Provided are: an epoxy resin composition for fiber-reinforced composite materials, which has a good balance between storage stability and fast curing properties at high levels; a prepreg; and an epoxy resin composition which exhibits excellent mechanical characteristics as a fiber-reinforced composite material. A resin composition which contains an epoxy resin, dicyandiamide, an imidazole compound and an acidic compound, while satisfying the following conditions (a)-(c): (d) The time until the heat flow rate reaches the peak top after the epoxy resin composition reaches 100° C. is 25 minutes or less as measured by a differential scanning calorimeter at an isothermal temperature of 100° C. in a nitrogen gas stream. (e) The time until the heat flow rate reaches the peak top after the epoxy resin composition reaches 60° C. is 15 hours or more as measured by a differential scanning calorimeter at an isothermal temperature of 60° C. in a nitrogen gas stream. (f) The ratio of the number of epoxy groups to the number of imidazole rings in the epoxy resin composition is from 25 to 90 (inclusive).

Provided herein is a conductive coating material that can be spray coated to form a shielding layer having desirable shielding performance, and desirable adhesion to a package. A shielded package producing method using the conductive coating material is also provided. The conductive coating material comprises at least (A) 100 parts by mass of a binder component containing 5 to 30 parts by mass of a solid epoxy resin that is solid at ordinary temperature, and 20 to 90 parts by mass of a liquid epoxy resin that is liquid at ordinary temperature, (B) 200 to 1800 parts by mass of metallic particles, and (C) 0.3 to 40 parts by mass of a curing agent. The conductive coating material has a viscosity of 3 to 30 dPa.Math.s.

Provided herein is a conductive coating material that can be spray coated to form a shielding layer having desirable shielding performance, and desirable adhesion to a package. A shielded package producing method using the conductive coating material is also provided. The conductive coating material comprises at least (A) 100 parts by mass of a binder component containing 5 to 30 parts by mass of a solid epoxy resin that is solid at ordinary temperature, and 20 to 90 parts by mass of a liquid epoxy resin that is liquid at ordinary temperature, (B) 200 to 1800 parts by mass of metallic particles, and (C) 0.3 to 40 parts by mass of a curing agent. The conductive coating material has a viscosity of 3 to 30 dPa.Math.s.

The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.

The present invention provides a curable resin composition, a cured product of which has a small change in heat resistance after receiving a thermal history and a low thermal expansion property; a cured product of the curable resin composition; a printed circuit board having a small change in heat resistance; and an epoxy resin which imparts the characteristics described above. The epoxy resin is an epoxy resin which is obtained by polyglycidyl etherification of a reaction product formed from ortho-cresol, a β-naphthol compound, and formaldehyde and which includes as a necessary component, a dimer (x2, formula (1)), a trifunctional compound (x3, formula (2)), and a tetrafunctional compound (x4, formula (3)). The total content of those components is 65% or more in terms of the area rate in GPC measurement. ##STR00001##

The invention provides methods and polymer-containing formulations for treating retinal detachment and other ocular disorders, where the methods employ polymer compositions that can form a hydrogel in the eye of a subject. The hydrogel is formed by reaction of (a) a nucleo-functional polymer is a biocompatible polyalkylene polymer substituted by (i) a plurality of —OH groups, (ii) a plurality of thio-functional groups —R.sup.1—SH wherein R.sup.1 is an ester-containing linker, and (iii) optionally one or more —OC(O)—(C.sub.1-C.sub.6 alkyl) groups, such as a thiolated poly(vinyl alcohol) polymer and (ii) an electro-functional polymer that is a biocompatible polymer containing at least one thiol-reactive group, such as a poly(ethylene glycol) polymer containing alpha-beta unsaturated ester groups. Formulations are provided containing a nucleo-functional polymer, a poly(ethylene glycol) polymer, and an aqueous pharmaceutically acceptable carrier, for use in the therapeutic methods.

The present invention aims to provide an epoxy resin composition that is high in both fast curability and storage stability, a prepreg prepared by using the epoxy resin composition, and a fiber reinforced composite material prepared by curing the prepreg. The epoxy resin composition contains the following components [A], [B], [C], and [D] and meets the following requirements [a], [b], and [c]: [A]: epoxy resin, [B]: dicyandiamide, [C]: aromatic urea, [D]: borate ester, [a]: 0.014≤(content of component [D]/content of component [C])≤0.045, [b]: 0.9≤(number of moles of active groups in component [A]/number of moles of active hydrogen in component [B])≤1.2, and [c]: 14≤(content of component [A]/content of component [C])≤25.

The present invention aims to provide an epoxy resin composition that is high in both fast curability and storage stability, a prepreg prepared by using the epoxy resin composition, and a fiber reinforced composite material prepared by curing the prepreg. The epoxy resin composition contains the following components [A], [B], [C], and [D] and meets the following requirements [a], [b], and [c]: [A]: epoxy resin, [B]: dicyandiamide, [C]: aromatic urea, [D]: borate ester, [a]: 0.014≤(content of component [D]/content of component [C])≤0.045, [b]: 0.9≤(number of moles of active groups in component [A]/number of moles of active hydrogen in component [B])≤1.2, and [c]: 14≤(content of component [A]/content of component [C])≤25.

The invention provides an epoxy compound A represented by the following formula (1): ##STR00001## in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R.sub.1 and R.sub.2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R.sub.3 to R.sub.8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R.sub.3 to R.sub.8 is a glycidyl ether group or a 2-methylglycidyl ether group; R.sub.9 to R.sub.12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p.sub.1, p.sub.2, and q are average values of repetition, m is 0.5 to 10, p.sub.1 and p.sub.2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).

The invention provides an epoxy compound A represented by the following formula (1): ##STR00001## in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R.sub.1 and R.sub.2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R.sub.3 to R.sub.8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R.sub.3 to R.sub.8 is a glycidyl ether group or a 2-methylglycidyl ether group; R.sub.9 to R.sub.12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p.sub.1, p.sub.2, and q are average values of repetition, m is 0.5 to 10, p.sub.1 and p.sub.2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).