C04B2237/064

Process for the moderately refractory assembling of articles made of SiC-based materials by non-reactive brazing in an oxidizing atmosphere, brazing compositions, and joint and assembly obtained by this process

Process for the moderately refractory assembly of at least two articles made of silicon carbide-based materials by non-reactive brazing in an oxidizing atmosphere, in which the articles are placed in contact with a non-reactive brazing composition and the assembly formed by the articles and the brazing composition is heated in an oxidizing atmosphere at a brazing temperature sufficient to melt the brazing composition so as to form a moderately refractory joint, wherein the non-reactive brazing composition is a composition A composed of silica (SiO.sub.2), alumina (Al.sub.2O.sub.3) and calcium oxide (CaO), or alternatively a composition B composed of alumina (Al.sub.2O.sub.3), calcium oxide (Cao) and magnesium oxide (MgO). Brazing suspension, paste comprising a powder of said brazing composition and an organic binder. Refractory joint and assembly.

Multilayer electronic component

A multilayer electronic component that includes a stacked body having therein a plurality of dielectric layers including a CZ-based perovskite phase and an element M2, a plurality of internal electrode layers including Ni, and an interface layer including the element M2 in at least a portion of an interface with the plurality of internal electrode layers. Element M2 is an element that has a binding energy between the CZ-based perovskite phase and Ni via the element M2 of less than or equal to ?12.3 eV by first-principles calculation using a pseudopotential method. When amounts of elements included in the dielectric layers are expressed as parts by mol, a ratio m2 of an amount of the element M2 to an amount of the Zr in the interface layer is 0.03?m2?0.25.

METHOD FOR MANUFACTURING AN ACOUSTIC ATTENUATION PANEL MADE OF AN OXIDE CERAMIC-MATRIX COMPOSITE MATERIAL

A method for producing an acoustic attenuation panel from a composite material with a ceramic oxide matrix is provided that includes draping a plurality of plies having fibrous reinforcements including fibers of ceramic material in a mold to define a first skin, depositing blocks made of fugitive material on the first skin such that a space between two blocks is defined, and draping a second plurality of plies on a surface formed by the blocks such that a second skin is defined. Rounded corners of the blocks define radii for connecting the first and second skins with walls of a honeycomb core of the acoustic panel. The method further includes using a liquid medium to infiltrate the skins and spaces with a precursor of a ceramic phase, removing the liquid medium by evaporation or polymerization, and sintering to consolidate the ceramic oxide material and removal the fugitive material.

REFRACTORY ARTICLE AND METHOD OF FORMING
20180216889 · 2018-08-02 ·

A refractory article can include a socket including a cavity that is configured to receive a post, a particulate material, and a binder. The binder is configured to bond the post to the socket. The refractory article can include a sleeve coupled to the socket and configured to bond the post to the socket. In an embodiment, the sleeve can bond to the binder. In another embodiment, a collar can be placed between the sleeve and the binder. The collar can be configured to bond the post to the socket. A method of forming a refractory article can include disposing a particulate material within a cavity of a socket and placing a binder material overlying the particulate material.

ELECTROSTATIC CHUCK
20180190527 · 2018-07-05 · ·

An electrostatic chuck includes a dielectric layer including an oriented alumina sintered body having a degree of c-plane orientation of 5% or more, the degree of c-plane orientation being determined by a Lotgering method using an X-ray diffraction profile obtained by the irradiation of an X-ray in the 2 range of 20 to 70; a ceramic layer integrated with a surface disposed opposite a wafer placement surface of the dielectric layer; and an electrostatic electrode between the dielectric layer and the ceramic layer.

ACOUSTIC ATTENUATION PANEL MADE OF AN OXIDE CERAMIC COMPOSITE MATERIAL WITH A CORE MADE OF AN ELECTROCHEMICALLY-CONVERTED METAL MATERIAL

The present disclosure relates to a method for producing an acoustic attenuation panel having two outer skins made from a composite material with a ceramic matrix containing a fibrous reinforcement. The skins are assembled on each side of a central honeycomb core having walls forming acoustic cavities produced by at least partial electrochemical conversion of aluminum into aluminum oxide. The method includes inserting a fugitive filler material into the acoustic cavities, leaving an annular space free in each cavity, on each side against the skin, extending around the cavity, and a step of sintering the composite material, in which the fugitive material is removed and the spaces around the cavities are filled with the composite material.

CERAMIC COMPONENT FORMED FROM CERAMIC PORTIONS BONDED TOGETHER WITH A HALOGEN PLASMA RESISTANT BONDING AGENT
20180134612 · 2018-05-17 ·

A bonded ceramic component which is resistant to reactive halogen-containing plasmas, said component comprising ceramic portions which are bonded together by a bonding material which includes an oxyfluoride glass-ceramic-comprising transition area between interfaces of the ceramic portions, where the transition area includes form at least 0.1 volume % amorphous phase up to about 50 volume % amorphous phase.

Metal/ceramic bonding substrate and method for producing same
12145352 · 2024-11-19 · ·

A metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing same, wherein the method includes arranging a ceramic substrate in a mold; putting the mold in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to 45 C. or lower in the furnace; injecting a molten metal of aluminum into the mold to contact the surface of the ceramic substrate; and cooling and solidifying the molten metal to form a metal plate for a circuit pattern of aluminum on one side of the ceramic substrate to bond one side of the metal plate for a circuit pattern directly to the ceramic substrate, while forming a metal base plate of aluminum on the other side of the ceramic substrate.

JOINING TECHNIQUES FOR COMPOSITE CERAMIC BODIES
20240379316 · 2024-11-14 ·

In joining composite ceramic bodies, at least one ceramic body is a compositionally graded with varying concentrations between two or more ceramic materials. The compositionally graded ceramic body terminates at an interfacial layer that is substantially composed of a single ceramic material. The compositionally graded ceramic body is joined to another ceramic body that may also be compositionally graded or made of a single ceramic material, and an interfacial layer of the other ceramic body is identical in composition with the interfacial layer of the compositionally graded ceramic body. In some embodiments, the ceramic bodies may be joined by diffusion bonding. In some embodiments, the ceramic bodies include a ceramic platen and ceramic stem of a wafer pedestal implemented in a plasma processing apparatus.

Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs

A method for fabricating a biocompatible hermetic housing including electrical feedthroughs, the method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thick film paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.