Provided are an encapsulating or filling composition for electronic devices and an electronic apparatus. The encapsulating or filling composition includes a curable material containing an epoxy group, a polymerization initiator, and a metal catalyst. The electronic apparatus includes a first substrate, an electronic device disposed on the first substrate, and one or more cured materials of the encapsulating or filling composition formed on the electronic device.

A hardener for epoxy resins, containing at least one amine A1 of formula (I) and at least one amine A2 of formula (II), the weight ratio of amine A1 to amine A2 ranging between 20/1 and 1/2. The hardener allows the manufacture of low-emission epoxy resin adhesives having good workability, a sufficiently long pot-life and open time with rapid curing, high strength, low brittleness, high adhesion, in particular to steel, and a sufficiently high glass transition temperature.

A hardener composition including: (a) a polymeric adduct; (b) a monomeric unmodified amine; and (c) an extender; a curable composition including (A) at least one epoxy compound; and (B) the above hardener composition; and a thermoset prepared from the above curable composition.

The present disclosure relates to coating compositions, kits, and methods of applying the same, for use with fireproofing materials. The coating compositions are effective to control the drying rate and shrinkage of fireproofing materials. The coating compositions are also able to be applied to fireproofing materials shortly after these materials have been applied to a substrate.

An epoxy composition that includes an epoxy-terminated prepolymer, an alkanolamine hardener having at least one hydroxyl group and an organometallic compound, where amine groups of the alkanolamine hardener react with epoxy groups of the epoxy-terminated prepolymer in a stoichiometric ratio to form a cured epoxy composition. The epoxy-terminated prepolymer is formed from a reaction product of an amine terminated polymeric polyol and a molar excess of epoxy groups in an epoxy monomer, relative to a molar amount of amine groups in the amine terminated polymeric polyol.

The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a curing agent that are placed at room temperature to 40-85° C. for reaction and curing. The curing agent contains an adduct of an olefinic nitrile compound and an amine compound. The present method for preparing an epoxy resin material has the characteristics of low mixing viscosity, long operation time, and low amount of heat released during preparation.

A method includes using at least one salt (S) selected from the salts of nitric acid, salts of nitrous acid, salts of halogens or salts of trifluoromethanesulfonic acid as an accelerator in a multi-component epoxy resin compound for the chemical fastening of construction elements and/or anchoring means. Another method includes the chemical fastening of construction elements and anchoring elements, such as anchor rods, anchor bolts, rods, sleeves, reinforcing bars, screws and the like in boreholes in various substrates.

A curable coating composition precursor comprising a first part (A) and a second part (B). The first part (A) comprises at least one first epoxy curing agent selected from aliphatic and cycloaliphatic amines and any combinations and mixtures thereof. The second part (B) comprises at least epoxy compound selected from bisphenol A and bisphenol F diglycidylether resins, and any combinations and mixtures thereof; at least one polyfunctional epoxy resin; at least one novolac epoxy resin; and optionally, at least one reactive diluent, Part (A) and/or part (B) comprise at least one inorganic phosphate compound.

A coated proppant having a proppant particle, an intermediate cross-linked terpolymer layer encapsulating the proppant particle, and an outer resin layer encapsulating the intermediate cross-linked terpolymer layer. The proppant particle is selected from sand, ceramic, glass, and combinations thereof. The intermediate cross-linked terpolymer layer includes styrene, methyl methacrylate, and divinyl benzene. The outer resin layer includes a cured epoxy resin formed from an epoxy resin and a curing agent.

A method for producing a coated proppant having an intermediate cross-linked terpolymer layer includes mixing a monomers solution including a first monomer, a second monomer that is different from the first monomer, a cross-linking agent, and an initiator. The proppant particle is combined with the monomers solution, and the monomer solution on the surface of the at least one proppant particle is polymerized to form at least one proppant particle having the intermediate cross-linked terpolymer layer on a surface of the at least one proppant particle. A resin solution including an epoxy resin, a curing agent, and graphene is mixed, and combined with the at least one proppant particle having the intermediate cross-linked terpolymer layer on a surface of the at least one proppant particle. The resin solution is cured to form the coated proppant comprising an intermediate cross-linked terpolymer layer.