The invention provides a composition and method for improving the selectivity of nitride etching versus oxide etching and can be used with conventional phosphoric acid wet etch compositions. The invention describes additives that serve to inhibit silicon, oxides, and related compounds regrowth (i.e., redeposition) on the silicon oxide surface. In certain embodiments, the invention provides certain amino-substituted aryl compounds which are bound to a tri-alkoxy silane.

Diterminally silanol-modified perfluoropolyether compounds of the general formula (1) ##STR00001##
(wherein each R.sup.1 is independently an unsubstituted divalent hydrocarbon group of 1 to 10 carbon atoms, each R.sup.2 is independently a substituted or unsubstituted monovalent hydrocarbon group of 1 to 10 carbon atoms, Rf is a perfluoropolyether group, and ‘n’ is independently at each occurrence an integer from 0 to 8) are provided. Such compounds, when reacted as an intermediate with a reactive silicon compound, afford compounds of excellent durability.

One-pot synthetic methods are disclosed for synthesizing curable, antimicrobial silsesquioxane-silica hybrids by hydrolytically co-condensing a tetraalkoxysilane with two different trialkoxysilanes. Particles are also disclosed that are substantially spherical and have an ordered lamellar internal structure. In addition, polymers prepared from the curable, antimicrobial silsesquioxane-silica hybrids and co-monomers are disclosed.

The present invention is a phenol compound represented by the following general formula (1A). This phenol compound makes it possible to provide a phenol compound as an additive for a conductive paste composition having a small decrease in electric conductivity in repetitive elongations and shrinkages and excellent printing processability, a conductive paste composition containing the additive, and a conductive wire made by using the conductive paste composition.

##STR00001##

A process for preparing siloxanes, wherein at least one alkoxy-organosilicon compound selected from compounds of the general formula (I) and/or from compounds of the general formula (II) is/are reacted in the presence of a cationic silicon and/or germanium compound at a temperature of −40 to 250° C.

Provided is a method for preparing a (meth)acryloyl group-containing organopolysiloxane having a step of transesterification between the components (a1) and (a2) in the presence of the components (a3) and (a4) to obtain the (meth)acryloyl group-containing organopolysiloxane, wherein component (a1) is an organopolysiloxane represented by the average composition formula (1) which has a hydroxy group-containing group, component (a2) is a (meth)acrylic acid ester represented by the general formula (2), component (a3) is a zirconium metal complex in an amount such that a molar ratio of component (a3) to the hydroxy group of component (a1) is 0.001 to 0.1, and component (a4) is a hydroxy group-containing amine represented by HON(R.sup.4).sub.2 in an amount such that a molar ratio of component (a4) to component (a3) is 0.10 to 1.5, wherein R.sup.4 is, independently of each other, a linear or branched aliphatic hydrocarbon group having 1 to 6 carbon atoms.

Surfactants for use in formulations and processes suitable for hydrocarbon recovery. These formulations, include formulations suitable for fracking, enhancing oil and or gas recovery, and the recovery and or production of bio-based oils.

The present invention provides a siloxane compound having a novel structure, the compound not being reactive with a polyamic acid which is a polyimide precursor. In addition, provided is a polyimide precursor composition having improved storage stability by adding the siloxane compound as an enhancer for adhesion between a polyimide and a substrate made of an inorganic material. According to the present invention, provided is a multifunctional polyimide film having improved adhesiveness with a substrate made of an inorganic material while having improved optically isotropic characteristics and reduced residual stress characteristics with respect to a substrate.

A method for making a dense organosilicon film with improved mechanical properties includes the steps of: providing a substrate within a reaction chamber; introducing into the reaction chamber a gaseous composition comprising alkoxydisiloxane; and applying energy to the gaseous composition comprising alkoxydisiloxane in the reaction chamber to induce reaction of the gaseous composition comprising alkoxydisiloxane to deposit an organosilicon film on the substrate, wherein the organosilicon film has a dielectric constant of from ˜2.50 to ˜3.30, an elastic modulus of from ˜6 to ˜35 GPa, and an at. % carbon of from ˜10 to ˜40 as measured by XPS.

A mixture M includes at least one compound A, selected from (a1) a compound of the general formula (I) and/or (a2) a compound of the general formula (I′), at least one compound B, selected from (b1) a compound of the general formula (II) and/or (b2) a compound of the general formula (II′) and/or (b3) a compound of the general formula (II″), and at least one compound C, selected from cationic germanium(II) compounds of the general formula (III).