Polymeric materials for use in challenging situations in the oil and gas industry (e.g. challenging physical and chemical environments) are described. The polymeric materials comprise a polymeric material having a repeat unit of formula I and a repeat unit of formula II wherein Ph represents a phenylene moiety; wherein the repeat units I and II are in the relative molar proportions 95:5 to 80:20.

A composition [composition (C)] comprising from 1 to 90% by weight (wt. %) of at least one poly(aryl ether ketone) [(PAEK) polymer, herein after], from to 25 wt. % of at least one polyphenylsulfone polymer [(PPSU) polymer, herein after], from 1 to 90% wt. % of at least one poly(aryl ether sulfone) polymer [(P1) polymer, herein after], selected from a group consisting of at least one high temperature poly(aryl ether sulfone) polymer [(PAES.sub.HT) polymer, herein after] and at least one polyethersulfone polymer [(PESU) polymer, herein after]; from 0 to 50% wt. % of at least one reinforcing filler, and wherein all % are based on the total weight of the composition (C).

A method for producing a semiconductor device, which includes forming an underlayer film on a semiconductor substrate with a resist underlayer film forming composition that contains a solvent, and a polymer containing a unit structure of Formula (2):
O—Ar.sub.2—O—Ar.sub.3-T-Ar.sub.4  Formula (2)
where Ar.sub.2, Ar.sub.3, and Ar.sub.4 are individually a C.sub.6-50 arylene group or an organic group containing a heterocyclic group; at least one of Ar.sub.3 and Ar.sub.4 is a phenylene group; and T is a carbonyl group. The resist underlayer film forming composition has a solid content of 0.1 to 70 mass % of a total mass of the composition.

A polyarylene ether comprising in polymerized form A) at least one tri- or higher functional compound and B) isosorbide, isomannide, isoidide or a mixture thereof, wherein the polyarylene ether is a polyarylene ether sulfone or a polyarylene ether ketone, a process for its preparation and its use in the preparation of a coating, film, fiber, foam, membrane or molded article.

A mobile electronic device comprising at least one part made of a polymer composition [composition (C), herein after] comprising at least one part made of a polymer composition [composition (C), herein after] comprising from at least one polyaryletherketone polymer [(PAEK) polymer], and at least one nitride (NI) of an element having an electronegativity (∈) of from 1.3 to 2.5, as defined in <<Handbook of Chemistry and Physics>>, CRC Press, 64.sup.th edition, pages B-65 to B-158, based on the total weight of the composition (C).

A PEEK-PEoDEK copolymer having RPEEK and RPEoDEK repeat units in a molar ratio RPEEK/RPEoDEK ranging from 95/5 to 70/30, a method of making the PEEK-PEoDEK copolymer and the polymer composition including the PEEK-PEoDEK copolymer, at least one reinforcing filler, at least one additive, or a combination thereof, shaped articles including the polymer composition, polymer-metal junctions including the polymer composition. Also described are methods of making the polymer composition, methods of making the shaped articles, and methods of making the polymer-metal junctions.

A blend comprising: (i) a polymeric material (A) having a repeat unit of formula

—O—Ph—O—Ph—CO—Ph—  I

and a repeat unit of formula

—O—Ph—Ph—O—Ph—CO—Ph—  II

wherein Ph represents a phenylene moiety; and (ii) a polymeric material (B) having a repeat unit of formula (XX)

##STR00001##

wherein t1 and w1 independently represent 0 or 1 and v1 represents 0, 1 or 2.

The present disclosure relates to method of making three-dimensional (3D) objects using an additive manufacturing system wherein the part material comprises a polymeric component comprising at least one poly(ether ether ketone) polymer (PEEK) having a weight average molecular weight (Mw) ranging from 75,000 to 100,000 g/mol (as determined by GPC), for example in the form of filaments or spherical particles, for use in additive manufacturing systems to print 3D objects.

A process for manufacturing a three-dimensional object from a powder by selective sintering the powder using electromagnetic radiation. The powder includes recycled PAEK. In one embodiment, the powder includes recycled PEKK. In one embodiment, the powder includes first recycle PEKK and second recycle PEKK. In one embodiment, the powder consists essentially of recycled PEKK. The process may include the step of maintaining a bed of a selective laser sintering machine at approximately 300 degrees Celsius and applying a layer of the powder to the bed. The average in-plane tensile strength of the three-dimensional object is greater than that of a three-dimension object manufactured by selective sintering using a powder including an unused PEKK powder.

The presence of certain impurities in diphenyl sulfone have a deleterious effect on the properties of the poly(aryletherketone)s produced therein, including one or more of color, melt stability, molecular weight, crystallinity, etc. and here identify those impurities and provide processes for the recovery of the diphenyl sulfone.