Patent classifications
C08G65/24
Polyoxyalkylenes with pendant long-chain acyloxy groups and method for producing same using DMC catalysts
The invention relates to polyoxyalkylenes having pendant long-chain acyloxy radicals and to a process for preparation thereof by an alkoxylation reaction using double metal cyanide (DMC) catalysts.
ELECTROSTATIC DISSIPATING MAT
An electrostatic mat, wherein the mat comprises at least one electrostatic layer, wherein the at least one layer comprises an elastomeric rubber, wherein the elastomeric rubber comprises 20-100 phr elastomeric polyether, wherein the elastomeric polyether comprises 10-75 wt % ethylene oxide, 20-70 wt % epihalohydrin, and 0-10% vinyloxirane. The mat prevents the generation of voltage when it is walked on and/or dissipates the charge that was generated.
Electronic component having movable contact
An electronic component comprising: a case; a switching mechanism incorporated within the case; an actuator configured to actuate the switching mechanism, the actuator being mounted in the case so as to be displaceable by sliding; and a rubber cap configured to seal a sliding part of the actuator, wherein the rubber cap is made of a hydrin-based rubber.
Electronic component having movable contact
An electronic component comprising: a case; a switching mechanism incorporated within the case; an actuator configured to actuate the switching mechanism, the actuator being mounted in the case so as to be displaceable by sliding; and a rubber cap configured to seal a sliding part of the actuator, wherein the rubber cap is made of a hydrin-based rubber.
Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics
An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P:
##STR00001##
Copper Deposition in Wafer Level Packaging of Integrated Circuits
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin). The electrodeposition composition can be used in a process for forming a copper feature over a semiconductor substrate in wafer level packaging to electrodeposit a copper bump or pillar on an underbump structure of a semiconductor assembly.
Copper Deposition in Wafer Level Packaging of Integrated Circuits
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin). The electrodeposition composition can be used in a process for forming a copper feature over a semiconductor substrate in wafer level packaging to electrodeposit a copper bump or pillar on an underbump structure of a semiconductor assembly.
POLYMER, OXYGEN ABSORBER USING SAME, AND CURABLE COMPOSITION
A polymer represented by the following general formula (I):
##STR00001##
wherein X.sup.1, X.sup.2, and X.sup.3 each represent a chalcogen atom, R.sup.1 and R.sup.2 each independently represent any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, and an aralkyl group, R.sup.3 and R.sup.4 each independently represent any one selected from the group consisting of an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, and an aralkyl group, R.sup.5 and R.sup.6 each independently represent any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, and an aralkyl group, R.sup.7 represents a hydrogen atom or a methyl group, R.sup.8 represents any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, and an aralkyl group, n is any integer, and none of R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are bonded to each other to form a ring structure.
POLYETHER COMPOUND AND GAS SEPARATION MEMBRANE
A polyether compound having a cationic group and two or more chain end groups and, wherein all of the chain end groups are any of a hydroxyl group and an azide group is provided.
POLYETHER COMPOUND AND GAS SEPARATION MEMBRANE
A polyether compound having a cationic group and two or more chain end groups and, wherein all of the chain end groups are any of a hydroxyl group and an azide group is provided.