Patent classifications
C04B2237/368
Method of pressure sintering an environmental barrier coating on a surface of a ceramic substrate
A method of pressure sintering an environmental barrier coating on a surface of a ceramic substrate to form an article includes the steps of etching the surface of the ceramic substrate to texture the surface, disposing an environmental barrier coating on the etched surface of the ceramic substrate wherein the environmental barrier coating includes a rare earth silicate, and pressure sintering the environmental barrier coating on the etched surface of the ceramic substrate in an inert or nitrogen atmosphere at a pressure of greater than atmospheric pressure such that at least a portion of the environmental barrier coating is disposed in the texture of the surface of the ceramic substrate thereby forming the article.
AIRFOIL WITH BUFFER LAYER TO ABSORB THERMAL MISMATCH
An airfoil includes a ceramic matrix composite airfoil core that defines an airfoil portion and a root portion. The ceramic matrix composite airfoil core is subject to core thermal growth. A platform includes a ceramic matrix composite that wraps around the root portion. The platform is subject to platform thermal growth. A buffer layer is located between the root portion and the platform. The buffer layer absorbs a mismatch between the core thermal growth and the platform thermal growth.
Direct bonded copper ceramic substrate
A direct bonded copper ceramic substrate is provided, which includes a nitride ceramic substrate, a first passivation layer, and a first copper layer. The first passivation layer includes aluminum oxide or silicon oxide doped with another metal. The other metal is titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, or a combination thereof. The aluminum or silicon and the other metal have a weight ratio of 60:40 to 99.5:0.5. The first passivation layer is disposed between the top surface of the nitride ceramic substrate and the first copper layer.
ROTOR ASSEMBLY WITH INTERNAL VANES
A rotor assembly is provided for a gas turbine engine. This rotor assembly includes a first rotor disk, a second rotor disk, a plurality of rotor blades and a plurality of vanes. The first rotor disk is configured to rotate about a rotational axis. The first rotor disk is configured from or otherwise includes disk material. The second rotor disk is configured to rotate about the rotational axis. The rotor blades are arranged circumferentially around the rotational axis. Each of the rotor blades is axially between and mounted to the first rotor disk and the second rotor disk. The vanes are arranged circumferentially around the rotational axis and axially between the first rotor disk and the second rotor disk. The vanes include a first vane, which first vane is configured from or otherwise includes vane material that is different than the disk material.
ROTOR ASSEMBLY WITH MULTIPLE ROTOR DISKS
A rotor assembly is provided for a gas turbine engine. This rotor assembly includes a first rotor disk, a second rotor disk, a plurality of rotor blades and a plurality of disk mounts. The first rotor disk is configured to rotate about a rotational axis. The second rotor disk is configured to rotate about the rotational axis. The rotor blades are arranged circumferentially around the rotational axis. Each of the rotor blades is mounted to the first rotor disk and to the second rotor disk. The rotor blades include a first rotor blade. Each of the disk mounts connects the first rotor disk and the second rotor disk together. The disk mounts include a first disk mount that further supports the first rotor blade.
ROTOR ASSEMBLY WITH INTERNAL VANES
A rotor assembly is provided for a gas turbine engine. This rotor assembly includes a first rotor disk, a second rotor disk, a plurality of rotor blades and a plurality of vanes. The first rotor disk is configured to rotate about a rotational axis. The second rotor disk is configured to rotate about the rotational axis. The rotor blades are arranged circumferentially around the rotational axis. Each of the rotor blades is axially between and mounted to the first rotor disk and the second rotor disk. The vanes are arranged circumferentially around the rotational axis. The vanes include a first vane that is integral with the first rotor disk and projects axially to the second rotor disk.
DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
A method includes applying a sintering precursor material layer to each of a first surface and a second surface of a ceramic tile, and assembling a precursor assembly of a direct bonded copper (DBC) substrate by coupling a first leadframe on the sinter precursor material layer on the first surface of the ceramic tile and a second leadframe on the second surface of the sinter precursor material layer on a second surface of the ceramic tile such that the ceramic tile is disposed between the first leadframe and the second leadframe. The method further includes sinter bonding the first leadframe and the second leadframe to the ceramic tile to form a sinter bonded DBC substrate.
RECESSION RESISTANT INTERMEDIATE LAYER FOR CMC VANE
A ceramic matrix composite (CMC) component is provided that includes: a CMC body in which an environmental protection layer is completely embedded within a CMC material of the CMC body, the environmental protection layer comprising a ceramic that has a higher impact and/or environmental resistance than the CMC material. Methods for manufacturing the CMC component are also provided.
CERAMIC STRUCTURAL BODY
A ceramic structural body includes a substrate that is composed of a ceramic(s), a hole that is opened on a surface of the substrate, and a seal material that is positioned at an opening portion of the hole.
STACKED STRUCTURE AND SEMICONDUCTOR MANUFACTURING APPARATUS MEMBER
A stacked structure includes a first structure formed of a composite sintered body that contains AlN and MgAl.sub.2O.sub.4 as main phases, and a second structure formed of a ceramic sintered body and stacked on and bonded to the first structure. A difference in linear thermal expansion coefficient between the first structure and the second structure is less than or equal to 0.3 ppm/K.