A polyamideimide resin having an isocyanate group blocked with a compound selected from the group consisting of alcohols, oximes and lactams, and having a carboxyl group blocked with a vinyl ether group-containing compound.

A problem to be solved by the present invention is to provide a resin composition suitable for spinning, particularly electrospinning, and in addition, to provide a heat-resistant non-woven fabric having excellent strength and a method of producing the same. A main object of the present invention is: to provide a resin composition including: (a) at least one heat-resistant resin or a precursor thereof, the heat-resistant resin being selected from the group consisting of a heat-resistant resin containing a nitrogen atom and a heat-resistant resin containing, in the main chain, a group selected from the group consisting of ether group, ketone group, sulfone group, and sulfide group; (b) a solvent; and (c) a surfactant having a fluoroalkyl group; and to form a non-woven fabric using the resin composition by an electrospinning method.

A semipreg that can be cured/molded to form aerospace composite parts including rocket booster casings. The semipreg includes a fibrous layer and a resin layer located on one side of the fibrous layer. The resin layer includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.

The present invention relates to an aqueous composition comprising: ?Water; ?A reaction product obtained by reacting ?a polyamideimide polymer obtainable by reacting suitable starting materials in N-n-butyl pyrrolidone at a temperature in the range from 80-120? C. until a polymer is formed with an Mw of between 10000 to 40000 g/mol (Dalton) and a Mw/Mn ratio between 1.1 and 2, with ?an amine compound; ?Optionally an amine compound, and ?N-n-butylpyrrolidone. and the use thereof in coating compositions.

Porous three-dimensional networks of polyimide and porous three-dimensional networks of carbon and methods of their manufacture are described. For example, polyimide aerogels are prepared by mixing a dianhydride and a diisocyanate in a solvent comprising a pyrrolidone and acetonitrile at room temperature to form a sol-gel material and supercritically drying the sol-gel material to form the polyimide aerogel. Porous three-dimensional polyimide networks, such as polyimide aerogels, may also exhibit a fibrous morphology. Having a porous three-dimensional polyimide network undergo an additional step of pyrolysis may result in the three dimensional network being converted to a purely carbon skeleton, yielding a porous three-dimensional carbon network. The carbon network, having been derived from a fibrous polyimide network, may also exhibit a fibrous morphology.

This invention provides a preparation method of solid self-lubricating material with high temperature resistance, including steps described as follows: first, mixing polymer matrix resin and nano lubricating filler to compose a uniform raw material powders; then, placing the raw material powders in the cavity of hot-press die; keeping the temperature for 90-120 min at the first prepressing temperature, controlling the hot-pressing pressure under the third pre-loading pressure, and gradually increasing the temperature to the solid-phase molding temperature of the material; gradually reducing the temperature to the first preloading temperature after the solid-phase molding is completed; next, removing the pressure, finally, obtaining the solid self-lubricating material by naturally cooling to normal temperature and demoulding. This invention adjusts the hot-pressing molding temperature according to the drift value of glass transition temperature, in order to avoid the degradation of tribological properties and mechanical properties caused by uneven plasticization and overheating of composite materials during the compression molding process.

A thermally conductive resin is provided. The thermally conductive resin has the formula ##STR00001##
In the formula, X.sub.1 is ##STR00002##
X.sub.2 is ##STR00003##
m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

Porous three-dimensional networks of polyimide and porous three-dimensional networks of carbon and methods of their manufacture are described. For example, polyimide aerogels are prepared by mixing a dianhydride and a diisocyanate in a solvent comprising a pyrrolidone and acetonitrile at room temperature to form a sol-gel material and supercritically drying the sol-gel material to form the polyimide aerogel. Porous three-dimensional polyimide networks, such as polyimide aerogels, may also exhibit a fibrous morphology. Having a porous three-dimensional polyimide network undergo an additional step of pyrolysis may result in the three dimensional network being converted to a purely carbon skeleton, yielding a porous three-dimensional carbon network. The carbon network, having been derived from a fibrous polyimide network, may also exhibit a fibrous morphology.

The present invention relates to an aqueous composition comprising: ?Water; ?A reaction product obtained by reacting ?a polyamideimide polymer obtainable by reacting suitable starting materials in N-n-butyl pyrrolidone at a temperature in the range from 80-120? C. until a polymer is formed with an Mw of between 10000 to 40000 g/mol (Dalton) and a Mw/Mn ratio between 1.1 and 2, with ?an amine compound; ?Optionally an amine compound, and ?N-n-butylpyrrolidone. and the use thereof in coating compositions.

A resin composition is provided having a high permittivity and a low dissipation factor, and having excellent moisture absorption and heat resistance, a high glass transition temperature, a low coefficient of thermal expansion, and good coatability and appearance, and used for producing an insulation layer of a printed wiring board; and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board. The resin composition contains: (A) a cyanate ester compound, (B) a maleimide compound, and (C) a surface-coated titanium oxide, wherein a content of the cyanate ester compound (A) is 1 to 65 parts by mass, based on 100 parts by mass of a total resin solid content in the resin composition, and a content of the maleimide compound (B) is 15 to 85 parts by mass, based on 100 parts by mass of a total resin solid content in the resin composition.