A compound represented by the following formula (1) and a method for producing the same, and a composition, a composition for optical component formation, a film forming composition for lithography, a resist composition, a method for forming a resist pattern, a radiation-sensitive composition, a method for producing an amorphous film, an underlayer film forming material for lithography, a composition for underlayer film formation for lithography, a method for producing an underlayer film for lithography, a resist pattern formation method, a circuit pattern formation method, and a purification method. ##STR00001## wherein R.sup.1 is a 2n-valent group of 1 to 60 carbon atoms or a single bond; R.sup.2 to R.sup.5 are each independently a linear, branched, or cyclic alkyl group of 1 to 30 carbon atoms, an aryl group of 6 to 30 carbon atoms, an alkenyl group of 2 to 30 carbon atoms, a group represented by the following formula (A), a group represented by the following formula (B), a thiol group, or a hydroxy group, wherein at least one selected from the group consisting of R.sup.2 to R.sup.5 is a group selected from the group consisting of a group represented by the following formula (A) and a group represented by the following formula (B); m.sup.2 and m.sup.3 are each independently an integer of 0 to 8; m.sup.4 and m.sup.5 are each independently an integer of 0 to 9, provided that m.sup.2, m.sup.3, m.sup.4, and m.sup.5 are not 0 at the same time; n is an integer of 1 to 4; and p.sup.2 to p.sup.5 are each independently an integer of 0 to 2: ##STR00002## wherein each R.sup.6 is independently an alkylene group of 1 to 4 carbon atoms; and m′ is an integer of 1 or larger, and ##STR00003## wherein R.sup.6 is as defined above; R.sup.7 is a hydrogen atom or a methyl group; and m″ is 0 or an integer of 1 or larger.

A compound represented by the following formula (1) and a method for producing the same, and a composition, a composition for optical component formation, a film forming composition for lithography, a resist composition, a method for forming a resist pattern, a radiation-sensitive composition, a method for producing an amorphous film, an underlayer film forming material for lithography, a composition for underlayer film formation for lithography, a method for producing an underlayer film for lithography, a resist pattern formation method, a circuit pattern formation method, and a purification method. ##STR00001## wherein R.sup.1 is a 2n-valent group of 1 to 60 carbon atoms or a single bond; R.sup.2 to R.sup.5 are each independently a linear, branched, or cyclic alkyl group of 1 to 30 carbon atoms, an aryl group of 6 to 30 carbon atoms, an alkenyl group of 2 to 30 carbon atoms, a group represented by the following formula (A), a group represented by the following formula (B), a thiol group, or a hydroxy group, wherein at least one selected from the group consisting of R.sup.2 to R.sup.5 is a group selected from the group consisting of a group represented by the following formula (A) and a group represented by the following formula (B); m.sup.2 and m.sup.3 are each independently an integer of 0 to 8; m.sup.4 and m.sup.5 are each independently an integer of 0 to 9, provided that m.sup.2, m.sup.3, m.sup.4, and m.sup.5 are not 0 at the same time; n is an integer of 1 to 4; and p.sup.2 to p.sup.5 are each independently an integer of 0 to 2: ##STR00002## wherein each R.sup.6 is independently an alkylene group of 1 to 4 carbon atoms; and m′ is an integer of 1 or larger, and ##STR00003## wherein R.sup.6 is as defined above; R.sup.7 is a hydrogen atom or a methyl group; and m″ is 0 or an integer of 1 or larger.

Provided is an epoxy reactive diluent, wherein the content of a compound represented by Formula 1 below is 85% by weight or more based on a total weight of an epoxy reactive diluent composition:

##STR00001##

wherein n is 0, 2, 4 or 6.

Provided is an epoxy reactive diluent, wherein the content of a compound represented by Formula 1 below is 85% by weight or more based on a total weight of an epoxy reactive diluent composition:

##STR00001##

wherein n is 0, 2, 4 or 6.

This fluorine-containing ether compound is represented by Formula (1).
R.sup.1—R.sup.2—CH.sub.2—R.sup.3—CH.sub.2—R.sup.4—R.sup.5  (1) (in Formula (1), R.sup.1 is an aryl group or an aralkyl group, R.sup.2 is a divalent linking group having 0 or 1 polar group, R.sup.3 is a perfluoropolyether chain, R.sup.4 is a divalent linking group having 2 or 3 polar groups, and R.sup.5 is an aryl group or an aralkyl group.)

The present invention relates to a tetramethylbiphenol epoxy resin represented by the following formula (1), which is an epoxy resin having excellent solvent solubility, a small hydrolyzable chlorine amount and further an appropriate melt viscosity and being effectively applicable, to a semiconductor sealing material and electrical or electronic components such as laminate sheet: ##STR00001##
wherein n represents an integer of 0 to 10.

The present invention relates to a tetramethylbiphenol epoxy resin represented by the following formula (1), which is an epoxy resin having excellent solvent solubility, a small hydrolyzable chlorine amount and further an appropriate melt viscosity and being effectively applicable, to a semiconductor sealing material and electrical or electronic components such as laminate sheet: ##STR00001##
wherein n represents an integer of 0 to 10.

The present invention relates to the use of hydrophilic compounds of the formula I as photopolymerisation initiators of polymerisable substance mixtures which comprise unsaturated compounds, or for the photochemical crosslinking of linear polymers, ##STR00001##
in which the parameters have the meaning indicated in Claim 1, to sealants for liquid-crystal displays which comprise the hydrophilic photoinitiators, to novel hydrophilic photoinitiators of the formula I, and to the liquid-crystal displays produced using these sealants.

Described herein polymer precursor compounds (aka polymer building blocks) of derived from biobased compounds, and specifically biobased mevalonolactone and its related derivatives. Through oxidation these biobased precursors can be reacted to yield building blocks for (unsaturated-) polyesters, polyester polyols and polyamides, as well as precursors for glycidyl esters and omega-alkenyl esters. Through reduction, these biobased precursors can be reacted to yield building blocks for (unsaturated-) polyesters, polyester polyols, polycarbonates, as well as precursors for glycidyl ethers and omega-alkenyl ethers. Through nucleophilic ring opening and/or amidation, these biobased precursors can be reacted to yield building blocks for polyester polyols, chain-extender for polyurethanes, or polyester-amides.

Described herein polymer precursor compounds (aka polymer building blocks) of derived from biobased compounds, and specifically biobased mevalonolactone and its related derivatives. Through oxidation these biobased precursors can be reacted to yield building blocks for (unsaturated-) polyesters, polyester polyols and polyamides, as well as precursors for glycidyl esters and omega-alkenyl esters. Through reduction, these biobased precursors can be reacted to yield building blocks for (unsaturated-) polyesters, polyester polyols, polycarbonates, as well as precursors for glycidyl ethers and omega-alkenyl ethers. Through nucleophilic ring opening and/or amidation, these biobased precursors can be reacted to yield building blocks for polyester polyols, chain-extender for polyurethanes, or polyester-amides.