To provide a friction material used for a brake shoe of a drum brake for a passenger car, which continuously reduces generation of low frequency noise and provides excellent braking effectiveness and wear resistance and is manufactured by forming a friction material composition which contains no cleavage substance, 8-12 weight % of a phenolic thermosetting resin as the binder, 9-18 weight % of cashew dust as the organic friction modifier, 6-12 weight % of a rubber particle, where the total amount of the cashew dust and rubber particle is 18-25 weight %, and 4-10 weight % of the aluminum particle as the inorganic friction modifier, all relative to the total amount of the friction material composition. The friction material contains the phenolic thermosetting resin consists of a straight novolak phenolic resin and the unvulcanized nitrile rubber (NBR) particle.

Provided is a curable composition which forms a cured product that has excellent fireproof performance, while having excellent shape retainability even in cases where the expansion ratio of the cured product after firing is set to a high value. This curable composition includes a shape retention agent, while having fluidity when applied; and if a cured product that is obtained by curing this curable composition is fired in 600 C. air atmosphere for 30 minutes, the cured product after firing has shape retainability.

An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.

An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.

The present invention relates to a polymeric Mannich base useful as an epoxy curative and/or accelerator, which has an improved safety profile due to the avoidance of the use of phenol in its preparation. More specifically, the present invention provides a method for forming a polymeric Mannich base, as well polymeric Mannich bases preparable by the method, for use as an epoxy resin curative and/or accelerator, said method comprising: i) providing: a) a polymer comprising aromatic terminal groups linked by a hydrocarbyl polymeric backbone, wherein each of the aromatic terminal groups comprises a ring substituted with at least one activating group and at least one unsubstituted ring atom, wherein the one or more activating groups is capable of activating the aromatic terminal group to undergo electrophilic aromatic 15 substitution at the at least one unsubstituted ring atom; wherein the aromatic terminal groups are bonded to the hydrocarbyl polymeric backbone through an ether, ester, amine, amide, thioether, or thioester group; b) a primary or secondary monoamine and/or a polyamine comprising primary and/or secondary amino groups, and c) an aldehyde; and ii) performing a Mannich reaction using components a) to c), wherein each aromatic terminal group of the polymer is converted to a Mannich base.

The present invention relates to a polymeric Mannich base useful as an epoxy curative and/or accelerator, which has an improved safety profile due to the avoidance of the use of phenol in its preparation. More specifically, the present invention provides a method for forming a polymeric Mannich base, as well polymeric Mannich bases preparable by the method, for use as an epoxy resin curative and/or accelerator, said method comprising: i) providing: a) a polymer comprising aromatic terminal groups linked by a hydrocarbyl polymeric backbone, wherein each of the aromatic terminal groups comprises a ring substituted with at least one activating group and at least one unsubstituted ring atom, wherein the one or more activating groups is capable of activating the aromatic terminal group to undergo electrophilic aromatic 15 substitution at the at least one unsubstituted ring atom; wherein the aromatic terminal groups are bonded to the hydrocarbyl polymeric backbone through an ether, ester, amine, amide, thioether, or thioester group; b) a primary or secondary monoamine and/or a polyamine comprising primary and/or secondary amino groups, and c) an aldehyde; and ii) performing a Mannich reaction using components a) to c), wherein each aromatic terminal group of the polymer is converted to a Mannich base.

The present invention relates to a package or a portion thereof having an interior food-contacting surface and a coating composition being substantially free of bisphenol A and reaction products thereof applied to the interior surface; wherein the coating composition comprises a polyhydroxy ether and a curing agent for the polyhydroxy ether and in which the polyhydroxy ether is prepared from reacting epichlorohydrin with a polyhydric phenol having the following structure (I), as shown in claim 1; where R.sub.1 is independently an organic group having a molecular weight of at least 15 Daltons or R.sub.1 can optionally join together with another R.sub.1 to form a fused aromatic ring that is similarly substituted with the R.sub.1 organic group; y=4, x=1 to 2; each of the arylene groups in structure (I) includes at least one R.sub.1 attached to the arylene ring at the ortho and/or meta position relative to the phenolic hydroxyl group; m is 0 to 1; R.sub.2 if present is a divalent organic group; n is 0 to 1 with the proviso that if n is 0, m is 0; the polyhydroxy ether having an Mn of from 2000 to 10,000 and containing at least 70 percent by weight of groups of the structure (II), as shown in claim 1, based on weight of the polyhydroxy ether.

The present invention relates to a package or a portion thereof having an interior food-contacting surface and a coating composition being substantially free of bisphenol A and reaction products thereof applied to the interior surface; wherein the coating composition comprises a polyhydroxy ether and a curing agent for the polyhydroxy ether and in which the polyhydroxy ether is prepared from reacting epichlorohydrin with a polyhydric phenol having the following structure (I), as shown in claim 1; where R.sub.1 is independently an organic group having a molecular weight of at least 15 Daltons or R.sub.1 can optionally join together with another R.sub.1 to form a fused aromatic ring that is similarly substituted with the R.sub.1 organic group; y=4, x=1 to 2; each of the arylene groups in structure (I) includes at least one R.sub.1 attached to the arylene ring at the ortho and/or meta position relative to the phenolic hydroxyl group; m is 0 to 1; R.sub.2 if present is a divalent organic group; n is 0 to 1 with the proviso that if n is 0, m is 0; the polyhydroxy ether having an Mn of from 2000 to 10,000 and containing at least 70 percent by weight of groups of the structure (II), as shown in claim 1, based on weight of the polyhydroxy ether.

This invention provides a new dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin with excellent heat resistance, low dielectric constant Dk, low dissipation factor Df having the formula 1. Preparation of dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin in two steps: Step 1, reacting (a1) dicyclopentadiene phenol resin represented by formula 2 with (a2) 2,6-dimethyl phenol in the presence of acid catalyst by (a3) aldehyde compounds to synthesize dicyclopentadiene phenol-2,6-dimethyl phenol copolymer, and Step 2, reacting dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer with excess epichlorhydrin under NaOH condition to prepare dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin. When this dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin according to the present invention is substituted into compositions for laminate, they have low dielectric constant, low dissipation factor, and no delamination after longer than 10 minutes 288 C. soldering test and 2 hours pressure cooking test.

This invention provides a new dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin with excellent heat resistance, low dielectric constant Dk, low dissipation factor Df having the formula 1. Preparation of dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin in two steps: Step 1, reacting (a1) dicyclopentadiene phenol resin represented by formula 2 with (a2) 2,6-dimethyl phenol in the presence of acid catalyst by (a3) aldehyde compounds to synthesize dicyclopentadiene phenol-2,6-dimethyl phenol copolymer, and Step 2, reacting dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer with excess epichlorhydrin under NaOH condition to prepare dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin. When this dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin according to the present invention is substituted into compositions for laminate, they have low dielectric constant, low dissipation factor, and no delamination after longer than 10 minutes 288 C. soldering test and 2 hours pressure cooking test.