To provide a resin composition that is suitable for use as a matrix resin for a fiber-reinforced composite material, the resin composition exhibiting excellent impregnation properties into reinforcing fibers and rapid curing properties, giving a molded product having high heat resistance when cured, and exhibiting excellent productivity in a short time. A two-pack curable resin composition for a fiber-reinforced composite material, including a main agent that includes an epoxy resin (A) and an ester compound (B) represented by general formula (1) below, and a curing agent that includes an amine compound (C):

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(R.sub.1 and R.sub.2 each denote an alkyl group or an aryl group, and R.sub.1 and R.sub.2 may bond together to form a cyclic structure; or R.sub.1 may be an ester-containing group).

A thermosetting epoxy resin composition including, as curing agent, a dihydrazide selected from the group consisting of glutaric dihydrazide, adipic dihydrazide and pimelic dihydrazide, in combination with a specific urea accelerator, which features good storage stability and a low curing temperature. The epoxy resin composition is especially suitable for use as bodywork adhesive.

A thermosetting epoxy resin composition including, as curing agent, a dihydrazide selected from the group consisting of glutaric dihydrazide, adipic dihydrazide and pimelic dihydrazide, in combination with a specific urea accelerator, which features good storage stability and a low curing temperature. The epoxy resin composition is especially suitable for use as bodywork adhesive.

An epoxy resin composition useful for making a molded composite article including: (a) at least one epoxy resin compound, (b) at least one curing agent, (c) at least one curing accelerator, (d) at least one internal mold release agent; and (e) at least one reaction inhibitor; and a molded composite article made from the above epoxy resin composition.

An epoxy resin composition useful for making a molded composite article including: (a) at least one epoxy resin compound, (b) at least one curing agent, (c) at least one curing accelerator, (d) at least one internal mold release agent; and (e) at least one reaction inhibitor; and a molded composite article made from the above epoxy resin composition.

The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

A curable composition includes a polyamide composition that includes a first polyamide. The first polyamide includes a tertiary amide in the backbone thereof and is amine terminated. The curable composition further includes an amino functional compound comprising from 2 to 20 carbon atoms, a multifunctional (meth)acrylate, an epoxy resin, and an inorganic filler. The inorganic filler is present an amount of at least 25 wt. %, based on the total weight of the curable composition.

Provided is a curing agent for a water-based epoxy resin, which contains the following component (A) and component (B): (A); at least one selected from the group consisting of a polyamide amine-based curing agent (a1), a reaction product (a2) of a polyamine compound and a polyepoxy compound, and a Mannich reaction product (a3) of a polyamine compound, a phenol compound, and an aldehyde compound; (B): at least one selected from the group consisting of a reaction product (b1) of styrene and an amine compound represented by the following formula (1), and a reaction product (b2) of epichlorohydrin and an amine compound represented by the following formula (1);

H.sub.2NCH.sub.2-A-CH.sub.2NH.sub.2(1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

The present disclosure is directed to a two-component epoxy resin paint, comprising a) an epoxy resin component; and b) an amine component for curing the epoxy resin component, the amine component comprising: i) at least one polyamide curing agent; and ii) at least one Mannich base curing agent, wherein at least one of the polyamide curing agent and the Mannich base curing agent is derived from one or more multifunctional amines comprising at least one cycloaliphatic multifunctional amine, and wherein the cycloaliphatic multifunctional amine is present in an amount of 30 wt % or more relative to the total amount of the multifunctional amines, wherein the ratio by weight of the epoxy resin component a) to the amine component b) is in the range of 100:8 to 100:20.

The present disclosure is directed to a two-component epoxy resin paint, comprising a) an epoxy resin component; and b) an amine component for curing the epoxy resin component, the amine component comprising: i) at least one polyamide curing agent; and ii) at least one Mannich base curing agent, wherein at least one of the polyamide curing agent and the Mannich base curing agent is derived from one or more multifunctional amines comprising at least one cycloaliphatic multifunctional amine, and wherein the cycloaliphatic multifunctional amine is present in an amount of 30 wt % or more relative to the total amount of the multifunctional amines, wherein the ratio by weight of the epoxy resin component a) to the amine component b) is in the range of 100:8 to 100:20.