A method for coating a substrate includes spraying a combination of powders. The combination of powders includes: Hf.sub.0.5Si.sub.0.5O.sub.2; Zr.sub.0.5Si.sub.0.5O.sub.2; and, optionally, at least one of HfO.sub.2 and ZrO.sub.2. A molar ratio of said Hf.sub.0.5Si.sub.0.5O.sub.2 and HfO.sub.2 combined to said Zr.sub.0.5Si.sub.0.5O.sub.2 and ZrO.sub.2 combined is from 2:1 to 4:1. A molar ratio of said Hf.sub.0.5Si.sub.0.5O.sub.2 to said HfO.sub.2 is at least 1:3.

A composite production method includes impregnating a plate-shaped porous inorganic structure and a fibrous inorganic material with a metal while the fibrous inorganic material is arranged to be adjacent to the porous inorganic structure. In the composite structure, first and second phases are adjacent to each other by using a porous inorganic structure having a porous silicon carbide ceramic sintered body and the fibrous inorganic material, the first phase being a phase in which the porous silicon carbide ceramic sintered body is impregnated with the metal, the second phase being a phase in which the fibrous inorganic material is impregnated with the metal, a percentage of the porous silicon carbide ceramic sintered body in the first phase is 50 to 80 volume percent, and a percentage of the fibrous inorganic material in the second phase is 3 to 20 volume percent. A composite is produced by the method.

The invention relates to a process for metallizing ferrite ceramics, which comprises the following steps: arrangement of a contact element composed of copper or a copper alloy on a surface of the ferrite ceramic, melting of the contact element at least in the region in which the contact element contacts the surface of the ferrite ceramic, and cooling of the contact element and the ferrite ceramic to below the melting point of copper or the copper alloy.

The invention relates to a process for metallizing ferrite ceramics, which comprises the following steps: arrangement of a contact element composed of copper or a copper alloy on a surface of the ferrite ceramic, melting of the contact element at least in the region in which the contact element contacts the surface of the ferrite ceramic, and cooling of the contact element and the ferrite ceramic to below the melting point of copper or the copper alloy.

An electronic component includes a ceramic element, glass-containing Au layers formed on both surfaces of the ceramic element, and an Au—Sn alloy layer formed on at least one of the glass-containing Au layers; the electronic component further includes a pure-Au layer between the glass-containing Au layer and the Au—Sn alloy layer; furthermore, the Au—Sn alloy layer has an Au—Sn eutectic structure.

A method of manufacturing a metal-coated member includes: providing a composite ceramic member including a ceramic part, and a connection part connected to the ceramic part; disposing a precious metal layer on a surface region that includes at least a portion of a surface of the ceramic part and a portion of a surface of the connection part, the precious metal layer including a precious metal; and removing at least a portion of the precious metal layer that is on the surface of the ceramic part and delineated by the boundary between the ceramic part and the connection part. The connection part has stronger adhesion to the precious metal than the ceramic part.

A method comprises discharging from a metal vaporization device a vapor of a metal or a metal precursor to a chemical vapor infiltration device where the chemical vapor infiltration device is in fluid communication with the metal vaporization device. The chemical vapor infiltration device contains a preform containing ceramic fibers. The preform is infiltrated with a metallic coating or a coating of a metallic precursor along with a ceramic precursor coating. The metallic coating and/or the metallic precursor coating and the ceramic precursor coating are applied sequentially or simultaneously.

A wiring substrate includes an insulating substrate, a conductor and an Ni film. The insulating substrate has a first surface and a second surface on a side opposite the first surface, and contains AlN. The conductor is disposed on the first surface and contains Cu. The Ni film is disposed so as to extend across an upper surface and a side surface of the conductor to the first surface. Ti oxide is scattered so as to be at a plurality of points on the first surface.

A method for producing and reinforcing a composite gear includes providing a base material comprising a polymer and forming a composite gear from the base material, the composite gear having a gear body and at least one gear tooth extending from the gear body, the at least one gear tooth having a tooth face, a tooth flank, a tooth fillet, a tooth root, and a tooth tip. The method includes depositing a first metallic material to a first area of the at least one gear tooth of the composite gear, the first area including the tooth root of the at least one gear tooth and depositing a second metallic material to a second area of the at least one gear tooth of the composite gear. The first metallic material is applied in a first thickness and the second metallic material is applied in a second thickness.

A method for producing and reinforcing a composite gear includes providing a base material comprising a polymer and forming a composite gear from the base material, the composite gear having a gear body and at least one gear tooth extending from the gear body, the at least one gear tooth having a tooth face, a tooth flank, a tooth fillet, a tooth root, and a tooth tip. The method includes depositing a first metallic material to a first area of the at least one gear tooth of the composite gear, the first area including the tooth root of the at least one gear tooth and depositing a second metallic material to a second area of the at least one gear tooth of the composite gear. The first metallic material is applied in a first thickness and the second metallic material is applied in a second thickness.