A joining material used for joining side surfaces of a plurality of silicon carbide-based honeycomb segments to each other to produce a silicon carbide-based honeycomb structure. The joining material contains from 0.1 to 50% by mass of processed powder generated in the production of the silicon carbide-based honeycomb segments and/or the silicon carbide-based honeycomb structure. The joining material has an average particle diameter D50 of from 0.5 to 60 μm.

A method to produce a protective surface layer having a predetermined topography on a ceramic matrix composite is described. The method includes applying a slurry layer to a surface of a fiber preform, and drying the slurry layer to form a particulate layer. A surface of the particulate layer is machined to improve surface smoothness and to form a machined surface. A ceramic tape is attached to the machined surface, and a tool comprising one or more features to be imprinted is placed on the ceramic tape, thereby forming a compression assembly. Heat and pressure are applied to the compression assembly to consolidate and bond the ceramic tape to the machined surface, while the one or more features of the tool are imprinted. Thus, a protective surface layer having a predetermined topography is formed.

A CMC ply assembly is disclosed including at least one matrix ply interspersed amongst a plurality of CMC plies. Each of the plurality of CMC plies includes a first matrix and a plurality of ceramic fibers. The at least one matrix ply includes a second matrix and is essentially free of ceramic fibers. The plurality of CMC plies and the at least one matrix ply are arranged in an undensified ply stack having an article conformation. A CMC article is disclosed including a plurality of densified CMC plies and at least one densified matrix ply interspersed amongst the plurality of densified CMC plies. A method for forming the CMC article is disclosed including forming, carburizing, infusing a melt infiltration agent into, and densifying the CMC ply assembly. The melt infiltration agent infuses more completely through the at least one matrix ply than through the plurality of CMC plies.

A honeycomb structure includes a plurality of prismatic columnar shaped honeycomb segments; a bonding layer bonding side faces of the honeycomb segments; and a circumferential wall disposed to surround a honeycomb segment bonded body having the honeycomb segments arranged in a grid pattern and bonded with the bonding layer, wherein the honeycomb segments has a porous partition wall disposed to surround a plurality of cells, the cells in other than outermost circumference have a hexagonal shape in a section orthogonal to the cell extending direction, the honeycomb segments include first and second honeycomb segment, the second honeycomb segment is different from the first in at least one of: a shape in the section; a size; and an arrangement direction of the cells and an extended line of one diagonal line imaginarily depicted in the cells in the first honeycomb segment and that in the second are configured to be orthogonal.

A joining method includes the steps of placing a brazing element between an interface area of a first ceramic piece and an interface area of a second ceramic piece to create a joining pre-assembly, placing the components of said joining pre-assembly into a process chamber, removing oxygen from said process chamber, and heating at least said brazing element of said joining pre-assembly, thereby hermetically joining said first ceramic piece to said second ceramic piece. The brazing element consists of Nickel and Carbon.

A member for a semiconductor manufacturing apparatus includes a ceramic plate having an upper surface serving as a wafer mounting surface and incorporating an electrode, a ceramic dense plug disposed adjacent to a lower surface side of the ceramic plate and ceramic-bonded to the ceramic plate by a ring-shaped joint portion, a metal cooling plate joined to the lower surface of the ceramic plate in a portion other than the ring-shaped joint portion, and a gas flow channel. The gas flow channel includes a gas discharge hole that passes completely through the ceramic plate in the thickness direction of the ceramic plate and an internal gas flow channel that passes from the upper surface to the lower surface of the dense plug while winding through the dense plug. The gas flow channel passes inside of an inner periphery of the joint portion.

A ceramic joined body includes: a pair of ceramic plates; and an electrode layer that is interposed between the pair of ceramic plates, in which the electrode layer is embedded in at least one of the pair of ceramic plates, and in an outer edge of the electrode layer, a joint surface between the at least one of the pair of ceramic plates and the electrode layer has an inclination with respect to a thickness direction of the pair of ceramic plates and the electrode layer.

A product according to one embodiment includes a first layer having a first composition, a first microstructure, and a first density; and a second layer above the first layer, the second layer having: a second composition, a second microstructure, and/or a second density. A gradient in composition, microstructure, and/or density exists between the first layer and the second layer, and either or both of the first layer and the second layer comprise non-spherical particles aligned along a longitudinal axis thereof.

A joined material and a method of manufacturing the joined material are provided which enable a metal layer and a carbon material layer to be easily joined to each other while making the thickness of the metal layer larger and which can inhibit failure. A joined material includes a CFC layer (3) and a tungsten layer (4) that are joined to each other. A sintered tungsten carbide layer (5), a mixed layer (6) of SiC and WC, and SiC and WC (7) that have been sintered while intruding into the CFC layer (3), are formed between the CFC layer (3) and the tungsten layer (4), and these layers (3, 4, 5, 6, and 7) are joined to each other by sintering.

A bonding tape for joining carbide ceramic structures, wherein the bonding tape comprises: a mixture comprising carbide ceramic particles, preceramic polymer liquid, fine carbon particles and metal nanoparticles that form a eutectic liquid at temperatures below 1400° C.