C08F222/1067

Acrylic Emulsions Modified with Functional (Meth)acrylates to Enable Crosslinking

The present invention provides a method for crosslinking an acrylic emulsion with a (meth)acrylate monomer or a (meth)acrylate oligomer including adding a base acrylic emulsion to a vessel, adding at least one (meth)acrylate crosslinker to the vessel, incorporating the at least one (meth)acrylate crosslinker into the base acrylic emulsion to create a two-phase system including water and a phase including crosslinkers of the at least one (meth)acrylate crosslinker inside acrylic emulsion particles of the base acrylic emulsion, applying the two-phase system to a surface, and curing the two-phase system to create a final system including a continuous film and crosslinked crosslinkers.

Composition, adhesive film, laminate, method for producing cured product pattern, and method for manufacturing circuit substrate

There are provided a composition having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting, includes a compound 1 or a compound group 2; and a solvent, in which the compound 1 and the like is a compound decomposable into two or more compounds in a case where a polarity conversion group is treated, and at least one compound has a molecular weight of 30 to 400, and at least one compound has a molecular weight of 1,000 or more, the compound 1: a compound is a resin having a polymerizable group and a polarity conversion group, in which the resin has the polarity conversion group in at least a main chain or a side chain, the polarity conversion group is bonded to the main chain of the resin via a linking group in a case where the polarity conversion group is provided in the side chain, and the number of atoms constituting a chain of the linking group is 8 or more; and the compound group 2: a compound that has a polymerizable group and does not have a polarity conversion group, and a compound that does not have a polymerizable group and has a polarity conversion group.

Composition, adhesive film, laminate, method for producing cured product pattern, and method for manufacturing circuit substrate

There are provided a composition having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting, includes a compound 1 or a compound group 2; and a solvent, in which the compound 1 and the like is a compound decomposable into two or more compounds in a case where a polarity conversion group is treated, and at least one compound has a molecular weight of 30 to 400, and at least one compound has a molecular weight of 1,000 or more, the compound 1: a compound is a resin having a polymerizable group and a polarity conversion group, in which the resin has the polarity conversion group in at least a main chain or a side chain, the polarity conversion group is bonded to the main chain of the resin via a linking group in a case where the polarity conversion group is provided in the side chain, and the number of atoms constituting a chain of the linking group is 8 or more; and the compound group 2: a compound that has a polymerizable group and does not have a polarity conversion group, and a compound that does not have a polymerizable group and has a polarity conversion group.

ENCAPSULATION MATERIAL, LAMINATED SHEET, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

An encapsulation material is used to fill a gap between a base member and a semiconductor chip to be bonded onto the base member. The encapsulation material has a reaction start temperature of 160° C. or less. A total content of components volatilized from the encapsulation material when the encapsulation material is heated to at least one temperature falling within a range from 100° C. to 170° C. is 0.5% by mass or less of the entire encapsulation material.

ENCAPSULATION MATERIAL, LAMINATED SHEET, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

An encapsulation material is used to fill a gap between a base member and a semiconductor chip to be bonded onto the base member. The encapsulation material has a reaction start temperature of 160° C. or less. A total content of components volatilized from the encapsulation material when the encapsulation material is heated to at least one temperature falling within a range from 100° C. to 170° C. is 0.5% by mass or less of the entire encapsulation material.

ALL-SOLID-STATE BATTERY AND PHOTOCURABLE COMPOSITION USED IN ALL-SOLID-STATE BATTERY

A photocurable composition includes a compound having one (meth)acryloyl group in one molecule and not having a urethane bond and a photoradical polymerization initiator as essential components, and further includes a compound having one (meth)acryloyl group in one molecule and not having a urethane bond, a compound having a (meth)acryloyl group and a urethane bond, and a compound having another ethylenically unsaturated group as optional components, in which a viscosity of the photocurable composition at 25° C. is 1 Pa.Math.s to 100 Pa.Math.s. The photocurable composition is a material for forming a resin layer on at least a part of a side surface of a laminated electrode body in an all-solid-state battery.

ALL-SOLID-STATE BATTERY AND PHOTOCURABLE COMPOSITION USED IN ALL-SOLID-STATE BATTERY

A photocurable composition includes a compound having one (meth)acryloyl group in one molecule and not having a urethane bond and a photoradical polymerization initiator as essential components, and further includes a compound having one (meth)acryloyl group in one molecule and not having a urethane bond, a compound having a (meth)acryloyl group and a urethane bond, and a compound having another ethylenically unsaturated group as optional components, in which a viscosity of the photocurable composition at 25° C. is 1 Pa.Math.s to 100 Pa.Math.s. The photocurable composition is a material for forming a resin layer on at least a part of a side surface of a laminated electrode body in an all-solid-state battery.

Methods for additive manufacturing of an object

The combination of 3D printing technology plus the additional dimension of transformation over time of the printed object is referred to herein as 4D printing technology. Particular arrangements of the additive manufacturing material(s) used in the 3D printing process can create a printed 3D object that transforms over time from a first, printed shape to a second, predetermined shape.

Methods for additive manufacturing of an object

The combination of 3D printing technology plus the additional dimension of transformation over time of the printed object is referred to herein as 4D printing technology. Particular arrangements of the additive manufacturing material(s) used in the 3D printing process can create a printed 3D object that transforms over time from a first, printed shape to a second, predetermined shape.

Acrylic emulsions modified with functional (meth)acrylates to enable crosslinking

The present invention provides a method for crosslinking an acrylic emulsion with a (meth)acrylate monomer or a (meth)acrylate oligomer including adding a base acrylic emulsion to a vessel, adding at least one (meth)acrylate crosslinker to the vessel, incorporating the at least one (meth)acrylate crosslinker into the base acrylic emulsion to create a two-phase system including water and a phase including crosslinkers of the at least one (meth)acrylate crosslinker inside acrylic emulsion particles of the base acrylic emulsion, applying the two-phase system to a surface, and curing the two-phase system to create a final system including a continuous film and crosslinked crosslinkers.