A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

An adhesion promoter, a curable composition containing the adhesion promoter, a cured composition formed from the curable composition, and an article containing the cured composition are provided. The adhesion promoter, which is formed by reacting a polyepoxide with a mercaptosilane that has a hydrolyzable silyl group, has at least one epoxide group and at least one hydrolyzable silyl group. The epoxide groups allow incorporation of the adhesion promoter into the polymeric matrix of the cured composition and the hydrolyzable silyl groups allow bond formation with various substrates.

A coating comprising epoxy functional resin, corrosion resistant particles, and a multi-functional crosslinker are disclosed as are methods of using such a coating to coat at least a portion of a substrate and a substrate coated thereby.

Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.

This application relates, in part, to novel salts represented by the following structure of Formula (1):

##STR00001##

wherein R.sup.1a is selected from the group consisting of hydrogen and optionally substituted alkyl (e.g., unsubstituted C.sub.1-6 alkyl, e.g., —CH.sub.3); R.sup.1b is optionally substituted alkyl (e.g., unsubstituted C.sub.1-6 alkyl, e.g., —CH.sub.3); each occurrence of R.sup.2 and R.sup.3 is independently selected from the group consisting of hydrogen, optionally substituted alkyl, optionally substituted cycloalkyl, and optionally substituted aryl; R.sup.2 and R.sup.3 can combine with each other to form optionally substituted cycloalkyl; each m and n is independently an integer ranging from 1 to 20 (e.g., m and n is independently an integer ranging from 1 to 5); and each of Q.sup.1⊖ and Q.sup.2⊖ is independently a counterion (e.g., each of Q.sup.1⊖ and Q.sup.2⊖ is independently a counterion selected from the group consisting of chloride, bromide, fluoride, iodide, acetate, carboxylate, hydrogen sulfate, nitrate, and phenolate, and sulfonate, e.g., chloride), and methods of making the same.

A curable void filler composition comprising at least one epoxy resin; at least one epoxy curing agent comprising at least one bicyclic carboxylic acid anhydride; and at least one epoxysilane compound according to formula (1), where formula (1) is Glycidoxy-R1Si(OR2)(OR3)(OR4), and R1 is selected from linear or branched alkyl comprising from 1 and 15 carbon atoms; and R2, R4 and R4 may be different or the same, and are independently selected from linear or branched alkyl comprising from 2 to 15 carbon atoms.

A two-component adhesive includes agent A containing an epoxy resin and agent B containing a polymer having a crosslinkable silicon group and an epoxy resin curing agent, wherein agent A and/or agent B contain(s) a core-shell rubber particle, and a condensation catalyst for the crosslinkable silicon group. Another adhesive contains an epoxy resin, a core-shell rubber particle, a polymer having a crosslinkable silicon group, an epoxy resin curing agent, and a condensation catalyst for the crosslinkable silicon group, wherein a cured product of the adhesive has a breaking strength (tensile strength at rupture) of 5 MPa or more and an elongation at break (elongation at rupture) of 30% or more, and has storage elastic moduli at 1 Hz in tensile mode of 100 to 1000 MPa at 20° C. and 50 to 1000 MPa at 80° C.

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

An ultra-high solids content primer coating composition comprising: (i) 5.0 to 50 wt % of at least one bisphenol F epoxy resin; (ii) 1.5 to 12 wt % of at least one silane; (iii) 0 to 20 wt % of at least one hydrocarbon resin; (iv) 0 to 15 wt % of at least one reactive diluent; (v) at least one curing agent; wherein said composition has a solids content of at least 90 wt % according to ASTM D5201-05; wherein said composition has a viscosity of 200 to 800 cps at 23° C. and 50% RH (ASTM D4287); and wherein the ratio between hydrogen equivalents in the curing agent and epoxy equivalents of the coating composition is in the range 50:100 to 120:100.

This application relates, in part, to novel salts represented by the following structure of Formula (1): ##STR00001##
wherein R.sup.1a is selected from the group consisting of hydrogen and optionally substituted alkyl (e.g., unsubstituted C.sub.1-6 alkyl, e.g., —CH.sub.3); R.sup.1b is optionally substituted alkyl (e.g., unsubstituted C.sub.1-6 alkyl, e.g., —CH.sub.3); each occurrence of R.sup.2 and R.sup.3 is independently selected from the group consisting of hydrogen, optionally substituted alkyl, optionally substituted cycloalkyl, and optionally substituted aryl; R.sup.2 and R.sup.3 can combine with each other to form optionally substituted cycloalkyl; each m and n is independently an integer ranging from 1 to 20 (e.g., m and n is independently an integer ranging from 1 to 5); and each of Q.sup.1.sup.⊖ and Q.sup.2.sup.⊖ is independently a counterion (e.g., each of Q.sup.1.sup.⊖ and Q.sup.2.sup.⊖ is independently a counterion selected from the group consisting of chloride, bromide, fluoride, iodide, acetate, carboxylate, hydrogen sulfate, nitrate, and phenolate, and sulfonate, e.g., chloride), and methods of making the same.