The present invention relates to a heat-curable composition comprising at least one epoxy monomer having two or three epoxy groups, which is not a silicon compound having at least one hydrolyzable group directly linked to the silicon atom, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one group comprising an epoxy function linked to the silicon atom though a carbon atom, and/or a hydrolyzate thereof, at least one epoxy ring-opening catalyst, and at least one compound comprising at least two (2,2,6,6-tetramethyl-4-piperidyl)-groups in which the nitrogen atom can be substituted with an alkyl group, an alkoxy group or an oxyl group.

Multi-layer electrochromic structures, and processes for assembling such structures, incorporating a cross-linked ion conducting polymer layer that maintains high adhesive and cohesive strength in combination with high ionic conductivity for an extended period of time, the ion conducting polymer layer characterized by electrochemical stability at voltages between about 1.3 V and about 4.4 V relative to lithium, lithium ion conductivity of at least about 10.sup.−5 s/cm, and lap shear strength of at least 100 kPa, as measured at 1.27 mm/min in accordance with ASTM International standard D1002 or D3163.

The present invention relates to an epoxy composition comprising a) a cycloaliphatic epoxy resin; b) a curing agent; and c) a bio-based epoxy compound having a structure I:

##STR00001##

The composition according to the present invention can be used as a structural adhesive, a coating and a primer.

The present invention relates to an epoxy composition comprising a) an epoxy resin; b) a curing agent; and c) a bio-based epoxy compound having a structure I:

##STR00001##

The composition according to the present invention can be used as a structural adhesive, a coating and a primer.

The invention is directed to a method of controlled conversion of thermosetting resins and additive manufacturing thereof by selective laser sintering. Partial curing of a thermosetting formulation can be used to increase the T.sub.g of the resin and minimize the additional cure needed to cross-link a printed object. After printing, the partially cured material is finally cured via a slow temperature ramp maintained just below the material's evolving T.sub.g.

A liquid optically clear adhesive (LOCA) for bonding optical substrates includes siloxane and epoxy-containing oligomers, a UV-activated photo-acid generator, a cross-linker additive, a solvent; and a reactive plasticizer, such as an additive of Structure 1. In one example, the additive of Structure 1 constitutes about 1-7% of a total mass of the LOCA excluding the solvent. R.sub.1, R.sub.2, and R.sub.3 of Structure 1 include methoxide, ethoxide, propoxide, or a combination thereof. R.sub.4 of Structure 1 includes an alkyl chain that is linear or branched and includes 2-8 carbons. The LOCA material is characterized by a refractive index equal to or greater than about 1.6 at 450 nm and an optical absorption below about 0.1% per micrometer of a thickness of the LOCA material.

A self-emulsifying epoxy composition is prepared by the components comprising an epoxide adduct a) and an epoxide compound b), the solid content of the self-emulsifying composition has a smaller particle size. The self-emulsifying epoxy composition can be used to prepare the coating composition which has favorable anti-corrosion-performance.

A composition containing: a compound represented by the following formula (D):

##STR00001##

wherein m is an integer of 0 to 6; p is 0 or 1; q is an integer of 0 to 6; Rf is a C1-C8 perfluoroalkyl group optionally containing oxygen with one fluorine atom being optionally replaced by a hydrogen atom, and a compound represented by the following formula (E):

##STR00002##

wherein n is an integer of 0 or greater; and M is a group represented by the following formula (E1):

##STR00003##

a group represented by the following formula (E2):

##STR00004##

or a group represented by the following formula (E3):

##STR00005##

wherein Z is hydrogen or a C1-C10 fluoroalkyl group.

The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.

Disclosed is related to an adhesive composition for encapsulating an organic electronic element and an organic electronic device comprising the same. The adhesive composition includes a curable compound having no carbon-carbon unsaturated group, a thermal initiator, and a photo-initiator. The adhesive composition can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, can realize a top emitting organic electronic device, and can prevent defects such as dark spots which may occur in the organic electronic device.