Patent classifications
C04B2237/406
CERAMIC COMPONENT AND THREE-DIMENSIONAL MANUFACTURING METHOD OF CERAMIC COMPONENT
A ceramic component is provided that is suitable to be placed in high temperature environment. The component includes a first member that is formed of a first material, and a ceramic layer that is bonded to a surface of the first member, which is a side exposed to the high temperature environment and that is formed of a ceramic material having a higher heat resistance than that of the first member. A bonding portion between the first member and the ceramic layer is formed of a composite material having the first material and the ceramic material, and a gradient composition in which an abundance ratio of the first material gradually decreases and an abundance ratio of the ceramic material gradually increases in a direction from the first member to the ceramic layer.
Method for producing a composite material
A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterized by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 m; heating the base material and the additional layer on the first surface to at least partially melt the solder layer; and connecting the base material to the at least one additional layer.
Heating module of electronic cigarette atomizer
A heating module of an electronic cigarette atomizer includes a ceramic rod, a connecting element and a heating wire. The heating wire is wound around the ceramic rod, the connecting element is connected to two ends of the heating wire respectively, and the ceramic rod is of a hollow micro-porous structure.
Lead-free piezo printhead using thinned bulk material
An apparatus for a lead-free piezoelectric ink-jet printhead is disclosed. Piezoelectric printheads, while more expensive are favored because they use a wider variety of inks. The piezoelectric printhead includes a diaphragm, a plurality of piezoelectric actuators comprising a lead-free piezoelectric material, at least one nozzle, at least one ink chamber, a top electrode, and a drive circuit. The deflection of the diaphragm on the body chamber contributes to a pressure pulse that is used to eject a drop of liquid from the nozzle. According to an exemplary embodiment, a lead-free piezoelectric printhead operated at smaller thicknesses and significantly higher electric fields is disclosed, along with methods of making such printheads.
METAL SOLID PRODUCTION METHOD
Provided is a method for producing a metal solid, the method being capable of easily producing a metal solid. A method for producing a metal solid, the method comprising covering at least a portion of the periphery of a metal powder with a high-melting-point material having a melting point higher than the melting point of the metal powder; and irradiating the metal powder, at least a portion of the periphery of which is covered with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melt-solidifying the metal powder.
METAL SOLID PRODUCTION METHOD
Provided is a method for producing a metal solid, the method being capable of easily producing a metal solid. A method for producing a metal solid, the method comprising covering at least a portion of the periphery of a metal powder with a high-melting-point material having a melting point higher than the melting point of the metal powder; and irradiating the metal powder, at least a portion of the periphery of which is covered with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melt-solidifying the metal powder.
JOINED SOLID PRODUCTION METHOD
A method for producing a joined solid, the method comprising placing a metal powder on a solid; covering at least a portion of the periphery of the metal powder with a high-melting-point material having a melting point higher than the melting point of the metal powder; and irradiating the metal powder, at least a portion of the periphery of which is covered with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melt-solidifying the metal powder to form a metal solid on the solid.
INTERMEDIATE MEMBER
An intermediate member is a member which is directly or indirectly sandwiched between a first object and a second object. The intermediate member includes a plate-like supporting member having a lower surface which is one main surface opposed to the first object and a plurality of ceramic blocks fixed on an upper surface which is the other main surface of the supporting member in a state of being separated from one another. Thus, in a state where the plurality of ceramic blocks are collectively held by the supporting member having relatively high shape retention, by disposing the intermediate member between the objects, it is possible to easily arrange the plurality of ceramic blocks between the objects with high positioning accuracy.
LEAD-FREE PIEZO PRINTHEAD USING THINNED BULK MATERIAL
An apparatus for a lead-free piezoelectric ink-jet printhead is disclosed. Piezoelectric printheads, while more expensive are favored because they use a wider variety of inks. The piezoelectric printhead includes a diaphragm, a plurality of piezoelectric actuators comprising a lead-free piezoelectric material, at least one nozzle, at least one ink chamber, a top electrode, and a drive circuit. The deflection of the diaphragm on the body chamber contributes to a pressure pulse that is used to eject a drop of liquid from the nozzle. According to an exemplary embodiment, a lead-free piezoelectric printhead operated at smaller thicknesses and significantly higher electric fields is disclosed, along with methods of making such printheads.
BRAZED JOINT AND SEMICONDUCTOR PROCESSING CHAMBER COMPONENT HAVING THE SAME
Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.