Provided is a monomer composition that has rapid curability and can be cured rapidly, even in the presence of oxygen and/or water, to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition according to the present invention contains a vinyl ether compound (A). The vinyl ether compound (A) includes a vinyl ether compound (a) having a cyclic ether skeleton. The monomer composition further contains at least one compound selected from the group consisting of a vinyl ether compound (a) having a chain hydrocarbon skeleton, a divinyl ether compound (a-1) having a cyclic hydrocarbon skeleton, an oxetane compound (B), and an epoxy compound (C).

Provided is a monomer composition that has rapid curability and can be cured rapidly, even in the presence of oxygen and/or water, to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition according to the present invention contains a vinyl ether compound (A). The vinyl ether compound (A) includes a vinyl ether compound (a) having a cyclic ether skeleton. The monomer composition further contains at least one compound selected from the group consisting of a vinyl ether compound (a) having a chain hydrocarbon skeleton, a divinyl ether compound (a-1) having a cyclic hydrocarbon skeleton, an oxetane compound (B), and an epoxy compound (C).

The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R.sup.1 is hydrogen or an alkenylphenoxy group, R.sup.2 is an alkenylphenoxy group, and R.sup.3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, molding compounds, as well as structural and/or electrical composites. ##STR00001##

The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R.sup.1 is hydrogen or an alkenylphenoxy group, R.sup.2 is an alkenylphenoxy group, and R.sup.3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, molding compounds, as well as structural and/or electrical composites. ##STR00001##

The invention relates to a curable composition having an electron deficient olefin.

The invention relates to a curable composition having an electron deficient olefin.

The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R.sup.1 is hydrogen or an alkenylphenoxy group, R.sup.2 is an alkenylphenoxy group, and R.sup.3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

##STR00001##

The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R.sup.1 is hydrogen or an alkenylphenoxy group, R.sup.2 is an alkenylphenoxy group, and R.sup.3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

##STR00001##

Provided is a process of making a polyphenylene oxide prepolymer, comprising a step of reacting a reactive cycloolefin and a vinyl-containing polyphenylene oxide in the presence of a ruthenium catalyst. The reactive cycloolefin may be selected from dicyclopentadiene monomer, dicyclopentadiene oligomer, dicyclopentadiene polymer, norbornene monomer, norbornene oligomer, norbornene polymer, and a combination thereof; the vinyl-containing polyphenylene oxide may be selected from divinylbenzyl polyphenylene oxide resin, vinylbenzyl-modified polyphenylene oxide resin, methacrylic polyphenylene oxide resin, and a combination thereof; the ruthenium catalyst may be a Grubbs catalyst. Also provided are a polyphenylene oxide prepolymer made by the process, a resin composition containing the polyphenylene oxide prepolymer, and a product made from the resin composition.

Provided is a process of making a polyphenylene oxide prepolymer, comprising a step of reacting a reactive cycloolefin and a vinyl-containing polyphenylene oxide in the presence of a ruthenium catalyst. The reactive cycloolefin may be selected from dicyclopentadiene monomer, dicyclopentadiene oligomer, dicyclopentadiene polymer, norbornene monomer, norbornene oligomer, norbornene polymer, and a combination thereof; the vinyl-containing polyphenylene oxide may be selected from divinylbenzyl polyphenylene oxide resin, vinylbenzyl-modified polyphenylene oxide resin, methacrylic polyphenylene oxide resin, and a combination thereof; the ruthenium catalyst may be a Grubbs catalyst. Also provided are a polyphenylene oxide prepolymer made by the process, a resin composition containing the polyphenylene oxide prepolymer, and a product made from the resin composition.