C04B2237/406

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

Ceramic structural body
12145891 · 2024-11-19 · ·

A ceramic structural body includes a substrate that is composed of a ceramic(s), a hole that is opened on a surface of the substrate, and a seal material that is positioned at an opening portion of the hole.

CERAMIC-CONTAINING TRANSACTION CARD WITH A FILL PANEL

A transaction card includes a card body that may comprise a card body comprising a ceramic material, the card body including a primary surface and a first mating surface. A card backer comprises a metallic material and includes a secondary surface and a second mating surface. A portion of the first mating surface and a portion of the second mating surface are coupled together.

Honeycomb structural body and method for manufacturing the same
09908307 · 2018-03-06 · ·

A honeycomb structural body 40 includes: a partition wall 48 formed of a porous ceramic which forms and defines a plurality of cells 47 each functioning as a flow path of a fluid and extending from one end surface to the other end surface; and an outer circumference wall 49 formed along the outermost circumference, where an oxide ceramic containing a Fe.sub.3O.sub.4 phase in which a solute component capable of forming a spinel-type oxide with Fe is solid-dissolved is formed.

Substrate structures and methods of manufacture

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

Sintered body comprising a plurality of materials and pressure measuring instrument comprising such a sintered body

A sintered body comprises a first region which comprises a first material having a first effective coefficient of thermal expansion .sub.1, a second region which comprises a second material having a second effective coefficient of thermal expansion .sub.2, a transition region between the first region and the second region in which the effective coefficient of thermal expansion changes from the first effective coefficient of thermal expansion to the second effective coefficient of thermal expansion. The transition region has a sequence of layers with a mixture of at least the first material and the second material, with the mixing ratio of the layers varying in order to achieve a stepwise, in particular monotonic, change in the coefficient of thermal expansion.

Pressure sensor having a ceramic platform

A pressure sensor, including a platform of ceramic, a measuring membrane arranged on the platform, a pressure measuring chamber enclosed in the platform under the measuring membrane, and at least one metal body connected with the platform via a pressure-tight, preferably elastomer free, mechanical connection. Thermomechanical stresses arising from the connection are reduced by features including that the pressure-tight, mechanical connection occurs via an adapting body arranged between the platform and the metal body. The adapting body has a thermal expansion coefficient, which rises in direction (z) extending from the platform to the metal body from a coefficient of expansion corresponding to a thermal coefficient of expansion of the ceramic of the platform to a coefficient of expansion corresponding to the thermal coefficient of expansion of the metal body, and the adapting body is connected by a first joint with the platform and by a second joint with the metal body.

Ceramic-containing transaction cards and methods of making the same

A transaction card includes a card body that may comprise a card body comprising a ceramic material, the card body including a primary surface and a first mating surface. A card backer comprises a metallic material and includes a secondary surface and a second mating surface. A portion of the first mating surface and a portion of the second mating surface are coupled together.

CERAMIC-CONTAINING TRANSACTION CARDS AND METHODS OF MAKING THE SAME

A transaction card includes a card body that may comprise a card body comprising a ceramic material, the card body including a primary surface and a first mating surface. A card backer comprises a metallic material and includes a secondary surface and a second mating surface. A portion of the first mating surface and a portion of the second mating surface are coupled together.

CERAMIC TILE FAN BLADE CONTAINMENT

Fan blade containment system includes circular tile layer of annular ceramic tiles attached to and extending radially inwardly from a shell, radially inner and outer annular surfaces of ceramic tiles bonded to a radially inner composite layer and the shell respectively with elastomeric inner and outer adhesive layers respectively. Elastomeric adhesive layers between circumferentially adjacent overlapped or scarfed edges along circumferential edges of the ceramic tiles overlap and mate along oppositely facing surfaces of adjacent ones of the ceramic tiles. Inner and outer adhesive layers and elastomeric adhesive layer may be a double-sided adhesive foam tape. Scarfed edges may be bevels or rabbets. Shell may be made of a metal or composite material. Fan blade containment system may be bonded to and extend inwardly from fan case circumscribing fan blades of a fan. Inner composite layer and composite outer shell may be co-cured with ceramic tiles therebetween.