Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

A method of manufacturing an ink blocking layer for a display device, an ink blocking layer for a display device, and a display device are provided. The method of manufacturing an ink blocking layer for a display device includes: preparing a main material including an epoxy monomer having three or more epoxy groups and a curing agent including an acid and an amine; and mixing the main material with the curing agent to prepare an epoxy resin.

An adhesive composition comprising a first part comprising an epoxy resin and a second part comprising a multifunctional amine package. The multifunctional amine package comprises bis(hexamethylene)triamine and a synergist. The amine concentration is at least 10% less than the epoxy resin concentration and the adhesive composition demonstrates a sag resistance of greater than 40 mm.

The present disclosure relates to an epoxy resin of which distribution of molecular weight having distribution range of molecular weight of 300 to 2,000,000 is adjusted such that an upper limit value is increased to a maximum of 2,000,000, a method of preparing the same, a composition comprising the same, and a use thereof. The epoxy resin having controlled distribution of molecular weight of the present disclosure may have improved thermal properties of an epoxy system by expanding the distribution of molecular weight, and may exhibit excellent processability.

A curing agent for epoxy resins has N-benzylethane-1,2-diamine and N,N′-dibenzylethane-1,2-diamine in a weight ratio in the range from 65/35 to 95/5. The curing agent is easy to prepare, thins epoxy resins particularly well, and enables low-emission epoxy resin products that have good workability and a long pot-life, cure reliably and surprisingly fast and can be walked on after a short time, in particular even in cold conditions. Coatings of particularly high mechanical grade, with a high surface quality and a minimal tendency to yellowing, can thus be produced. Epoxy resins of this type are particularly suitable for coating floors.

A method includes using at least one salt (S) selected from the salts of nitric acid, salts of nitrous acid, salts of halogens or salts of trifluoromethanesulfonic acid as an accelerator in a multi-component epoxy resin compound for the chemical fastening of construction elements and/or anchoring means. Another method includes the chemical fastening of construction elements and anchoring elements, such as anchor rods, anchor bolts, rods, sleeves, reinforcing bars, screws and the like in boreholes in various substrates.

Implementations described herein relate to an etheramine mixture containing a cyclobutane based amine and its method of production by alkoxylating an initiator with an alkylene oxide to produce a precursor polyol and reductively aminating the precursor polyol to form the ehteramine mixture. The etheramine mixture may be used in a variety of applications including as a curing agent for an epoxy resin or as a reactant in the production of polyurea materials.

Embodiments disclosed relate to a composition and a method of treating a formation. The method includes introducing a loss circulation material system through a wellbore into a formation, where the loss circulation material system is comprised of an esterified derivative of an epoxidized organic material and a curing agent. The esterified derivative of an epoxidized organic material has a formula of: ##STR00001##
where R′ comprises H, a substituted or an unsubstituted (C1-C12) hydrocarbyl group; and where R″ comprises a substituted or an unsubstituted (C2-C30) hydrocarbyl group, including where at least one oxygen atom is attached to two different adjacent carbon atoms of the (C2-C30) hydrocarbyl group. The method also includes maintaining wellbore conditions such that the loss circulation material system cures into a loss circulation material in the formation. The cured loss circulation material may withstand a pressure differential up to about 20,000 psid.

A prepreg having at least one layer of carbon fibres and a curable thermosetting resin system, the curable thermosetting resin system at least partly impregnating the at least one layer of carbon fibres, wherein the curable thermosetting resin system includes: a curable thermosetting resin including at least one epoxide group, the curable thermosetting resin having an epoxy equivalent weight of from 140 to 180 g/eq; a curing agent for curing the curable thermosetting resin, wherein the curing agent is present in the liquid phase and includes a cyanamide reactive group; and a rheology modifier for the curable thermosetting resin system, wherein the rheology modifier includes at least one of a thermoplastic resin and an inorganic particulate thickener or a mixture thereof.

The present invention relates to curing agents for epoxy resins, containing at least one adduct of trimethylhexamethylenediamine and cresyl glycidyl ether. The curing agent has a low viscosity and cures quickly together with epoxy resins even in moist, cold conditions and without blushing to form films with a high hardness and surface quality, which scarcely undergo yellowing upon exposure to light. It is particularly suited for low-emission room temperature-curing coatings.