Patent classifications
C04B41/5055
PLASMA PROCESSING DEVICE MEMBER, PLASMA PROCESSING DEVICE COMPRISING SAID PLASMA PROCESSING DEVICE MEMBER, AND METHOD FOR MANUFACTURING PLASMA PROCESSING DEVICE MEMBER
A plasma processing device member according to the disclosure includes a base material and a film formed of an oxide, or fluoride, or oxyfluoride, or nitride of a rare-earth element, the film being disposed on at least part of the base material, the film including a surface to be exposed to plasma, the surface having an area occupancy of open pores of 8% by area or more, and an average diameter of open pores of 8 m or less.
Methods of minimizing particles on wafer from plasma spray coatings
Methods comprise performing two or more thermal cycles on an article comprising a body and a ceramic coating. Each thermal cycle of the two or more thermal cycles comprise heating the ceramic article to a target temperature at a first ramping rate. Each thermal cycle further comprises maintaining the article at the target temperature for a first duration of time and then cooling the article to a second target temperature at a second ramping rate. The method further comprises submerging the article in a bath for a second duration of time to remove the particles from the ceramic coating.
Methods of minimizing particles on wafer from plasma spray coatings
Methods comprise performing two or more thermal cycles on an article comprising a body and a ceramic coating. Each thermal cycle of the two or more thermal cycles comprise heating the ceramic article to a target temperature at a first ramping rate. Each thermal cycle further comprises maintaining the article at the target temperature for a first duration of time and then cooling the article to a second target temperature at a second ramping rate. The method further comprises submerging the article in a bath for a second duration of time to remove the particles from the ceramic coating.
Structure
A structure includes a polycrystalline substance of yttrium fluoride, wherein an average crystallite size in the polycrystalline substance is less than 100 nanometers. When taking a peak intensity detected near diffraction angle 2=24.3 by X-ray diffraction as , and taking a peak intensity detected near diffraction angle 2=25.7 as , a peak intensity ratio / of the structure is not less than 0% and less than 100%.
Structure
A structure includes a polycrystalline substance of yttrium fluoride, wherein an average crystallite size in the polycrystalline substance is less than 100 nanometers. When taking a peak intensity detected near diffraction angle 2=24.3 by X-ray diffraction as , and taking a peak intensity detected near diffraction angle 2=25.7 as , a peak intensity ratio / of the structure is not less than 0% and less than 100%.
Surface coating treatment
A method for conditioning a ceramic layer with a thickness of less than 150 m over a substrate is provided. The ceramic layer is cleaned. A region of the ceramic layer is scanned with a pulsed excimer laser beam at a repetition rate of 3-300 Hz.
Surface coating treatment
A method for conditioning a ceramic layer with a thickness of less than 150 m over a substrate is provided. The ceramic layer is cleaned. A region of the ceramic layer is scanned with a pulsed excimer laser beam at a repetition rate of 3-300 Hz.
FILM-FORMING MATERIAL AND FILM
A coating material containing an oxyfluoride of yttrium and having a Fisher diameter of 1.0 to 10 m and a tap density TD to apparent density AD ratio, TD/AD, of 1.6 to 3.5. The coating material preferably has a pore volume of pores with a diameter of 100 m or smaller of 1.0 cm.sup.3/g or less as measured by mercury intrusion porosimetry. A coating containing an oxyfluoride of yttrium and having a Vickers hardness of 200 HV0.01 or higher. The coating preferably has a fracture toughness of 1.010.sup.2 Pa.Math.m.sup.1/2 or higher.
FILM-FORMING MATERIAL AND FILM
A coating material containing an oxyfluoride of yttrium and having a Fisher diameter of 1.0 to 10 m and a tap density TD to apparent density AD ratio, TD/AD, of 1.6 to 3.5. The coating material preferably has a pore volume of pores with a diameter of 100 m or smaller of 1.0 cm.sup.3/g or less as measured by mercury intrusion porosimetry. A coating containing an oxyfluoride of yttrium and having a Vickers hardness of 200 HV0.01 or higher. The coating preferably has a fracture toughness of 1.010.sup.2 Pa.Math.m.sup.1/2 or higher.
METHODS OF MINIMIZING PARTICLES ON WAFER FROM PLASMA SPRAY COATINGS
Methods comprise performing two or more thermal cycles on an article comprising a body and a ceramic coating. Each thermal cycle of the two or more thermal cycles comprise heating the ceramic article to a target temperature at a first ramping rate. Each thermal cycle further comprises maintaining the article at the target temperature for a first duration of time and then cooling the article to a second target temperature at a second ramping rate. The method further comprises submerging the article in a bath for a second duration of time to remove the particles from the ceramic coating.