A resin composition is provided which contains a mixture comprising a cycloaliphatic epoxy resin, a coupling agent, and an epoxy-containing compound, and/or a polycarbonate alcohol. Further, the resin composition contains a hardener component comprising a dicarboxylic anhydride, a dicarboxylic anhydride semi ester, an organic phosphite and an accelerator.

A composition for forming a resist underlayer film enables the formation of a desired resist pattern; and a method for forming a resist pattern using this resist underlayer film forming composition. A resist underlayer film forming composition contains an organic solvent and a polymer that has a structure represented by formula (1) or (2) at an end of the polymer chain. (In formula (1) and formula (2), X represents a divalent organic group; A represents an aryl group having 6-40 carbon atoms; R1 represents a halogen atom, an alkyl group having 1-40 carbon atoms or an alkoxy group having 1-40 carbon atoms; each of R2 and R3 independently represents a hydrogen atom, an optionally substituted alkyl group having 1-10 carbon atoms, an aryl group having 6-40 carbon atoms or a halogen atom; each of n1 and n3 independently represents an integer of 1-12; and n2 represents an integer of 0-11.)

A dispersion includes a hyperbranched polymer having latent crosslinking functionality and comprising the reaction product of: a partially neutralized, acid-functional resin; and an epoxy; and optionally, an effective amount of a crosslinking agent; wherein: the partially neutralized, acid-functional resin comprises the reaction product of a mixture of: a first acid-functional resin with a base and a second acid-functional resin; or a first and a second acid-functional resin with a base; the first acid-functional resin is not the same as the second acid-functional resin; at least one of the acid functional resins comprises a further functional group capable of Schiff-Base crosslinking after film formation; and the dispersion is a single pack waterborne polymer dispersion.

Lost circulation material (LCM) compositions for sealing lost circulation zones in wellbores may include an epoxy resin, a curing agent, an amide accelerator, and calcium carbonate having an average particle size of from 1,000 microns to 10,000 micron. The epoxy resin includes at least one of 2,3-epoxypropyl-o-tolyl ether, C12-C14 alkyl glycidyl ether, 1,6-hexanediol diglycidyl ether, butyl glycidyl ether, or cyclohexanedimethanol diglycidyl ether. The epoxy resin can also include bisphenol-A-epichlorohydrin epoxy resin. Methods of treating a lost circulation zone of a wellbore include injecting the LCM compositions into the lost circulation zone and curing the LCM compositions, where the LCM compositions include an epoxy resin, a curing agent, an amide accelerator, and calcium carbonate having an average particle size of from 1,000 microns to 10,000 microns.

The present invention is to provide a monomer mixture that is cured rapidly even in the presence of oxygen and that forms a cured product having high hardness and excellent adhesion to metals and/or glass. The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. As the cationically polymerizable monomers, the monomer mixture contains at least 10 wt. %, based on a total amount of the monomer mixture, of a compound having at least one cationically polymerizable group selected from the group consisting of a vinyl ether group, an epoxy group, and an oxetanyl group, and at least one hydroxy group in a molecule, and at least 5 wt. %, based on the total amount of the monomer mixture, of a compound represented by Formula (b). In the formula, R represents an s-valent straight-chain or branched saturated aliphatic hydrocarbon group or an s-valent group having two or more straight-chain or branched saturated aliphatic hydrocarbon groups bonded to each other through an ether bond, and s represents an integer of 2 or greater.

The present disclosure relates to materials for photoinitiated cationic ring-opening polymerization (ROP). The present disclosure also relates to uses of the materials, e.g., in 3D printing.

A thermally reworkable adhesive includes at least one di-epoxide, at least one diamine that is reactive with the at least one di-epoxide, at least one additive that is miscible, but not reactive, with the at least one di-epoxide and/or the at least one diamine. Reaction of the at least one di-epoxide and the at least one diamine forms a crosslinked polymer network and the at least one additive offsets the stoichiometry of the crosslinked polymer network by 5-50%. The offset crosslinked polymer network forms the thermally reworkable adhesive that once cured, at a temperature in the range of 20-200° C., can be de-bonded from a device to which it is attached at a temperature in the range of 50-200° C.

A curable void filler composition comprising at least one epoxy resin; at least one epoxy curing agent comprising at least one bicyclic carboxylic acid anhydride; and at least one epoxysilane compound according to formula (1), where formula (1) is Glycidoxy-R1Si(OR2)(OR3)(OR4), and R1 is selected from linear or branched alkyl comprising from 1 and 15 carbon atoms; and R2, R4 and R4 may be different or the same, and are independently selected from linear or branched alkyl comprising from 2 to 15 carbon atoms.

The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, can implement a top-emitting organic electronic device, can be applied in an inkjet method, can provide a thin display and can effectively prevent interference of an electromagnetic field due to a low dielectric constant.

Provided is a method for making a mold of a gap between components, the method comprising: a step for preparing a curable composition by mixing a resin material with a curing agent that promotes curing of the resin material; a step for cooling the curable composition (M) to a predetermined temperature at which curing of the curable composition is not initiated, so as to manufacture a mold-making kit; a step for placing the mold-making kit in a gap between a first member and a second member so as to fill the gap; a step for curing the mold-making kit between the first member and the second member to mold the mold-making kit into the shape of the gap; and a step for removing the cured mold-making kit from the gap.