C08G65/24

Polyoxyalkylenes with pendant long-chain acyloxy groups and method for producing same using DMC catalysts
09783635 · 2017-10-10 · ·

The invention relates to polyoxyalkylenes having pendant long-chain acyloxy radicals and to a process for preparation thereof by an alkoxylation reaction using double metal cyanide (DMC) catalysts.

ELECTROSTATIC DISSIPATING MAT
20170283577 · 2017-10-05 ·

An electrostatic mat, wherein the mat comprises at least one electrostatic layer, wherein the at least one layer comprises an elastomeric rubber, wherein the elastomeric rubber comprises 20-100 phr elastomeric polyether, wherein the elastomeric polyether comprises 10-75 wt % ethylene oxide, 20-70 wt % epihalohydrin, and 0-10% vinyloxirane. The mat prevents the generation of voltage when it is walked on and/or dissipates the charge that was generated.

Electronic component having movable contact
09741504 · 2017-08-22 · ·

An electronic component comprising: a case; a switching mechanism incorporated within the case; an actuator configured to actuate the switching mechanism, the actuator being mounted in the case so as to be displaceable by sliding; and a rubber cap configured to seal a sliding part of the actuator, wherein the rubber cap is made of a hydrin-based rubber.

Electronic component having movable contact
09741504 · 2017-08-22 · ·

An electronic component comprising: a case; a switching mechanism incorporated within the case; an actuator configured to actuate the switching mechanism, the actuator being mounted in the case so as to be displaceable by sliding; and a rubber cap configured to seal a sliding part of the actuator, wherein the rubber cap is made of a hydrin-based rubber.

Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics

An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P:

##STR00001##

Copper Deposition in Wafer Level Packaging of Integrated Circuits

An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin). The electrodeposition composition can be used in a process for forming a copper feature over a semiconductor substrate in wafer level packaging to electrodeposit a copper bump or pillar on an underbump structure of a semiconductor assembly.

Copper Deposition in Wafer Level Packaging of Integrated Circuits

An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin). The electrodeposition composition can be used in a process for forming a copper feature over a semiconductor substrate in wafer level packaging to electrodeposit a copper bump or pillar on an underbump structure of a semiconductor assembly.

POLYMER, OXYGEN ABSORBER USING SAME, AND CURABLE COMPOSITION

A polymer represented by the following general formula (I):

##STR00001##

wherein X.sup.1, X.sup.2, and X.sup.3 each represent a chalcogen atom, R.sup.1 and R.sup.2 each independently represent any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, and an aralkyl group, R.sup.3 and R.sup.4 each independently represent any one selected from the group consisting of an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, and an aralkyl group, R.sup.5 and R.sup.6 each independently represent any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, and an aralkyl group, R.sup.7 represents a hydrogen atom or a methyl group, R.sup.8 represents any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, and an aralkyl group, n is any integer, and none of R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are bonded to each other to form a ring structure.

POLYETHER COMPOUND AND GAS SEPARATION MEMBRANE
20210355275 · 2021-11-18 · ·

A polyether compound having a cationic group and two or more chain end groups and, wherein all of the chain end groups are any of a hydroxyl group and an azide group is provided.

POLYETHER COMPOUND AND GAS SEPARATION MEMBRANE
20210355275 · 2021-11-18 · ·

A polyether compound having a cationic group and two or more chain end groups and, wherein all of the chain end groups are any of a hydroxyl group and an azide group is provided.