Patent classifications
C08G73/1035
Preparation of poly amidoimides
A liquid composition comprising (a) a solvent or solvent mixture containing at least 50% by weight, based on the total amount of solvents, of a dioxabicycloalkane derivative, (b) an aromatic tricarboxylic acid anhydride, and (c) an aromatic diisocyanate,
can be used as coating composition for metal surfaces.
POLY(AMIDE-IMIDE) COPOLYMER, METHOD OF MANUFACTURING THE SAME, POLY(AMIDE-IMIDE) COPOLYMER FILM, WINDOW FOR DISPLAY DEVICE, AND DISPLAY DEVICE
A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.
TRANSFER BELT, TRANSFER UNIT, AND IMAGE FORMING APPARATUS
A transfer belt includes a resin base material layer and a surface layer, wherein the surface layer contains a polyamide-imide resin A, a siloxane-modified imide resin B, and a conductive material.
Water-based electrodeposition dispersion for forming insulating film
A water-based electrodeposition dispersion for forming an insulating film contains polymer particles, an organic solvent, a basic compound, and water, the polymer particles are made of polyamide-imide, and the basic compound is a nitrogen-containing compound in which the HSP distance from water is 35 or greater.
Rocket booster casings made with semipreg having a thermoplastic toughened novolac-based epoxy resin matrix
A semipreg that can be cured/molded to form aerospace composite parts including rocket booster casings. The semipreg includes a fibrous layer and a resin layer located on one side of the fibrous layer. The resin layer includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.
Poly(amide-imide) resin composition and fluorochemical coating material
A polyamideimide resin composition containing: (A) a polyamideimide resin which has isocyanate groups at the terminals and in which at least a portion of the isocyanate groups are blocked with a blocking agent selected from the group consisting of alcohols, oximes and lactams, (B) N-formylmorpholine, and (C) water.
POROUS NANOSTRUCTURED POLYIMIDE NETWORKS AND METHODS OF MANUFACTURE
Porous three-dimensional networks of polyimide and porous three-dimensional networks of carbon and methods of their manufacture are described. For example, polyimide aerogels are prepared by mixing a dianhydride and a diisocyanate in a solvent comprising a pyrrolidone and acetonitrile at room temperature to form a sol-gel material and supercritically drying the sol-gel material to form the polyimide aerogel. Porous three-dimensional polyimide networks, such as polyimide aerogels, may also exhibit a fibrous morphology. Having a porous three-dimensional polyimide network undergo an additional step of pyrolysis may result in the three dimensional network being converted to a purely carbon skeleton, yielding a porous three-dimensional carbon network. The carbon network, having been derived from a fibrous polyimide network, may also exhibit a fibrous morphology.
POLYAMIDEIMIDE RESIN COMPOSITION AND FLOURINE-BASED COATING MATERIAL
Disclosed are a polyamideimide resin composition comprising (A) a polyamideimide resin, (B) a 3-alkoxy-N,N-dimethylpropanamide, and (C) water; and a fluorine-based coating material comprising the polyamideimide resin composition and a fluororesin.
PREPARATION OF POLYAMIDOIMIDES
A liquid composition comprising (a) a solvent or solvent mixture containing at least 50% by weight, based on the total amount of solvents, of a dioxabicycloalkane derivative, (b) an aromatic tricarboxylic acid anhydride, and (c) an aromatic diisocyanate,
can be used as coating composition for metal surfaces.
Preparation method for thermoplastic multi-hybrid polyimide films
A preparation method for thermoplastic multi-hybrid polyimide films is provided. The method includes the following steps: S1, adding an aromatic diisocyanate to an aromatic dianhydride solution system to obtain an anhydride-terminated polyimide precursor solution containing a seven-membered ring structure named a first solution; S2, adding an aromatic dianhydride to an aromatic diamine solution system to obtain an amino-terminated polyamic acid solution named a second solution; S3, mixing the first solution and the second solution to obtain a uniform multi-polymerization solution; S4, after extending the multi-polymerization solution to form a film, carrying out a gradient heating curing in a vacuum oven and an ordinary oven respectively to obtain a thermoplastic multi-hybrid polyimide film after cooling. The invention prepares a thermoplastic multi-hybrid polyimide film with better comprehensive performance rapidly, the preparation process is simple, and the production cost is effectively reduced.