This invention outlines a method for synthesizing a blended resin system in a one pot reaction that may utilize, for example, bio-based anhydrosugars such as isosorbide as a principle component to produce isosorbide dimethacrylate and other monomeric materials for thermosetting applications. This invention establishes a one-pot procedure for reacting a hydroxy group containing compound with methacrylic anhydride in the first step and using the by-product methacrylic acid to react with glycidyl ethers to form additional methacrylate compounds in the second step. This methodology can be formulated to produce a wide array of resin systems that have controlled ratios of hydroxy group containing compound/cross-linker/reactive diluent. Additionally, the novel resin systems may be partially to fully bio-based, promoting global sustainability and reducing costs, and when free radically polymerized have properties that meet or exceed their petroleum derived counterparts.

One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.

The disclosure describes an epoxy resin composition and a transformer including the same. The epoxy resin composition according to an embodiment of the present invention includes an epoxy resin having a glycol-based functional group in a main chain, a filler, a curing agent, and an imidazole-based catalyst, and the transformer according to an embodiment includes an insulated conductor wound in multiple layers in a vertical direction; a semi-conductive layer which is provided on the insulated conductor and disperses a concentrated electric field; and an insulator which is casted on the insulated conductor and the semi-conductive layer and forms an outer shape of the transformer, and the insulator consists of the epoxy resin composition including the epoxy resin having the glycol-based functional group in the main chain, the filler, the curing agent, and the imidazole-based catalyst.

The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.

This invention outlines a method for synthesizing a blended resin system in a one pot reaction that may utilize, for example, bio-based anhydrosugars such as isosorbide as a principle component to produce isosorbide dimethacrylate and other monomeric materials for thermosetting applications. This invention establishes a one-pot procedure for reacting a hydroxy group containing compound with methacrylic anhydride in the first step and using the by-product methacrylic acid to react with glycidyl ethers to form additional methacrylate compounds in the second step. This methodology can be formulated to produce a wide array of resin systems that have controlled ratios of hydroxy group containing compound/cross-linker/reactive diluent. Additionally, the novel resin systems may be partially to fully bio-based, promoting global sustainability and reducing costs, and when free radically polymerized have properties that meet or exceed their petroleum derived counterparts.

A composition containing: a compound represented by the following formula (D):

##STR00001##

wherein m is an integer of 0 to 6; p is 0 or 1; q is an integer of 0 to 6; Rf is a C1-C8 perfluoroalkyl group optionally containing oxygen with one fluorine atom being optionally replaced by a hydrogen atom, and a compound represented by the following formula (E):

##STR00002##

wherein n is an integer of 0 or greater; and M is a group represented by the following formula (E1):

##STR00003##

a group represented by the following formula (E2):

##STR00004##

or a group represented by the following formula (E3):

##STR00005##

wherein Z is hydrogen or a C1-C10 fluoroalkyl group.

Various embodiments include an impregnation formulation for a wrapping tape insulation of an electrical machine. The formulation comprises: a resin formulation with an epoxy base resin and a first component; and a hardener formulation with a hardener. The resin formulation reacts when combined with the hardener formulation to produce an insulation material. The first component includes a saturated and/or unsaturated epoxycycloalkyl group. A glass transition temperature of the insulation material is elevated compared to an impregnation formulation without the first component.

The invention relates to a composition comprising components a), b) and c), to a process for the preparation thereof, and to the use thereof. In one embodiment, a composition is provided which comprises the following components a), b) and c): a) from 75 to 99.5% by weight of a polymer based on epoxide compounds, from 0.5 to 25% by weight of at least one polyhydric alcohol, and optionally additives, b) from 80 to 99% by weight of a curing agent which is suitable for curing the polymer based on epoxide compounds, from 1 to 20% by weight of a polycaprolactone-polysiloxane block copolymer, optionally an accelerator, and optionally additives, and c) optionally an accelerator.

A curing agent composition comprising anhydride and approximately equimolar amount of tertiary amine or imidazole and carboxylic acid, the amine being 1-piperidinylethanol (N-hydroxyethyl-piperidine, NHEP) represented by the structure below or an imidazole represented by the structure below: ##STR00001##
where R.sub.1=H, a C1-C20 straight chain or branched alkyl, or a monocyclic aryl; R.sub.2=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The carboxylic acid is represented by RCOOH; R=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The composition comprises a lower ratio of epoxy resin to anhydride (1:0.4-0.6) than typically used (1:0.8-1.1). In addition, it uses a higher loading of the hindered latent tertiary amine or the imidazole in combination with the carboxylic acid (wt % ratio of combined amine and carboxylic acid to anhydride ˜10%). With this composition a full cure can be achieved in less than 2 hr at a significantly lower temperature (˜100° C.).

The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.