One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

Superhydrophobic electrothermal epoxy composites, their preparation and a self-healing method are disclosed. 1,4,5-oxadithiepane-2,7-dione and methylhexahydrophthalic anhydride were mixed and cured with epoxides to get self-healable epoxy resins; carbon nanotube/self-healable epoxy resin prepolymers were coated on self-healable epoxy resins and cured to get electrothermal epoxy composites; modified superhydrophobic copper powders were adhered on electrothermal epoxy composites and cured to get a kind of superhydrophobic electrothermal epoxy composites. The thermal resistance of superhydrophobic electrothermal epoxy composites is superior to existed technical solutions and they can simultaneously repair cracking and delamination and the healed samples still exhibit excellent superhydrophobicity. These merits of superhydrophobic electrothermal epoxy composites provided in this invention can meet the harsh requirements of self-healing and removing ice on surfaces of wind turbine blades, suggesting good abilities of guaranteeing service safety and lifespan of wind turbine blades.

The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.

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A curable composition includes a non-aromatic epoxy resin; a non-aromatic curing agent; and a colorant. The cured composition that is the reaction product of the curable composition exhibits a non-overlap shear value on etched aluminum of at least 30 MPa.

A silicone hybrid resin composition contains: (A) 100 parts by mass of a curable organic resin composition containing (A1) one or more curable organic resins selected from an epoxy resin, an acrylic resin, a polyimide resin, a maleimide resin, a polyurethane resin, a phenolic resin, a melamine resin, and silicone-modified resins thereof; and (B) 1 to 300 parts by mass of a curable silicone resin composition having a viscosity at 25° C. of 0.01 to 1,000 Pa.Math.s as measured by a method described in JIS K 7117-1:1999, where the component (B) is a dispersion in the component (A), and the component (A) is a curable organic resin composition that cures by a reaction mechanism that is different from a reaction mechanism of the component (B). The silicone hybrid resin composition can lower a storage modulus and is excellent in adhesiveness to a substrate while maintaining the Tg of an organic resin.

A resin composition for fiber-reinforced plastic having a good balance between stability and curability and capable of producing fiber-reinforced plastic with improved strength. The composition contains an epoxy resin, an acid anhydride, and a catalyst that is liquid at 25° C. The catalyst is at least one member selected from the group consisting of a compound composed of an acid and a base and a compound composed of a quaternary onium cation and an anion.

The present disclosure relates to rubber polymers of ethylene-glycidylmethacrylate-vinyl acetate polymer as modifiers in epoxy resins. In particular ethylene-glycidylmethacrylate-vinyl acetate rubber polymers comprising phthalic anhydride modified glycidyl methacrylate monomer units.

Provided are an epoxy resin composition that excels in solubility of a coloring agent and can impart a high insulating property without color unevenness in a cured product, and an ignition coil that exhibits an excellent property of impregnation of the epoxy resin composition into the coil and cracking resistance. The epoxy resin composition includes (A) an epoxy resin, (B) an acid anhydride, (C) an inorganic filler, and (D) a coloring agent. A difference between a solubility parameter (SP value) of a mixture of the epoxy resin (A) and the acid anhydride (B) and a solubility parameter (SP value) of the coloring agent (D) as measured by Fedors method is less than 3.1 [(cal/cm.sup.3).sup.1/2]. The SP value of the mixture of the epoxy resin (A) and the acid anhydride (B) is calculated from a weighted average of a solubility parameter (SP value) of the epoxy resin (A).

A curing agent composition and a curing agent coating formula thereof are provided. The curing agent composition includes 5 to 25 wt % of an ester group-containing amine end group adduct, 2 to 25 wt % of a C8-C22 hydrophobic saturated or unsaturated fatty amine, 2 to 25 wt % of a polyamine compound, 2 to 20 wt % of a silane compound, and 10 to 60 wt % of an ether solvent.

An object of the present invention is to provide a resin composition for encapsulation capable of suppressing warpage even when a large-area substrate is encapsulated. In order to solve the above problems, a resin composition for encapsulating an electronic member containing an epoxy resin (A), a compound having a polyalkylene glycol chain (B), and an inorganic filler (C) is provided. Thus, even when a large-area substrate is encapsulated, an effect of suppressing the warpage can be obtained.