Patent classifications
C08G59/066
STRUCTURAL ADHESIVE COMPOSITIONS
Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.
DENTAL COMPOSITION
Dental root canal filling composition comprising (a) one or more diepoxides; (b) one or more primary monoamines and/or disecondary diamines; (c) a particulate filler, wherein the one or more diepoxides are selected from compounds of the following formula (I) or a salt thereof:
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EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND
An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:
E1-(M1).sub.a1-(L1).sub.b1-(M2).sub.a2-L2-A1-L3-(M3).sub.a3-(L4).sub.b2-(M4).sub.a4-E2 Formula 1
E3-(A2).sub.c1-(L5).sub.b3-(M5).sub.a5-L6-(M6).sub.a6-L7-(M7).sub.a7-(L8).sub.b4-(A3).sub.c2-E4 Formula 2
In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.
Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of η′2/η′1 equal to 3 or less, wherein η′1 is an initial dynamic shear viscosity (Pa.Math.s) and η′2 is a maximum value of dynamic shear viscosity (Pa.Math.s), in a measurement of dynamic shear viscosity.
CURABLE COATING COMPOSITIONS
Disclosed herein are curable compositions comprising an epoxide-functional polymer, a curing agent capable of reacting with the epoxide-functional polymer that is activatable by an external energy source, and a fluoropolymer that is substantially free of a reactive functional group. The epoxide-functional polymer may be a solid epoxide-functional polyurethane comprising a di-isocyanate. Also disclosed are articles comprising one of the compositions in an at least partially cured state positioned between first and second substrates. Also disclosed are methods of forming an adhesive on a substrate.
CATIONIC ELECTRODEPOSITION COATING MATERIAL COMPOSITION
This invention provides a cationic electrodeposition paint composition comprising an amino-group-containing epoxy resin (A), a blocked polyisocyanate compound (B), and a modified imidazole (C) having a specific structure, wherein the cationic electrodeposition paint composition satisfies the following (i) or (ii), or both: (i) the cationic electrodeposition paint composition further comprises a rust inhibitor (D) or (ii) a blocking agent (b-2) of the blocked polyisocyanate compound (B) is an oxime-based compound (b-2-1) and/or a pyrazole-based compound (b-2-2).
Silicon-containing compositions and their methods of use
Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.
THIOL-CONTAINING COMPOSITION
The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods.
Container coating system
A multi-coat coating system having an undercoat composition and an overcoat composition, wherein the undercoat, overcoat or both the undercoat and overcoat contain a polymer having segments of a specified formula and are substantially free of polyhydric phenols having estrogenic activity greater than or equal to that of bisphenol S. The coating system is suitable for use on a food-contact surface of food or beverage containers.
Curing agent composition and curing agent coating formula thereof
A curing agent composition and a curing agent coating formula thereof are provided. The curing agent composition includes 5 to 25 wt % of an ester group-containing amine end group adduct, 2 to 25 wt % of a C8-C22 hydrophobic saturated or unsaturated fatty amine, 2 to 25 wt % of a polyamine compound, 2 to 20 wt % of a silane compound, and 10 to 60 wt % of an ether solvent.