A polyamideimide resin having isocyanate groups at the terminals, wherein at least a portion of the isocyanate groups are blocked with an ether group-containing cyclic amine.

The present invention relates to a polyamideimide composition that is highly suitable for use as primary insulation for wires. The composition comprises from 55 to 65 pbw of N-n-butyl pyrollidone, from 25 to 40 pbw of polyamideimide resin, from 0 to 20 pbw of other components, wherein the polyamideimide resin has a Mw of between 10000 to 40000 g/mol (Dalton) and a Mw/Mn ratio between 1,1 and 2.

A method for manufacturing a patterned polyimide aerogel film on a substrate includes: dispensing a polyimide prepolymer sol onto a first portion of a surface of a substrate, a second portion of the surface of the substrate being substantially free of the polyimide prepolymer sol; forming a patterned film of a polyimide prepolymer gel on the substrate from the polyimide prepolymer sol; drying the polyimide prepolymer gel to form a patterned film of a polyimide prepolymer aerogel on the substrate; and curing the polyimide prepolymer aerogel on the substrate to form the patterned polyimide aerogel film on the first portion of the surface of the substrate, the second portion of the surface of the substrate being substantially free of the patterned polyimide aerogel film.

A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.

Provided is a film touch sensor comprising a separation layer; a protective layer formed on the separation layer; an electrode pattern layer formed on the protective layer; and an insulation layer formed on the electrode pattern layer, wherein the protective layer is a cured layer of a protective layer forming composition comprising a cyclic olefin polymer having a protonic polar group and a curing agent comprising a polyamide-imide resin in a specific mixing ratio. The film touch sensor has improved mechanical properties of the protective layer, so that the occurrence of cracks can be suppressed during a manufacturing process or transfer.

Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.

There is provided a partial discharge-resistant paint that is excellent in the dispersibility of alumina particles, has an industrially suitable viscosity, and can form a coating that is excellent in partial discharge resistance and insulating properties. A partial discharge-resistant paint comprising at least one heat-resistant resin selected from the group consisting of a polyamide resin, a polyimide resin, a polyimide resin precursor, a polyamide-imide resin, a polyetherimide resin, and a polyester-imide resin; alumina particles having an aspect ratio of 2 to 99, and represented by the formula: Al.sub.2O.sub.3.nH.sub.2O; at least one selected from the group consisting of an organophosphorous compound, a sulfonic acid compound, an amic acid compound, a triazole compound, a compound represented by formula (A) below, a compound represented by formula (B) below, a compound represented by formula (C) below, citric acid, ethylenediaminetetraacetic acid, and an ethylenediaminetetraacetic acid derivative; and a solvent, wherein the solvent comprises 90% by mass or more of a solvent having a boiling point of 100° C. or more at a pressure of 1 atm, the alumina particle content is 10 to 30% by mass relative to a total of 100% by mass of the heat-resistant resin and the alumina particles, and a total content of the heat-resistant resin and the alumina particles is 10 to 30% by mass.

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A method for manufacturing a patterned polyimide aerogel film on a substrate includes: dispensing a polyimide prepolymer sol onto a first portion of a surface of a substrate, a second portion of the surface of the substrate being substantially free of the polyimide prepolymer sol; forming a patterned film of a polyimide prepolymer gel on the substrate from the polyimide prepolymer sol; drying the polyimide prepolymer gel to form a patterned film of a polyimide prepolymer aerogel on the substrate; and curing the polyimide prepolymer aerogel on the substrate to form the patterned polyimide aerogel film on the first portion of the surface of the substrate, the second portion of the surface of the substrate being substantially free of the patterned polyimide aerogel film.

The present invention provides a production method of an organic compound, in which a reaction is performed between functional groups without using any solvents. The present invention relates to a production method of an organic compound, in which a reaction is performed between functional groups by using a mechanochemical effect.

To provide: a solvent used for synthesizing a synthetic resin such as a polyimide resin and a polyurethane resin, the solvent capable of synthesizing a polymer having a high molecular weight in a short time, causing no clouding of a reaction solution during and after reaction, and having high transparency and storage stability; and a method for producing the synthetic resin using the solvent. A solvent (C) for resin synthesis, containing: 10 to 99.9999 mass % of an amide-based solvent (A); and 0.0001 to 5 mass % of a reaction accelerator (B), in which the reaction accelerator (B) is an aliphatic or aromatic tertiary amine compound having one or more tertiary amino groups in a molecule of the reaction accelerator (B).