A thermosetting resin composition, which constitutes at least a part of a heat-dissipating insulating member interposed between a heat-generating body and a heat-dissipating body, includes (A) an epoxy resin, (B) a thermosetting resin (excluding epoxy resin (A)), (C) a phenoxy resin having a mesogenic structure in the molecule, (D) thermally conductive particles, and (E) an organosiloxane compound.

Disclosed is an environment-friendly vinyl ester resin, which is prepared by mixing following raw materials in percentage by weight: 20-65 weight percentage (wt %) of epoxy resin, 5-35 wt % of methyl monomer, 8-25 wt % of unsaturated acid, 0.01-0.3 wt % of a catalyst, 0.01-0.08 wt % of polymerization inhibitor and 10-40 wt % of a cross-linking agent.

The present disclosure relates to the field of epoxide synthesis, and particularly to a safe, environmentally friendly and controllable method for preparing cycloaliphatic diepoxides. The method comprises the steps of: mixing a diene compound, a carboxylic acid, an alkaline salt, and a solvent, and cooling; dropwise adding a hydrogen peroxide solution thereto over 1-12 h; standing for layering to obtain an underlayer of an organic phase 1, washing the organic phase 1 with a washing liquid, and standing for layering to obtain an underlayer of an organic phase 2; and purifying the organic phase 2. The reaction system of the present disclosure is simple, environmentally friendly, safe and controllable, and the production cost is low, which can meet the technical and economic requirements. The obtained cycloaliphatic diepoxides have high purity, high yield, low solvent content, low chroma and low halogen content, which are suitable for large-scale industrial production.

The present disclosure relates to the field of epoxide synthesis, and particularly to a safe, environmentally friendly and controllable method for preparing cycloaliphatic diepoxides. The method comprises the steps of: mixing a diene compound, a carboxylic acid, an alkaline salt, and a solvent, and cooling; dropwise adding a hydrogen peroxide solution thereto over 1-12 h; standing for layering to obtain an underlayer of an organic phase 1, washing the organic phase 1 with a washing liquid, and standing for layering to obtain an underlayer of an organic phase 2; and purifying the organic phase 2. The reaction system of the present disclosure is simple, environmentally friendly, safe and controllable, and the production cost is low, which can meet the technical and economic requirements. The obtained cycloaliphatic diepoxides have high purity, high yield, low solvent content, low chroma and low halogen content, which are suitable for large-scale industrial production.

A high-temperature-resistant insulating polymer composite is provided, including the following components in parts by mass: 3-12 parts of cyanate ester resin, 3-20 parts of epoxy resin, 5-15 parts of an inorganic filler, 0.1-2 parts of an epoxy resin curing agent, 0.0001-0.005 parts of a curing accelerant, and 0.1-2 parts of a dispersant. A glass transition temperature of the cured high-temperature-resistant insulating polymer composite is higher than 120° C.

A curable epoxy system useful in the production of composites capable of being used in various industries, including, for example, the aerospace industry. In particular, the present disclosure relates to a curable epoxy system comprising (i) an epoxy component selected from bisphenol C diglycidyl ether, one or more derivatives of bisphenol C diglycidyl ether, and combinations thereof, and (ii) 9,9-bis(4-amino-3-chlorophenyl)fluorene.

The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine substantially free of an aromatic tertiary amine and glycerin. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.

Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R.sup.5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3. ##STR00001##

Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R.sup.5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3. ##STR00001##

A curing composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. A method for the chemical fastening of construction elements in boreholes and a method of using a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound including a Mannich base and an amine which is reactive to epoxy groups.