A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I): ##STR00001##
X is an oxygen, sulfur, or nitrogen; R.sup.1 is an alkyl group, an aryl group, or an alkylaryl group; R.sup.2, R.sup.3, and R.sup.4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R.sup.5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R.sup.3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R.sup.3 and the adjacent nitrogen, m is 1.

A multilayer coil device includes an element formed by laminating a coil conductor and a magnetic element body. The magnetic element body includes soft magnetic particles and an epoxy resin. The soft magnetic particles include soft magnetic metal particles. The epoxy resin has an epoxy value of 150 or less. The epoxy resin is filled in gap spaces between the soft magnetic particles.

A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.

A curable liquid composition containing a particulate filler and an epoxy compound having a non-aromatic cyclic group having 5 or more annular atoms, having a favorable dispersion stability of particulate filler and providing a cured material having high hardness, a filler that is suitably incorporated in the curable liquid composition, and a compound that can be suitably used as a ligand bonded to the filler. In a curable liquid composition comprising an epoxy compound having a non-aromatic cyclic group having 5 or more annular atoms as a curable component, a filler on a surface of which a ligand having an alicyclic epoxy group that may be condensed with an aromatic ring and a thiol group, is bonded, is used.

An epoxy resin having end groups each having an epoxy group that are disposed at both ends respectively, and between the end groups, either or both of a first structure in which an aromatic cyclic group, an ether oxygen, a methylene group, an aromatic cyclic group, a methylene group, an ether oxygen and an aromatic cyclic group are bonded together in this order and a second structure in which an aromatic cyclic group, a methylene group, an ether oxygen, an aromatic cyclic group, an ether oxygen, a methylene group and an aromatic cyclic group are bonded together in this order.

A thermosetting resin composition at least including: [A] an epoxy resin containing two or more glycidyl groups; [B] a cyanate ester resin containing two or more cyanate groups; and [C] an amine compound; and satisfying the following conditions (1) and (2): (1) 0.25≤the number of moles of glycidyl groups in the thermosetting resin composition/the number of moles of cyanate groups in the thermosetting resin composition≤1.5; and (2) 0.05≤the number of moles of active hydrogen contained in the amino groups in the thermosetting resin composition/the number of moles of cyanate groups in the thermosetting resin composition<0.5; and a prepreg and a fiber reinforced composite material using the thermosetting resin composition. Provided are a thermosetting resin composition having excellent mechanical properties and heat resistance in a high-temperature environment after moisture absorption, and having excellent reactivity that allows curing in a short time; a prepreg prepared by impregnating a reinforced fiber with a thermosetting resin composition, which prepreg has excellent handling ability (tackiness properties) at room temperature; and a fiber reinforced composite material including a thermosetting resin composition and a reinforced fiber.

The present invention provides an epoxy compound indicated by chemical formula (1) (in chemical formula (1), X indicates a C1-10 aliphatic hydrocarbon group, R.sub.1 and R.sub.2 each independently indicate one selected from the group consisting of a hydrogen atom, an aliphatic hydrocarbon group, an aromatic group, an alkoxy group, and a halogen atom) ##STR00001##

A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I):

##STR00001##

X is an oxygen, sulfur, or nitrogen; R.sup.1 is an alkyl group, an aryl group, or an alkylaryl group; R.sup.2, R.sup.3, and R.sup.4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R.sup.5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R.sup.3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R.sup.3 and the adjacent nitrogen, m is 1.

The present disclosure relates to epoxide containing compounds comprising three benzene units linked by bridging groups. The disclosure also relates to the production of curable epoxy resin formulations comprising said epoxide containing compounds, and their possible incorporation into composite materials such as fibre reinforced composites. Possible methods for formulating the compounds epoxide containing compounds, as described herein, are also disclosed.

An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.