One aspect of the present disclosure provides a composite sheet including a porous sintered ceramic component having a thickness of less than 2 mm and a resin filled into pores of the sintered ceramic component, wherein the curing rate of the resin is 10 to 70%.

Provided is a composite sheet including a porous nitride sintered body having a thickness of less than 2 mm and a resin filled in pores of the nitride sintered body, wherein a filling rate of the resin is 85% by volume or more. Provided is a method for manufacturing a composite sheet including an impregnation step of impregnating pores of a porous nitride sintered body having a thickness of less than 2 mm with a resin composition having a viscosity of 10 to 500 mPa.Math.s to obtain a resin-impregnated body, and a curing step of heating the resin-impregnated body to semi-cure the resin composition filled in the pores.

One aspect of the present disclosure provides a composite sheet including a porous sintered ceramic component having a thickness of less than 2 mm and a resin filled into pores of the sintered ceramic component, wherein the resin is a semi-cured product of a resin composition including a compound having a cyanate group and the content of triazine rings in the resin is 0.6 to 4.0 mass %.

A DBC substrate for power semiconductor devices includes a ceramic workpiece of a non-oxide ceramic having first and second opposing main sides, the ceramic workpiece having a thickness of 10 μm or more measured between the first and second main sides, a copper-containing layer disposed over the first main side, the copper-containing layer having a thickness of 5 μm or more, and an intermediate layer comprising Al.sub.2O.sub.3 disposed between the ceramic workpiece and the copper-containing layer.

A cBN sintered compact has cubic boron nitride particles and a ceramic binder phase, and in the sintered compact, WSi.sub.2 having an average particle diameter of 10 nm to 200 nm is dispersed such that a content thereof is 1 vol % to 20 vol %. A cutting tool has the cBN sintered compact as a tool body.

Electrostatic chucks and methods of forming electrostatic chucks are disclosed. Exemplary electrostatic chucks include a ceramic body, a device embedded within the ceramic body, and an interface layer formed overlying the device. Exemplary methods include providing ceramic precursor material within a mold, providing a device, coating the device with an interface material to form a coated device, placing the coated device on or within the ceramic precursor material, and sintering the ceramic precursor material to form the electrostatic chuck and an interface layer between the device and ceramic material formed during the step of sintering.

According to a method set forth herein a plurality of preform plies having first and second preform plies can be associated together to define a preform. The preform can be subject to chemical vapor infiltration (CVI) processing to define a ceramic matrix composite (CMC) structure.

According to a method set forth herein a plurality of preform plies having first and second preform plies can be associated together to define a preform. The preform can be subject to chemical vapor infiltration (CVI) processing to define a ceramic matrix composite (CMC) structure.

A cubic boron nitride sintered material comprises 30% by volume or more and 80% by volume or less of cubic boron nitride grains and 20% by volume or more and 70% by volume or less of a binder phase, the cubic boron nitride grains having a dislocation density of 3×10.sup.17/m.sup.2 or more and 1×10.sup.20/m.sup.2 or less.

The cubic boron nitride sintered material comprises 30% by volume or more and 80% by volume or less of cubic boron nitride grains and 20% by volume or more and 70% by volume or less of a binder phase, the cubic boron nitride grains having a dislocation density of 1×10.sup.15/m.sup.2 or more and 1×10.sup.17/m.sup.2 or less.