Provided in the present invention is a thermosetting resin composition, comprising phosphorus-containing active ester and epoxy resin, the phosphorus-containing active ester being copolymerised using bis-aromatic formyl chloride hydrocarbyl phosphine oxide and one of bis-hydroxyl aromatic hydrocarbyl phosphine oxide, bis-hydroxyl aromatic oxyhydrocarbyl phosphine oxide, or hydroxylated DOPO, and then obtained from aromatic formyl chloride end capping; the thermosetting resin composition provided in the present invention has the advantages of good thermal stability, humidity resistance and heat resistance, a low dielectric constant and dielectric loss tangent, a low rate of water absorption, and halogen-free flame-retardant properties, and has excellent machinability; also provided in the present invention are applications of the thermosetting resin composition for resin sheet material, resin composite metal foil, prepreg, laminated plate, metal foil-clad laminated plate, and printed circuit boards.

A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): ##STR00001##
wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.

The present teachings contemplate a method that includes a step of providing a first amount of esterified reaction product of an acid and an epoxy-based material. The esterified reaction product may be further reacted an epoxy resin to form a polymeric epoxy. The resulting material may have a generally linear backbone, foaming and curing capability and flame retardant properties.

The present invention relates to novel hardeners for curing epoxy resins and to cure accelerants for the accelerated curing of epoxy resins comprising, in each case, at least one compound from the group of esters of phosphorus-containing acids according to Formula (I), wherein there applies to Formula (I): ##STR00001##
wherein there applies to the radicals R.sup.1, R.sup.2, R.sup.3, R.sup.6, X and indices m, n, p, simultaneously or independently of one another: R.sup.1, R.sup.2=simultaneously or independently of one another, hydrogen or alkyl, R.sup.3=alkyl, aryl, O-alkyl, O-aryl, O-alkylaryl or O-arylalkyl, R.sup.6=hydrogen, alkyl or NHC(O)NR.sup.1R.sup.2, X=oxygen or sulphur, m=1, 2 or 3, n=0, 1 or 2, wherein there applies: m+n=3 p=0, 1 or 2.

The invention relates to a curable adhesive comprising: a) one or more (co)polymers, b) one or more polymerizable epoxide compounds, c) one or more cationic initiators, and d) one or more dyes, wherein the one or the two or more dyes are selected from the group consisting of Benzoyl-Leuco-Methylene Blue, Leuco-Crystal Violet, Crystal Violet Lactone, Ethyl Violet, Methyl Violet, Methyl Green, Ethyl Green, Nile Blue, 1,4-bis(mesitylamino)anthraquinone and copper phthalocyanine.

There is provided herein a flame retardant and curing agent compound for curing thermosetting resins, e.g., epoxy resins, a composition comprising a thermosetting resin, e.g., an epoxy resin and the curing agent, an article comprising the curing agent, and a method of making the curing agent.

Provided is a ceramic-resin composite body that has good mass productivity and product properties (heat dissipation properties, insulation properties and adhesive properties), and particularly a ceramic-resin composite that can dramatically improve the heat dissipation properties for electronic devices. The ceramic-resin composite body includes: 35 to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 to 60 m and an aspect ratio of from 5 to 30 are three-dimensionally continuous; and 65 to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180 C. or more and a curing rate of from 5 to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800, wherein the sintered body is impregnated with the thermosetting resin composition.

There is provided herein a composition containing (A) a phosphorus-containing aromatic polyester of the general formula (I) described herein which has a weight average molecular weight of from 1,000 to 20,000 and which is concurrently a flame retardant O and an active ester curing agent, and, (B) a solvent, such as a solvent commonly used in thermosetting resin formulations and copper-cias laminate preparation.

Disclosed are a fluorine-silicon-containing polyphosphate ester and method for preparation thereof, having a chemical structural formula of:

##STR00001##

wherein R .sub.1 is

##STR00002##

R .sub.2 is

##STR00003##

n=10100. The fluorine-silicon-containing polyphosphate ester of the present invention uses silicon phosphorus and fluorine for improving flame retardancy. Phosphorus catalyzes the system to form a phosphorus-rich carbon layer, performing a protective-layer function and thereby preventing further breakdown of the epoxy resin. The silicon-containing epoxy resin forms a silica-containing carbon layer during the process of combustion, strengthening the carbon-layer structure and further improving the protective function of the carbon-layer. The introduction of elemental fluorine improves the thermal stability of the epoxy resin, thereby improving the flame retardancy performance of the system.

Solvent free epoxy systems are disclosed that can include a hardener compound H comprising: a molecular structure (R.sub.1(Y.sup.1)n), wherein R.sub.1 is an ionic moiety, Y.sup.1 is a nucleophilic group, n is a between 2 and 10; and an ionic moiety A acting as a counter ion to R.sub.1; and an epoxy compound E comprising: a molecular structure (R.sub.2Z.sup.1)n), wherein R.sub.2 is an ionic moiety, Z.sup.1 comprises an epoxide group, n is a between 2 and 10, and an ionic moiety B acting as a counter ion to R.sub.2. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of use are described.