The invention provides methods and polymer-containing formulations for treating retinal detachment and other ocular disorders, where the methods employ polymer compositions that can form a hydrogel in the eye of a subject. The hydrogel is formed by reaction of (a) a nucleo-functional polymer is a biocompatible polyalkylene polymer substituted by (i) a plurality of —OH groups, (ii) a plurality of thio-functional groups —R.sup.1—SH wherein R.sup.1 is an ester-containing linker, and (iii) optionally one or more —OC(O)—(C.sub.1-C.sub.6 alkyl) groups, such as a thiolated poly(vinyl alcohol) polymer and (ii) an electro-functional polymer that is a biocompatible polymer containing at least one thiol-reactive group, such as a poly(ethylene glycol) polymer containing alpha-beta unsaturated ester groups. Formulations are provided containing a nucleo-functional polymer, a poly(ethylene glycol) polymer, and an aqueous pharmaceutically acceptable carrier, for use in the therapeutic methods.

A two-component epoxy resin composition includes a first component K1 including at least one epoxy resin A that contains on average more than one epoxy group per molecule; and a second component K2 including a hardener B for epoxy resins; wherein the two-component epoxy resin composition contains between 2 and 35 wt.-%, based on the total weight of the composition, of at least one impact modifier I in either one or both of components K1 and K2; wherein the impact modifier I is a reaction product of at least one polymeric diol, at least one polyisocyanate, and cardanol. The two-component epoxy resin composition exhibits excellent toughness and impact peel strength

This invention relates to a hardener composition for an epoxy resin based two-pack coating formulation wherein the hardener composition comprises moieties having at least one structural element of formula >N-D1-NH2, and moieties having at least one structural element of formula >N-D2-NH—C(O)-Q, wherein D1 is a bivalent group, D2 is a bivalent group, and Q is a univalent group, to epoxy resin based two-pack coating formulations comprising at least one epoxy resin which is a polymer containing, on average, at least two epoxide groups per molecule, and the hardener composition, and at least one of diglycerides which are esters of glycerol with two molecules of fatty acid, monoglycerides which are esters of glycerol with one molecule of fatty acid, or glycerol, or the reaction products of at least one of diglycerides or monoglycerides or glycerol with organic compounds having at least one reactive group selected from the group consisting of acylesters, acylanhydrides, isocyanates, epoxides, cyclocarbonates, and aziridines, and to the use of these epoxy resin based two-pack coating formulations as protective coatings on metallic and mineral substrates.

This invention relates to a hardener composition for an epoxy resin based two-pack coating formulation wherein the hardener composition comprises moieties having at least one structural element of formula >N-D1-NH2, and moieties having at least one structural element of formula >N-D2-NH—C(O)-Q, wherein D1 is a bivalent group, D2 is a bivalent group, and Q is a univalent group, to epoxy resin based two-pack coating formulations comprising at least one epoxy resin which is a polymer containing, on average, at least two epoxide groups per molecule, and the hardener composition, and at least one of diglycerides which are esters of glycerol with two molecules of fatty acid, monoglycerides which are esters of glycerol with one molecule of fatty acid, or glycerol, or the reaction products of at least one of diglycerides or monoglycerides or glycerol with organic compounds having at least one reactive group selected from the group consisting of acylesters, acylanhydrides, isocyanates, epoxides, cyclocarbonates, and aziridines, and to the use of these epoxy resin based two-pack coating formulations as protective coatings on metallic and mineral substrates.

The present disclosure provides a method for bonding parts, comprising the following steps (a) Providing a two-component adhesive composition precursor, comprising a first part (A) comprising at least one epoxy curing agent and preferably at least one first dye; a second part (B) comprising at least one second dye different from the at least one first dye and at least one epoxy resin; (b) Mixing part (A) and part (B) of the two-component adhesive composition precursor so as to obtain an adhesive composition; (c) Applying the adhesive composition onto a first part; (d) Applying a second part onto the adhesive composition applied to the first part; and then performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change; or (e) Performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change, and then applying a second part onto the adhesive composition applied to the first part; (f) Perform a second curing step at a second temperature higher than the first temperature, thereby fully curing the adhesive composition so as to obtain a structural adhesive bond between the first and second parts, wherein the adhesive composition undergoes a second colour change.

The present disclosure provides a method for bonding parts, comprising the following steps (a) Providing a two-component adhesive composition precursor, comprising a first part (A) comprising at least one epoxy curing agent and preferably at least one first dye; a second part (B) comprising at least one second dye different from the at least one first dye and at least one epoxy resin; (b) Mixing part (A) and part (B) of the two-component adhesive composition precursor so as to obtain an adhesive composition; (c) Applying the adhesive composition onto a first part; (d) Applying a second part onto the adhesive composition applied to the first part; and then performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change; or (e) Performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change, and then applying a second part onto the adhesive composition applied to the first part; (f) Perform a second curing step at a second temperature higher than the first temperature, thereby fully curing the adhesive composition so as to obtain a structural adhesive bond between the first and second parts, wherein the adhesive composition undergoes a second colour change.

The invention relates to a method of making parts of construction materials by using a mold coated with multiple resin-based layers comprising at least an epoxy resin-based primer and a polyurethane resin-based demolding layer, wherein the mold can be used for multiple cycles after curing and demolding. The invention also relates to the resin-coated mold and the cured parts of construction materials having smooth surface made thereof.

The present disclosure provides a curable casting resin precursor, comprising (a) a first part (A) comprising: (a1) at least one epoxy resin; (b) a second part (B) comprising: (b1) at least one first amine-based epoxy curing agent; (b2) optionally, at least one second amine-based epoxy curing agent; (b3) at least one mineral filler; (b4) at least one phenolic lipid; wherein part (A) and/or part (B) comprise at least one triphenylmethane dye. The curable casting resin precursor is suited for encapsulating metal parts such as cable joints and the like.

The present disclosure provides a method for bonding parts, comprising the following steps (a) Providing a two-component adhesive composition precursor, comprising a first part (A) comprising at least one epoxy curing agent and preferably at least one first dye; a second part (B) comprising at least one second dye different from the at least one first dye and at least one epoxy resin; (b) Mixing part (A) and part (B) of the two-component adhesive composition precursor so as to obtain an adhesive composition; (c) Applying the adhesive composition onto a first part; (d) Applying a second part onto the adhesive composition applied to the first part; and then performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change; or (e) Performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change, and then applying a second part onto the adhesive composition applied to the first part; (f) Perform a second curing step at a second temperature higher than the first temperature, thereby fully curing the adhesive composition so as to obtain a structural adhesive bond between the first and second parts, wherein the adhesive composition undergoes a second colour change.

The present disclosure provides a method for bonding parts, comprising the following steps (a) Providing a two-component adhesive composition precursor, comprising a first part (A) comprising at least one epoxy curing agent and preferably at least one first dye; a second part (B) comprising at least one second dye different from the at least one first dye and at least one epoxy resin; (b) Mixing part (A) and part (B) of the two-component adhesive composition precursor so as to obtain an adhesive composition; (c) Applying the adhesive composition onto a first part; (d) Applying a second part onto the adhesive composition applied to the first part; and then performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change; or (e) Performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change, and then applying a second part onto the adhesive composition applied to the first part; (f) Perform a second curing step at a second temperature higher than the first temperature, thereby fully curing the adhesive composition so as to obtain a structural adhesive bond between the first and second parts, wherein the adhesive composition undergoes a second colour change.