-resistant member which is to be coated, as well as a manufacturing method for said alumina sintered body.

The present invention relates to an alumina sintered body and a manufacturing method therefor; for example, the present invention relates to an alumina sintered body that is suitably utilized for a member or similar used in a plasma processing device, an etcher for semiconductor/liquid crystal display device manufacturing, a CVD device, or similar, or that is suitably utilized for a substrate or similar of a plasma-resistant member which is to be coated, as well as a manufacturing method for said alumina sintered body.

The present disclosure relates to the field of dental material treatment, and particularly to a dental zirconia treatment technology. The specific technical solution is as follows: a zirconia treatment method, mainly involving color masking the zirconia, surface roughening the zirconia, coloring the zirconia, surface protection treatment and additional protective film treatment. Based on this treatment method, a brand-new color masking liquid, coloring liquid and adhesive solution are proposed. The present zirconia treatment technology not only meets the individualized requirements of patients for teeth, but also meets the requirements of dentists for convenient operation, so that it is of great value in application and popularization on the market.

In one example, a method for forming a coating system including a bond coat and an environmental barrier coating on a ceramic or CMC substrate, e.g., with an abradable coating on the environmental barrier coating. The method may include depositing a bond coat on a ceramic or ceramic matrix composite (CMC) substrate to form an as-deposited bond coat; heat treating the as-deposited bond coat following the deposition of the as-deposited bond coat on the substrate to form a heat treated bond coat; depositing an environment barrier coating (EBC) layer on the heat treated bond coat to form as deposited EBC layer; and heat treating the as-deposited EBC layer to form a heat treated EBC layer.

In one example, a method for forming a coating system including a bond coat and an environmental barrier coating on a ceramic or CMC substrate, e.g., with an abradable coating on the environmental barrier coating. The method may include depositing a bond coat on a ceramic or ceramic matrix composite (CMC) substrate to form an as-deposited bond coat; heat treating the as-deposited bond coat following the deposition of the as-deposited bond coat on the substrate to form a heat treated bond coat; depositing an environment barrier coating (EBC) layer on the heat treated bond coat to form as deposited EBC layer; and heat treating the as-deposited EBC layer to form a heat treated EBC layer.

The plasma-resistant coating film according to the present invention is formed on a substrate, including crystalline Y.sub.2O.sub.3 particles having an average particle diameter of 0.5 μm to 5.0 μm in a SiO.sub.2 film, in which a film density of the plasma-resistant coating film is 90% or more, the film density being obtained by performing image analysis of a cross section of the film with an electron scanning microscope and by using the following expression (1), a size of pores in the film is 5 μm or less in terms of diameter, and a peeling rate of the film from the substrate measured by performing a cross-cut test is 5% or less. Film density (%)=[(S.sub.1−S.sub.2)/S.sub.1]×100 (1). However, in the expression (1), S.sub.1 is an area of the film and S.sub.2 is an area of a pore portion in the film.

The plasma-resistant coating film according to the present invention is formed on a substrate, including crystalline Y.sub.2O.sub.3 particles having an average particle diameter of 0.5 μm to 5.0 μm in a SiO.sub.2 film, in which a film density of the plasma-resistant coating film is 90% or more, the film density being obtained by performing image analysis of a cross section of the film with an electron scanning microscope and by using the following expression (1), a size of pores in the film is 5 μm or less in terms of diameter, and a peeling rate of the film from the substrate measured by performing a cross-cut test is 5% or less. Film density (%)=[(S.sub.1−S.sub.2)/S.sub.1]×100 (1). However, in the expression (1), S.sub.1 is an area of the film and S.sub.2 is an area of a pore portion in the film.

A method of preparing a ceramic matrix composite (CMC) article is disclosed. The method includes depositing a first layer of a coating composition directly onto a surface of a silicon carbide fiber-reinforced silicon carbide matrix (SiC/SiC) composite substrate, with the coating composition comprising a rare earth silicate and a sintering aid. The method also includes heating the first layer to sinter the coating composition to form an environmental barrier coating (EBC) adjacent the SiC/SiC composite and a transition layer integrally bonded to and between the substrate and the EBC. CMC articles prepared according to the method, including coated turbomachine components, are also disclosed.

A method for processing a component is provided and includes masking a first portion of the component with a maskant. The maskant includes a slurry having a plurality of particles in a fluid carrier. The plurality of particles comprises at least one of silicon, carbon, one or more rare earth disilicates, monosilicates or oxides, and combinations thereof. The method includes depositing a silicon-based coating on a second portion of the component via a chemical vapor deposition process and removing the maskant and any overlying silicon-based coating from the first portion of the component.