A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.

A preparation method of thermadapt shape memory polymers includes: (1) synthesis of pendant hydroxyl groups functionalized epoxy oligomer using epoxy resin and alcohol amine; (2) synthesis of alkoxyl groups terminated silane crosslinking agent by isocyanate silane coupling agent and diamine; (3) crosslinked shape memory polymers were prepared by condensation reaction of pendant hydroxyl groups functionalized epoxy oligomer and alkoxyl groups terminated silane crosslinking agent. The thermadapt shape memory polymers show high glass transition temperatures and high tensile strength. The original shape of thermadapt shape memory polymers can be reconfigured to a new permanent shape as needed, and thus effectively solving the bottleneck problems of reprocessing or reshape in the traditional crosslinked polymers once after molding. The thermadapt shape memory polymers are suitable for smart materials based on shape memory polymers with complex three-dimensional permanent shapes, and showing unfolding or folding behaviors along with convert to three-dimensional structures under heat stimulation.

The attenuation material composition disclosed in the present disclosure comprises a room temperature vulcanized silicone rubber, an epoxy resin, a first curing agent and a second curing agent, wherein the first curing agent comprises ethyl orthosilicate and dibutyltin oxide; and the weight ratio of the room temperature vulcanized silicone rubber to the epoxy resin is (0.1-1):1.

The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.

A silicone oil-treated fumed silica and a method of producing the silicone oil-treated fumed silica are provided. The silicone oil-treated fumed silica, which has the following physical properties: A) the silicone oil-treated fumed silica has a degree of hydrophobicity of 68 vol % or more; B) the silicone oil-treated fumed silica has a silicone oil fixation rate of from 60 mass % to 95 mass %; and C) a composition obtained by adding 6 parts by mass of the silicone oil-treated fumed silica to 100 parts by mass of an amine composition containing trimethylolpropane polyoxypropylene triamine and 1,3-bis(aminomethyl)cyclohexane at a mass ratio of 95:5 has a viscosity of 4,000 mPa.Math.s or more after the composition is left to stand at 25° C. for 1 hour.

A coating comprising epoxy functional resin, corrosion resistant particles, and a multi-functional crosslinker are disclosed as are methods of using such a coating to coat at least a portion of a substrate and a substrate coated thereby.

A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.

Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.

A curing agent or a curing accelerator which is easy to synthesize and may cure an epoxy resin and the like, or may accelerate the curing is provided. A curing agent or a curing accelerator according to some embodiments of the present invention has a highly-coordinated silicon structure.

A liquid epoxy resin composition for sealing includes an epoxy resin, a curing agent, and a particle having a core-shell structure. In the composition, the particle having a core-shell structure includes a core including a cross-linked polysiloxane and a shell including a polymer in which the content of a structural unit having an epoxy group is 10% by mass or more.