A curable composition is provided that includes an alkenyl phenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and a thermosetting resin E, in which the thermosetting resin E contains one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenolic compound, an alkenyl-substituted nadimide compound, and an epoxy compound.

The present invention relates to a thermosetting material for use in additive manufacturing, the material comprising at least one thermosetting resin and at least two curing compounds different from said thermosetting resin that are able to cure this/these thermosetting resin(s), wherein at least one curing compound is provided for curing during the additive manufacturing process and at least one curing compound is provided for curing during a post-curing step. The invention furthermore relates to a method of producing a cured 3D thermoset object comprising at least the steps of subjecting the material according to the present invention to an additive manufacturing process, obtaining a partially cured 3D thermoset object and subsequently subjecting the partially cured 3D thermoset object to a post-curing process to further cure the 3D thermoset object Additionally, the invention relates to the use of the material in an SLS, FFF, CBAM, FGF or powder bed additive manufacturing process.

An epoxy resin, comprising an epoxy compound having a mesogenic structure, the epoxy compound comprising a first epoxy compound having one biphenyl structure in a molecule and a second epoxy compound that is different from the first epoxy compound, at a mass ratio of the first epoxy compound to the second epoxy compound (first epoxy compound:second epoxy compound) of from 10:100 to 50:100.

A resinous polymer compound used as a durable surface coating that maximizes content of epoxidized soybean oil (“ESO”) in lieu of bisphenol-A epoxy and hydrogenated bisphenol-A epoxy at various proportions to produce a less brittle, more elastic (flexible) film that, at various weight-percentages of substitution, presents a rapid enough reaction rate for efficient commercial production and yields a colorless and transparent film while lessening the amount of synthetic, petroleum-derived ingredients.

A flux resin composition includes an epoxy resin, an imidazole compound, a thixo agent, and an activator. The epoxy resin includes at least one resin selected from the group consisting of naphthalene epoxy resins, biphenyl aralkyl epoxy resins, trisphenol methane epoxy resins, biphenyl epoxy resins, and dicyclopentadiene epoxy resins. The content of the at least one resin is equal to or greater than 20% by weight with respect to a total weight of the epoxy resin.

A method for strengthening metal structure, including steps: i) mixing two-component epoxy resin composition; ii) applying composition to metal structure surface, or onto strengthening element, or both; iii) contacting applied epoxy resin composition with strengthening element surface and/or metal structure surface wherein composition forms interlayer between metal structure and strengthening element, and iv) curing epoxy resin composition at 100° C. or below; wherein two-component epoxy resin composition contains: first component between 10-50 wt.-% of at least one epoxy resin contains on average more than one epoxy group per molecule; second component between 5-30 wt.-% of hardener for epoxy resins; between 3-25 wt.-% of at least one impact strength modifier in one or both components; between 15-80 wt.-% of at least one filler in one or both components; and wherein two-component epoxy resin composition exhibits after curing Elastic Modulus at least 2500 MPa, and Impact Peel Strength at least 15 N/mm.

A copolymer is formed by reacting a composition I, which includes (a) a first epoxy compound having a chemical structure of

##STR00001##

wherein R.sup.1 is single bond, —O—,

##STR00002##

(b) a second epoxy compound that is different from (a) the first epoxy compound, and (c) a curing agent. The copolymer can be mixed with inorganic powder to form a composite material.

Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: (A) a prepolymer as a molten mixture of (A-1) an epoxy resin: a triazine derivative epoxy resin and/or an alicyclic epoxy compound having an epoxy group and an alicyclic structure in one molecule and being non-fluid at 25° C., (A-2) an acid anhydride having no carbon-carbon double bond and (A-3) an acrylic resin-based modifier having an epoxy group and a weight-average molecular weight of 1,000 to 30,000; (B) a white pigment containing a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.

A thermally or photo curable adhesive composition containing a bisphenol F epoxy resin and a bisphenol A epoxy resin in a ratio between 2 and 10. The composition further contains at least one epoxy acrylate component and a rubber modified bisphenol. The adhesive composition is applicable by a melt or liquid coating technique and undergoes curing upon exposure to heat or radiation, showing improved viscoelastic properties and suitable to provide a cured product having superior durability.

A curable composition containing an alkenyl phenol A, an epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.