Curable compositions comprise at least one (meth)acrylate monomer; silver; and a photoinitiator system. The photoinitiator system comprises at least one cyclic β-diketone represented by the formula (I) or a tautomer thereof, wherein: R.sup.1 represents H or an organic moiety having from 1 to 32 carbon atoms and optionally 1 to 12 heteroatoms selected from O, N, and combinations thereof; each R.sup.2 independently represents H or an aliphatic group having from 1 to 12 carbon atoms, and up to two of oxygen and sulfur atoms; and n represents 1, 2, or 3; and at least one Type II photoinitiator. Methods of making and using the compositions are also disclosed.

Curable compositions comprise at least one (meth)acrylate monomer; silver; and a photoinitiator system. The photoinitiator system comprises at least one cyclic β-diketone represented by the formula (I) or a tautomer thereof, wherein: R.sup.1 represents H or an organic moiety having from 1 to 32 carbon atoms and optionally 1 to 12 heteroatoms selected from O, N, and combinations thereof; each R.sup.2 independently represents H or an aliphatic group having from 1 to 12 carbon atoms, and up to two of oxygen and sulfur atoms; and n represents 1, 2, or 3; and at least one Type II photoinitiator. Methods of making and using the compositions are also disclosed.

Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

A radiation curable secondary coating composition for optical fiber is described and claimed. This radiation curable secondary coating composition includes component (A) which is a urethane (meth)acrylate and component (B) which is a (meth)acrylate compound with two or more ethylenically unsaturated groups and one or more bisphenol structures; wherein the content of component (B) in the composition is 60-300 mass parts per 100 mass parts of component (A). The liquid secondary coating has a viscosity at 25° C. of from about 0.1 Pa.Math.s to about 15 Pa.Math.s. Films obtained by curing the liquid radiation curable secondary coating composition of the present invention have a Young's modulus of from about 600 MPa to about 500 MPa and the breaking elongation of the cured film is from about to 5% to about 50%.

A radiation curable secondary coating composition for optical fiber is described and claimed. This radiation curable secondary coating composition includes component (A) which is a urethane (meth)acrylate and component (B) which is a (meth)acrylate compound with two or more ethylenically unsaturated groups and one or more bisphenol structures; wherein the content of component (B) in the composition is 60-300 mass parts per 100 mass parts of component (A). The liquid secondary coating has a viscosity at 25° C. of from about 0.1 Pa.Math.s to about 15 Pa.Math.s. Films obtained by curing the liquid radiation curable secondary coating composition of the present invention have a Young's modulus of from about 600 MPa to about 500 MPa and the breaking elongation of the cured film is from about to 5% to about 50%.

The present invention relates to liquid-crystalline media comprising one or more pleochroic dyes and one or more compounds selected from the group of compounds of formulae I, II and III,

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in which the parameters have the meaning indicated in Claim 1, and to components comprising these media for high-frequency technology, in particular phase shifters and microwave array antennas.

There is provided a curable composition, which forms a cured product with high light transmittance, a high refractive index, and high scratch resistance, a cured product thereof, and an optical member. A curable composition contains zirconium oxide nanoparticles, a dispersant, and a (meth)acrylate compound. The dispersant has an acid value in the range of 100 to 300 mgKOH/g. The (meth)acrylate compound contains a (meth)acrylate compound having a poly(alkylene oxide) structure.

Provided are the following compound represented by General Formula (A) or (B), a curable resin composition including the compound, a cured product thereof, an optical member, and a lens:

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A ring Ar.sup.1 and a ring Ar.sup.2 represent an aromatic ring represented by a specific formula or a fused ring thereof, R.sup.1 and R.sup.2 represent a specific substituent, and v and w are a specific integer. R.sup.3 and R.sup.4 represent a hydrogen atom or a monovalent substituent, L.sup.1 and L.sup.2 represent an alkylene group having 1 to 6 carbon atoms, and Sp.sup.a to Sp.sup.d represent a single bond or a divalent linking group. Pol.sup.1 and Pol.sup.2 represent a hydrogen atom or a polymerizable group, in which at least one of Pol.sup.1 or Pol.sup.2 is a polymerizable group. Further, in the formulae, a structure represented by (R.sup.1).sub.v—Ar.sup.1/cyclopentadiene skeleton/Ar.sup.2—(R.sup.2).sub.w is not line-symmetrical.

The present, invention provides a liquid crystal display device that can exhibit excellent retardation stability against heat and that can prevent reduction in contrast ratio due to scattering even when the liquid crystal display device includes a retardation layer formed by polymerization of a reactive monomer, and a method for producing a liquid crystal display device suitable for production of the liquid crystal display device. The liquid crystal display device of the present invention includes paired substrates and a liquid crystal layer provided between the paired substrates. At least one of the paired substrates includes a retardation layer formed from a polymer of at least one type of monomer. The at least one type of monomer includes a photo-aligning monomer that is to be aligned by polarized light.

An encapsulation resin composition is used to hermetically seal a gap between a base member and a semiconductor chip bonded onto the base member. The encapsulation resin composition has a reaction start temperature of 160° C. or less. A melt viscosity of the encapsulation resin composition is 200 Pa.Math.s or less at the reaction start temperature, 400 Pa.Math.s or less at any temperature which is equal to or higher than a temperature lower by 40° C. than the reaction start temperature and which is equal to or lower than the reaction start temperature, and 1,000 Pa.Math.s or less at a temperature lower by 50° C. than the reaction start temperature.