A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.

The image display device sealing material contains a resin component and a curing agent, wherein the resin component contains biphenyl skeleton-containing epoxy resin having a weight-average molecular weight of 200 or more and 100,000 or less, alicyclic skeleton-containing epoxy resin having a weight-average molecular weight of 180 or more and 790 or less, and styrene oligomer having a weight-average molecular weight of 750 or more and 4000 or less.

The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.

A curable composition of the present invention includes a cationic polymerizable compound; a thermal polymerization initiator; and a storage stabilizer, in which the cationic polymerizable compound includes at least two selected from the group consisting of a glycidyl ether compound, an alicyclic epoxy compound, and an oxetane compound, a content of the thermal polymerization initiator is from 0.3 to 3 parts by mass with respect to 100 parts by mass of the cationic polymerizable compound, and chain curing is enabled by thermal energy generated by a polymerization reaction of the cationic polymerizable compound.

Provided are: an epoxy resin composition for fiber-reinforced composite materials, which has a good balance between storage stability and fast curing properties at high levels; a prepreg; and an epoxy resin composition which exhibits excellent mechanical characteristics as a fiber-reinforced composite material. A resin composition which contains an epoxy resin, dicyandiamide, an imidazole compound and an acidic compound, while satisfying the following conditions (a)-(c): (d) The time until the heat flow rate reaches the peak top after the epoxy resin composition reaches 100° C. is 25 minutes or less as measured by a differential scanning calorimeter at an isothermal temperature of 100° C. in a nitrogen gas stream. (e) The time until the heat flow rate reaches the peak top after the epoxy resin composition reaches 60° C. is 15 hours or more as measured by a differential scanning calorimeter at an isothermal temperature of 60° C. in a nitrogen gas stream. (f) The ratio of the number of epoxy groups to the number of imidazole rings in the epoxy resin composition is from 25 to 90 (inclusive).

Disclosed is a photosensitive resin composition for an optical waveguide containing a resin component and a photoacid generator. In the photosensitive resin composition, the resin component is constituted of an epoxy resin component containing both an aromatic epoxy resin and an aliphatic epoxy resin, and the content of the aromatic epoxy resin is 55 wt. % or more and less than 80 wt. % of the entirety of the epoxy resin component and the content of the aliphatic epoxy resin is more than 20 wt. % and 45 wt. % or less of the entirety of the epoxy resin component. Accordingly, for example, when a core layer of an optical waveguide is formed using the disclosed photosensitive resin composition for an optical waveguide, a core layer of an optical waveguide having satisfactorily low tackiness and high transparency while maintaining satisfactory roll-to-roll compatibility and a high resolution patterning property can be formed.

A low-dust composite building product is provided. The low-dust composite building product includes a binder system comprising one or more of a thermoset resin, a diluent, and a hardener; and a low-dust filler material comprising filler particles that have been pre-coated with a coating agent comprising one or more of the thermoset resin, the diluent, and the hardener from the binder system.

A resin composition including an epoxy resin (A), a curing agent (B), and vinyl polymer particles (C), in which the contained amount of epoxy resin (a1) having a molecular weight of 100-480 is 30-90 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of epoxy resin (a2) having a molecular weight of 2,000-40,000 is 10-70 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of the vinyl polymer particles (C) is 2-30 parts by mass per 100 parts by mass of the epoxy resin (A), and the instantaneous maximum thickening value of the vinyl polymer particles obtained by the following method is 0.3-5.0 Pa.Math.s/° C.

The present invention relates to a plastic film and a method for manufacturing same. A plastic film, which is formed such that at least one part has a curved shape, can have high hardness, impact resistance, scratch resistance and high transparency. The plastic film is light and will not be easily damaged by external pressure and thus can substitute for the existing glass and is expected to be used for various electronic products such as a display and the like. In particular, the plastic film has at least one part in a curved shape and thereby is expected to be used for products in various shapes which cannot be manufactured by means of the existing glass. Moreover, a method for manufacturing a plastic film enables manufacturing of a plastic film having at least one part in a curved shape without curls or cracks as well as simultaneous performing of heat molding and heat curing, thereby increasing the productivity of a plastic film.

A resin composition is disclosed that includes a thermosetting base resin; a curing agent; an inorganic filler; and at least one fluorine resin powder selected from polyvinylidene fluoride, polychlorotetrafluoroethylene, and a tetrafluoroethylene/perfluoro(alkyl vinyl ether)/chlorotrifluoroethylene copolymer, and a semiconductor device which is fabricated by being sealed using a sealant formed of the resin composition.