A handle substrate of a composite substrate for a semiconductor is provided. The handle substrate is composed of polycrystalline alumina. The handle substrate includes an outer peripheral edge part with an average grain size of 20 to 55 m and a central part with an average grain size of 10 to 50 m. The average grain size of the outer peripheral edge part is 1.1 times or more and 3.0 times or less of that of the central part of the handle substrate.

Segmented silicon carbide liners for use in a fluidized bed reactor for production of polysilicon-coated granulate material are disclosed, as well as methods of making and using the segmented silicon carbide liners. Non-contaminating bonding materials for joining silicon carbide segments also are disclosed. One or more of the silicon carbide segments may be constructed of reaction-bonded silicon carbide.

A corrosion-resistant component configured for use with a semiconductor processing reactor, the corrosion-resistant component comprising: a) a ceramic insulating substrate; and, b) a corrosion-resistant non-porous layer associated with the ceramic insulating substrate, the corrosion-resistant non-porous layer having a composition comprising at least 15% by weight of a rare earth compound based on total weight of the corrosion-resistant non-porous layer; and, the corrosion-resistant non-porous layer characterized by a microstructure substantially devoid of microcracks and fissures, and having an average grain size of at least about 100 nm and at most about 100 m. Assemblies including corrosion-resistant components and methods of making are also disclosed.

There is herein described a method for forming a ceramic wavelength converter assembly which achieves a direct bonding of an alumina-based ceramic wavelength converter to an alumina-based ceramic substrate such as polycrystalline or sapphire. The method comprises applying a silica-containing layer between the converter and the substrate and then applying heat to bond the converter to the substrate to form the ceramic wavelength converter assembly. Because direct bonding is achieved, the ceramic wavelength converter may operate at much higher incident light powers than conventional silicone glue-bonded converters.

A system for producing chemicals, such as, ethylene or gasoline, at high temperature (above 1100 degrees C.) having a feedstock source. The system includes a chemical conversion portion connected with the feedstock source to receive feedstock and convert the feedstock to ethylene or gasoline. The conversion portion includes a coil array and a furnace that heats the feedstock to temperatures in excess of 1100 C. or 1200 C. or even 1250 C. or even 1300 C. or even 1400 C. A method for producing chemicals, such as ethylene or gasoline, at high temperature.

Ceramic honeycomb structures and methods to make the same are disclosed. The structures may be comprised of at least two separate smaller ceramic honeycombs that have been coated with a polymer to create a polymeric barrier coating and adhered together with a cement comprised of inorganic fibers and a binding phase which is comprised of amorphous silicate, aluminite or alumino silicate glass and other inorganic particles. The polymer is selected such that it is penetratable into or covering the pores in the honeycomb structure to form a thin barrier layer thereon to mitigate migration of the inorganic fibers, binding phase and water into the pores. The polymer is adapted to be burned off or decomposed at or below cement and honeycomb skin firing temperatures, or at or below honeycomb operating temperatures during application to create a honeycomb structure that, when formed into an exhaust filter, does not have any undesired pressure drop increase due to cement migration.

A ceramic/metal composite structure includes an aluminum oxide substrate, an interface bonding layer and a copper sheet. The interface bonding layer is disposed on the aluminum oxide substrate. The copper sheet is disposed on the interface bonding layer. The interface bonding layer bonds the aluminum oxide substrate to the copper sheet. Some pores are formed near or in the interface bonding layer. A porosity of the interface bonding layer is substantially smaller than or equal to 25%.

A plugged honeycomb structure includes: a plurality of honeycomb segments, a bonding layer, and a plugging portions to plug open ends of cells of each of the honeycomb segments. The honeycomb segment is configured so that the cells having at least two kinds of different shapes are disposed in a cross section orthogonal to an extension direction of the cells, the honeycomb segment has a center region and an circumferential region located in the circumference of the center region, the center region has a cell arrangement pattern such that inflow cells surround one outflow cell, in the inflow end face of the honeycomb segment, the circumferential region has an open frontal area that is smaller than an open frontal area of the center region, the segment circumferential wall of the honeycomb segment and the bonding layer have a special thickness.

A method for manufacturing a composite panel is described. The method includes producing a first wall, a second wall, a third wall and a fourth wall from composite materials including an oxide matrix and long oxide fibres; from the first and second walls, producing a cellular core including a plurality of cells, each cell including a first end and an opposing second end, covering the first and second ends of the cells of the cellular core with the third wall and the fourth wall, respectively, so as to close the ends of said cells.

A method of assembling together by brazing two parts made of composite material, each part having an assembly face for brazing with the assembly face of the other part, the method including: making a plurality of cavities in the assembly face of at least one of the two composite material parts, at least some of the cavities opening out into one or more portions of the part that are situated outside the assembly face; interposing capillary elements between the assembly faces of the composite material parts; placing a brazing composition in contact with a portion of the capillary elements; and applying heat treatment to liquefy the brazing composition so as to cause the molten brazing composition to spread by capillarity between the assembly faces of the composite material parts.