A fluorine-containing ether compound of the present invention is represented by Formula (1).
R.sup.1CH.sub.2R.sup.2CH.sub.2R.sup.3(1) (In Formula (1), R.sup.1 is an organic end group having 3 or more carbon atoms which includes two or more polar groups with each polar group being bonded to different carbon atoms and the carbon atoms to which the polar groups are bonded being bonded to each other via a linking group including the carbon atoms which are not bonded to the polar groups, R.sup.2 includes a perfluoropolyether chain represented by Formula (3), and R.sup.3 is a hydroxyl group or R.sup.1)
(CF.sub.2).sub.y1O((CF.sub.2).sub.yO).sub.z(CF.sub.2).sub.y1(3) (In Formula (3), y represents an integer of 2 to 4, and z represents an integer of 1 to 30).

A fluorine-containing ether compound of the present invention is represented by Formula (1).
R.sup.1CH.sub.2R.sup.2CH.sub.2R.sup.3(1) (In Formula (1), R.sup.1 is an organic end group having 3 or more carbon atoms which includes two or more polar groups with each polar group being bonded to different carbon atoms and the carbon atoms to which the polar groups are bonded being bonded to each other via a linking group including the carbon atoms which are not bonded to the polar groups, R.sup.2 includes a perfluoropolyether chain represented by Formula (3), and R.sup.3 is a hydroxyl group or R.sup.1)
(CF.sub.2).sub.y1O((CF.sub.2).sub.yO).sub.z(CF.sub.2).sub.y1(3) (In Formula (3), y represents an integer of 2 to 4, and z represents an integer of 1 to 30).

The present invention relates to the use of hydrophilic compounds of the formula I as photopolymerisation initiators of polymerisable substance mixtures which comprise unsaturated compounds, or for the photochemical crosslinking of linear polymers,

##STR00001##

in which the parameters have the meaning indicated in Claim 1, to sealants for liquid-crystal displays which comprise the hydrophilic photoinitiators, to novel hydrophilic photoinitiators of the formula I, and to the liquid-crystal displays produced using these sealants.

The present invention relates to an alkoxysilylated epoxy compound, a composite exhibiting good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg-less. The cured product exhibits good flame retardant properties by the introduction of the alkoxysilyl group.

The present invention relates to an alkoxysilylated epoxy compound, a composite exhibiting good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg-less. The cured product exhibits good flame retardant properties by the introduction of the alkoxysilyl group.

The present invention discloses polyglycol epoxide crosslinked sodium hyaluronate gel for injection and a preparation method thereof. A polyglycol epoxide is a compound with single molecular weight preferably; a plurality of ether bonds are present in the molecule of the polyglycol epoxide, the water solubility is good, and thus, the polyglycol epoxide is more easily subjected to a crosslinking reaction with polysaccharides; and meanwhile, polyglycol is relatively easy in adjustment of the number of repeating units and relatively easy in control of length, and thus, the sodium hyaluronate gel prepared by taking the polyglycol epoxide as a crosslinker is relatively easy in regulation and control of properties. The crosslinked sodium hyaluronate gel is low in toxicity, little in residual, small in squeezing and pushing force, good in shaping performance, good in enzyme resistance and long in in-vivo retention time. The present invention further discloses a mild crosslinker deactivation technology. Unreacted epoxide groups in the gel are subjected to a hydrolysis reaction in a carbonate buffer system with a pH of 8-9, so that the difficulty of impurity removal of the crosslinked sodium hyaluronate gel can be effectively lowered, and the problem of toxicity in the prior art due to the fact that BDDE is used in a crosslinking method is avoided.

The present invention relates to an inclusion compound of fumagillol derivative or its salt with hydroxypropyl--cyclodextrin or sulfobutylether-7--cyclodextrin, and pharmaceutical compositions comprising the same. The inclusion compound according to the present invention has superior water solubility and stability while exhibiting low toxicity, rendering it valuable as an anticancer agent or inhibitor of tumor metastasis.

The present invention relates to an inclusion compound of fumagillol derivative or its salt with hydroxypropyl--cyclodextrin or sulfobutylether-7--cyclodextrin, and pharmaceutical compositions comprising the same. The inclusion compound according to the present invention has superior water solubility and stability while exhibiting low toxicity, rendering it valuable as an anticancer agent or inhibitor of tumor metastasis.

Provided is a radiation-sensitive resin composition capable of forming a resin film for which development residue formation is sufficiently inhibited and that has excellent extensibility. The radiation-sensitive resin composition contains: a cycloolefin polymer (A-1) including a protonic polar group; a cycloolefin polymer (A-2) including a protonic polar group; a difunctional epoxy compound (B); and a radiation-sensitive compound (C). The cycloolefin polymer (A-1) has a weight-average molecular weight of not less than 1,000 and less than 10,000, and the cycloolefin polymer (A-2) has a weight-average molecular weight of not less than 10,000 and not more than 100,000. Content of the cycloolefin polymer (A-2) is not less than 5 mass % and not more than 55 mass % of total content of the cycloolefin polymer (A-1) and the cycloolefin polymer (A-2).

Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (CSPs), ball grid arrays (BGAs), land grid arrays (LGAs) and the like (collectively, subcomponents), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.