Two-component epoxy-based liquid formulations and their resultant dual use epoxy-based products. The epoxy-based liquid formulations include a liquid epoxy resin composition mixed with a liquid epoxy curing agent composition. The liquid epoxy resin compositions include one or more liquid epoxy resins containing a reactive oxirane structure or epoxide group, while the liquid epoxy curing agent composition comprises one or more epoxy curing agents. The liquid epoxy resin and liquid epoxy curing agent compositions are mixed together to provide a dual functioning epoxy-based formulation that, when applied to a substrate and cured, provides a cured three-dimensional cross-linked thermoset dual acting epoxy-based product having both the moisture vapor barrier and the primer functionalities.

Provided is a curable epoxy composition capable of forming a cured product having excellent heat resistance even in a high temperature environment. A first curable epoxy composition includes an alicyclic epoxy compound (A) having an alicyclic structure and an epoxy group in a molecule, an acid anhydride-based curing agent (B), and an imidazole-based curing accelerator (C), and is liquid at 25° C. and to be used for a rotary electric machine. A second curable epoxy composition includes an alicyclic epoxy compound (A) having an alicyclic structure and an epoxy group in a molecule, an acid anhydride-based curing agent (B), an imidazole-based curing accelerator (C), and a polyester polyol (D), and is to be used for a rotary electric machine.

The present invention provides a degradable and recyclable epoxy conductive adhesive, which comprises the following raw materials in percentage by weight: 15% to 30% of epoxy resin, 1% to 10% of a curing agent, 0.1% to 2% of a reaction diluent and 15% to 85% of a conductive filler, wherein the curing agent comprises a breakable molecular structure. According to the epoxy conductive adhesive of the present invention, after the epoxy resin in the conductive adhesive is cured by using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the conductive adhesive can be degraded in normal pressure, mild and specific conditions, the process is simple and the operation is convenient, no contamination is brought to the environment, the recycling cost is largely reduced, and the recycling of the conductive adhesive has enormous economic and environmental advantages. By using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the shear strength of the conductive adhesive is greatly increased, and the reliability and the service life of the conductive adhesive are largely improved.

A composition formed of an epoxy resin incorporating a fire retardant.

Achieved is a coating floor material using a carbon nanotube, which has excellent finishing properties and shows high conductivity even when a cured coating film is at 50 V. This coating floor material contains: a room temperature curable resin, a single-walled carbon nanotube, a wetting dispersant, a leveling agent, and a defoaming agent, wherein the wetting dispersant is a polymer salt containing an acidic group and an amino group.

The invention is directed to a method of controlled conversion of thermosetting resins and additive manufacturing thereof by selective laser sintering. Partial curing of a thermosetting formulation can be used to increase the T.sub.g of the resin and minimize the additional cure needed to cross-link a printed object. After printing, the partially cured material is finally cured via a slow temperature ramp maintained just below the material's evolving T.sub.g.

The present invention relates to a heat-curable composition comprising at least one epoxy monomer comprising two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, and at least one epoxy ring-opening catalyst. The composition comprises at least 50% by weight of compounds having at least one epoxy group, relative to the total weight of polymerizable compounds present in the composition and provides upon pre-curing a tack-free coating that can be removed by treatment with a solution of sodium hydroxide, and upon post-curing a coating that cannot be removed by treatment with a solution of sodium hydroxide.

An amine of the formula (I) and a process for its preparation by reductive alkylation of 1,2-propylenediamine with a di- or trifunctional carbonyl compound and hydrogen. The amine of the formula (I) is low in viscosity and in odour, high in reactivity towards epoxides and outstanding in its compatibility with other amines and with epoxy resins. The amine of the formula (I) allows access to low-emission epoxy resin compositions which have good processing qualities, cure rapidly even at low temperatures and form high-quality, high-hardness plastics having an attractive surface.

The cationically photopolymerizable composition according to the present disclosure includes: (A) a polyfunctional epoxy compound having two or more epoxy groups per molecule; (B) a monofunctional epoxy compound having one epoxy group per molecule; (C) a photocation generator; and (D) an oxetane compound. At least one of the component (A) and the component (B) contains an epoxy compound ((A1) or (B1)) having a polyether backbone per molecule. A mass ratio of the component (A) to the component (B) falls within a range of 90:10 to 30:70.

The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can provide a thin display.